Search Patents
  • OPTICS FORMATION USING PICK-UP TOOLS
    Publication number: 20200035882
    Abstract: Techniques related to optics formation using pick-up tools are disclosed. Optical elements are formed by pressing a pick-up tool (PUT) against elastomeric material deposited on a light-outputting side of light-emitting diode (LED) devices. Pressing the PUT against the elastomeric material causes a molded shape of the PUT to be transferred to the elastomeric material. This forms the optical elements in the elastomeric material.
    Type: Application
    Filed: July 30, 2018
    Publication date: January 30, 2020
    Inventors: Daniel Brodoceanu, Patrick Joseph Hughes, Pooya Saketi, Oscar Torrents Abad
  • Microlens arrays for parallel micropatterning
    Patent number: 11344971
    Abstract: Disclosed herein are systems and methods for using microlens arrays for parallel micropatterning of features. A method includes emitting a laser beam providing the laser beam to a lenslet array including a plurality of lenslets, and generating, from the laser beam, a plurality of laser sub-beams using the lenslet array. Each one of the plurality of laser sub-beams is generated by a corresponding one of the plurality of lenslets. Each lenslet of the plurality of lenslets has the same shape.
    Type: Grant
    Filed: April 5, 2019
    Date of Patent: May 31, 2022
    Assignee: FACEBOOK TECHNOLOGIES, LLC
    Inventors: Daniel Brodoceanu, Oscar Torrents Abad
  • Flexible interconnect using conductive adhesive
    Patent number: 11349053
    Abstract: Embodiments relate to the design of an electronic device capable having flexible interconnects that connect together a first body and a second body of the electronic device. The flexible interconnects allow the electrical device to better withstand thermal-mechanical stress during fabrication of the electronic device and user usage of the electronic device.
    Type: Grant
    Filed: January 14, 2020
    Date of Patent: May 31, 2022
    Assignee: Facebook Technologies, LLC
    Inventors: Zheng Sung Chio, Daniel Brodoceanu, Ali Sengül, Oscar Torrents Abad, Jeb Wu, Pooya Saketi, Chao Kai Tung, Tennyson Nguty, Allan Pourchet
  • ELASTOMERIC LAYER FABRICATION FOR LIGHT EMITTING DIODES
    Publication number: 20190123031
    Abstract: An elastomeric interface layer (elayer) is formed over multiple light emitting diode (LED) dies by depositing photoresist materials across multiple LED dies, and using the LED dies as a photolithography mask to facilitate formation of the elayer on each LED die. The elayer facilitates adhesive attachment of each LED die with a pick and place head (PPH), allowing the LED dies to be picked up and placed onto a display substrate including control circuits for sub-pixels of an electronic display. In some embodiments, the LED dies are micro-LED (?LED) dies.
    Type: Application
    Filed: October 20, 2017
    Publication date: April 25, 2019
    Inventors: Daniel Brodoceanu, Oscar Torrents Abad
  • Dry-etching of carrier substrate for microLED microassembly
    Patent number: 10832933
    Abstract: A method of placing light emitting diodes (LEDs) includes embedding an array of LEDs in a polymer layer on a substrate. The method includes detaching at least one LED in the array of LEDs from the substrate by dry-etching the polymer layer in which at least one LED is embedded. A pick-up-tool (PUT) is brought into contact with at least one surface of at least one LED facing away from the substrate, responsive to dry-etching the polymer layer. The PUT is lifted with the at least one LED attached to the PUT.
    Type: Grant
    Filed: April 2, 2018
    Date of Patent: November 10, 2020
    Assignee: Facebook Technologies, LLC
    Inventors: Daniel Brodoceanu, Oscar Torrents Abad
  • Bonding corners of light emitting diode chip to substrate using laser
    Patent number: 11255529
    Abstract: A light emitting diode (LED) chip is bonded to a substrate. The LED chip includes a plurality of electrodes that each corresponds to a contact on the substrate. The plurality of electrodes are exposed to one or more laser beams for coupling the LED chip to the substrate. The laser beams may be directed to one or more edges or corners of the plurality of electrodes, where the edges or corners lie outside emission areas of LEDs on the LED chip.
    Type: Grant
    Filed: October 29, 2019
    Date of Patent: February 22, 2022
    Assignee: Facebook Technologies, LLC
    Inventors: Jeb Wu, Oscar Torrents Abad, Daniel Brodoceanu, Pooya Saketi, Zheng Sung Chio, Ali Sengül
  • Optics formation using pick-up tools
    Patent number: 11005014
    Abstract: Techniques related to optics formation using pick-up tools are disclosed. Optical elements are formed by pressing a pick-up tool (PUT) against elastomeric material deposited on a light-outputting side of light-emitting diode (LED) devices. Pressing the PUT against the elastomeric material causes a molded shape of the PUT to be transferred to the elastomeric material. This forms the optical elements in the elastomeric material.
    Type: Grant
    Filed: July 30, 2018
    Date of Patent: May 11, 2021
    Assignee: FACEBOOK TECHNOLOGIES, LLC
    Inventors: Daniel Brodoceanu, Patrick Joseph Hughes, Pooya Saketi, Oscar Torrents Abad
  • ELASTOMERIC LAYER FABRICATION FOR LIGHT EMITTING DIODES
    Publication number: 20190148348
    Abstract: An elastomeric interface layer (elayer) is formed over multiple light emitting diode (LED) dies by depositing photoresist materials across multiple LED dies, and using the LED dies as a photolithography mask to facilitate formation of the elayer on each LED die. The elayer facilitates adhesive attachment of each LED die with a pick and place head (PPH), allowing the LED dies to be picked up and placed onto a display substrate including control circuits for sub-pixels of an electronic display. In some embodiments, the LED dies are micro-LED (?LED) dies.
    Type: Application
    Filed: October 18, 2018
    Publication date: May 16, 2019
    Inventors: Daniel Brodoceanu, Oscar Torrents Abad
  • Method for polymer-assisted chip transfer
    Patent number: 10388516
    Abstract: One or more chips are transferred from one substrate to another by using one or more polymer layers to secure the one or more chips to an intermediate carrier substrate. While secured to the intermediate carrier substrate, the one or more chips may be transported or put through further processing or fabrication steps. To release the one or more chips, the adhesion strength of the one or more polymer layers is gradually reduced to minimize potential damage to the one or more chips.
    Type: Grant
    Filed: January 10, 2018
    Date of Patent: August 20, 2019
    Assignee: Facebook Technologies, LLC
    Inventors: Oscar Torrents Abad, Pooya Saketi, Daniel Brodoceanu, Karsten Moh
  • MONITORING DRY-ETCHING OF POLYMER LAYER FOR TRANSFERRING SEMICONDUCTOR DEVICES
    Publication number: 20200006108
    Abstract: Embodiments relate to placing light emitting diodes from a carrier substrate to a target substrate. At least one LED is embedded in a polymer layer on a substrate. The polymer layer is etched between the at least one LED and the substrate. A thickness of the polymer layer is monitored during etching of the polymer layer. The etching of the polymer layer is terminated responsive to determining that the thickness of the polymer layer is in a target range or a target value. A pick-up-tool (PUT) is brought into contact with at least one surface of the at least one LED facing away from the substrate responsive to dry-etching the polymer layer, and the PUT is lifted with the at least one LED attached to the PUT.
    Type: Application
    Filed: June 27, 2018
    Publication date: January 2, 2020
    Inventor: Daniel Brodoceanu
  • ELASTOMERIC LAYER FABRICATION FOR LIGHT EMITTING DIODES
    Publication number: 20190333903
    Abstract: An elastomeric interface layer (elayer) is formed over multiple light emitting diode (LED) dies by depositing photoresist materials across multiple LED dies, and using the LED dies as a photolithography mask to facilitate formation of the elayer on each LED die. The elayer facilitates adhesive attachment of each LED die with a pick and place head (PPH), allowing the LED dies to be picked up and placed onto a display substrate including control circuits for sub-pixels of an electronic display. In some embodiments, the LED dies are micro-LED (?LED) dies.
    Type: Application
    Filed: May 9, 2019
    Publication date: October 31, 2019
    Inventors: Daniel Brodoceanu, Oscar Torrents Abad
  • Method for polymer-assisted chip transfer
    Patent number: 10586725
    Abstract: One or more chips are transferred from one substrate to another by using one or more polymer layers to secure the one or more chips to an intermediate carrier substrate. While secured to the intermediate carrier substrate, the one or more chips may be transported or put through further processing or fabrication steps. To release the one or more chips, the adhesion strength of the one or more polymer layers is gradually reduced to minimize potential damage to the one or more chips.
    Type: Grant
    Filed: January 10, 2018
    Date of Patent: March 10, 2020
    Assignee: Facebook Technologies, LLC
    Inventors: Pooya Saketi, Oscar Torrents Abad, Allan Pourchet, Patrick Joseph Hughes, Karsten Moh, Daniel Brodoceanu
  • Elastomeric layer fabrication for light emitting diodes
    Patent number: 10269781
    Abstract: An elastomeric interface layer (elayer) is formed over multiple light emitting diode (LED) dies by depositing photoresist materials across multiple LED dies, and using the LED dies as a photolithography mask to facilitate formation of the elayer on each LED die. The elayer facilitates adhesive attachment of each LED die with a pick and place head (PPH), allowing the LED dies to be picked up and placed onto a display substrate including control circuits for sub-pixels of an electronic display. In some embodiments, the LED dies are micro-LED (?LED) dies.
    Type: Grant
    Filed: October 18, 2018
    Date of Patent: April 23, 2019
    Assignee: Facebook Technologies, LLC
    Inventors: Daniel Brodoceanu, Oscar Torrents Abad
  • Elastomeric layer fabrication for light emitting diodes
    Patent number: 10319705
    Abstract: An elastomeric interface layer (elayer) is formed over multiple light emitting diode (LED) dies by depositing photoresist materials across multiple LED dies, and using the LED dies as a photolithography mask to facilitate formation of the elayer on each LED die. The elayer facilitates adhesive attachment of each LED die with a pick and place head (PPH), allowing the LED dies to be picked up and placed onto a display substrate including control circuits for sub-pixels of an electronic display. In some embodiments, the LED dies are micro-LED (?LED) dies.
    Type: Grant
    Filed: October 20, 2017
    Date of Patent: June 11, 2019
    Assignee: Facebook Technologies, LLC
    Inventors: Daniel Brodoceanu, Oscar Torrents Abad
  • Interconnect with nanotube fitting
    Patent number: 11417792
    Abstract: A light emitting diode (LED) array is formed by bonding an LED substrate to a backplane substrate via fitted nanotube interconnects. The backplane substrate may include circuits for driving the LED array. The LED substrate may be a chip or wafer, and may include one or more LED devices. The LED substrate is positioned above the backplane substrate, such that a LED device of the LED substrate is aligned to a corresponding circuit in the backplane substrate. Each of the fitted interconnects electrically connect a LED device to the corresponding circuit of the backplane substrate.
    Type: Grant
    Filed: March 19, 2020
    Date of Patent: August 16, 2022
    Assignee: Meta Platforms Technologies, LLC
    Inventors: Ali Sengül, Zheng Sung Chio, Daniel Brodoceanu, Oscar Torrents Abad, Jeb Wu, Tennyson Nguty
  • Molded etch masks
    Patent number: 10910514
    Abstract: Techniques related to molded etch masks are disclosed. Etch masks can be formed based on pressing a mold against a layer of pliable masking material applied to a surface of an epitaxial layered structure. The epitaxial layered structure includes a first semiconductor layer, a second semiconductor layer, and a light-emitting layer between the first and second semiconductor layers. The epitaxial layered structure is etched using the molded etch masks to form etched structures. The etched structures may be optical structures that modify light emitted through the surface or epitaxial mesas that collimate light within the epitaxial layered structure.
    Type: Grant
    Filed: December 21, 2018
    Date of Patent: February 2, 2021
    Assignee: FACEBOOK TECHNOLOGIES, LLC
    Inventors: Daniel Brodoceanu, David Massoubre, Karsten Moh
  • Method for polymer-assisted chip transfer
    Patent number: 10559486
    Abstract: One or more chips are transferred from one substrate to another by using one or more polymer layers to secure the one or more chips to an intermediate carrier substrate. While secured to the intermediate carrier substrate, the one or more chips may be transported or put through further processing or fabrication steps. To release the one or more chips, the adhesion strength of the one or more polymer layers is gradually reduced to minimize potential damage to the one or more chips.
    Type: Grant
    Filed: January 10, 2018
    Date of Patent: February 11, 2020
    Assignee: Facebook Technologies, LLC
    Inventors: Daniel Brodoceanu, Pooya Saketi, Oscar Torrents Abad, Allan Pourchet, Patrick Joseph Hughes, Karsten Moh
  • ATOMIC FORCE MICROSCOPY TIPS FOR INTERCONNECTION
    Publication number: 20210055327
    Abstract: Embodiments relate to the design of an electronic device capable of preventing a lateral motion between a first body and a second body. The device comprises a first body comprising one or more atomic force microscopy (AFM) tips protruding from a first surface of the first body. The device further comprises a second body comprising one or more electrical contacts on a second surface of the second body. The second surface faces the first surface. The one or more electrical contacts pierced by the AFM tips of the first surface to prevent a lateral motion between the first body and the second body.
    Type: Application
    Filed: February 4, 2020
    Publication date: February 25, 2021
    Inventors: Ali Sengül, Oscar Torrents Abad, Zheng Sung Chio, Pooya Saketi, Daniel Brodoceanu
  • METAL-NANOPARTICLE-ARRAYS AND PRODUCTION OF METAL-NANOPARTICLE-ARRAYS
    Publication number: 20150321162
    Abstract: In metal-nanoparticle arrays and methods of producing metal-nanoparticle arrays, the metal-nanoparticle size and the interparticle distance between the metal nanoparticles can be adjusted. In the method of producing metal-nanoparticle arrays, a colloidal dispersion of microspheres is deposited on a substrate as a densely packed monolayer via convective assembly, after which the deposited monolayer is coated with at least one thinly deposited metal-nanoparticle layer by a physical deposition process, and after which the microspheres deposited on the substrate as a monolayer and coated with at least one metal-nanoparticle layer are removed by thermal decomposition.
    Type: Application
    Filed: December 12, 2013
    Publication date: November 12, 2015
    Applicants: BESCHRAENKTER HAFTUNG
    Inventors: Daniel BRODOCEANU, Tobias KRAUS, Cheng FANG, Nicolas Hans VOELCKER
  • LASER LIFT-OFF MASKS
    Publication number: 20200035880
    Abstract: Techniques related to laser lift-off masks are disclosed. In some embodiments, masking material is applied to a substrate that is attached to a plurality of semiconductor device sets. More specifically, the masking material is applied to one or more regions of the substrate between the semiconductor device sets. When the semiconductor device sets are embedded in a filling material, the masking material may be situated between the substrate and the filling material. Thus, transmitting light through the substrate toward the semiconductor device sets causes the substrate to become detached from the semiconductor device sets. However, the light is at least partially occluded by the masking material.
    Type: Application
    Filed: July 30, 2018
    Publication date: January 30, 2020
    Inventors: Daniel Brodoceanu, David Massoubre, James Small, Oscar Torrents Abad, Patrick Joseph Hughes
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