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  • Flexible interconnect using conductive adhesive
    Patent number: 11349053
    Abstract: Embodiments relate to the design of an electronic device capable having flexible interconnects that connect together a first body and a second body of the electronic device. The flexible interconnects allow the electrical device to better withstand thermal-mechanical stress during fabrication of the electronic device and user usage of the electronic device.
    Type: Grant
    Filed: January 14, 2020
    Date of Patent: May 31, 2022
    Assignee: Facebook Technologies, LLC
    Inventors: Zheng Sung Chio, Daniel Brodoceanu, Ali Sengül, Oscar Torrents Abad, Jeb Wu, Pooya Saketi, Chao Kai Tung, Tennyson Nguty, Allan Pourchet