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  • Patent number: 6454633
    Abstract: A polishing pad is provided which is comprised of vertically oriented hollow fibers. Such pads can be produced by electrostatically flocking fibers onto a substrate.
    Type: Grant
    Filed: June 22, 2000
    Date of Patent: September 24, 2002
    Assignee: Rodel Holdings Inc.
    Inventors: Heinz F. Reinhardt, Elmer W. Jensen, Jr.
  • Patent number: 5487697
    Abstract: The present invention relates to an apparatus for polishing semiconductor wafers and, in particular, one in which the polishing pads are linear, that is, the polishing pads have a long linear dimension relative to their width and have a uniform cross-section along this linear dimension. In addition, the wafer holder travels in a straight line parallel to the long linear dimension of the polishing pads.
    Type: Grant
    Filed: February 9, 1993
    Date of Patent: January 30, 1996
    Assignee: Rodel, Inc.
    Inventor: Elmer W. Jensen