Abstract: A polishing pad is provided which is comprised of vertically oriented hollow fibers. Such pads can be produced by electrostatically flocking fibers onto a substrate.
Type:
Grant
Filed:
June 22, 2000
Date of Patent:
September 24, 2002
Assignee:
Rodel Holdings Inc.
Inventors:
Heinz F. Reinhardt, Elmer W. Jensen, Jr.
Abstract: The present invention relates to an apparatus for polishing semiconductor wafers and, in particular, one in which the polishing pads are linear, that is, the polishing pads have a long linear dimension relative to their width and have a uniform cross-section along this linear dimension. In addition, the wafer holder travels in a straight line parallel to the long linear dimension of the polishing pads.