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  • Polymeric polishing pad having continuously regenerated work surface
    Publication number: 20030068960
    Abstract: A polishing pad used in a method for polishing a semiconductor device is made by combining a polymeric matrix and a dissolvable substance that dissolves upon contact with a polishing slurry.
    Type: Application
    Filed: November 12, 2002
    Publication date: April 10, 2003
    Inventors: Heinz F. Reinhardt, John V. H. Roberts, Harry George McClain, William D. Budinger, Elmer William Jensen
  • Polishing pad for a semiconductor device having a dissolvable substance
    Patent number: 6899611
    Abstract: A polishing pad used in a method for polishing a semiconductor device is made by combining a polymeric matrix and a dissolvable substance that dissolves upon contact with a polishing slurry.
    Type: Grant
    Filed: November 12, 2002
    Date of Patent: May 31, 2005
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Heinz F. Reinhardt, John V. H. Roberts, Harry George McClain, William D. Budinger, Elmer William Jensen
  • Method of polishing a semiconductor device
    Publication number: 20040224142
    Abstract: The present invention provides a method of polishing a semiconductor device comprising, polishing the semiconductor device with a polishing pad, the polishing pad comprising, a polymeric matrix and a dissolvable substance. The dissolvable substance is located at a work surface of the polishing pad and in a subsurface proximate the work surface. The method further comprises dissolving the dissolvable substance at the work surface while polishing the semiconductor device and wearing away the polishing pad while polishing the semiconductor device such that the subsurface becomes a new work surface that polishes the semiconductor device.
    Type: Application
    Filed: May 19, 2004
    Publication date: November 11, 2004
    Inventors: Heinz F. Reinhardt, John V. H. Roberts, Harry George McClain, William D. Budinger, Elmer William Jensen
  • Method of polishing a semiconductor device
    Patent number: 6903021
    Abstract: The present invention provides a method of polishing a semiconductor device comprising, polishing the semiconductor device with a polishing pad, the polishing pad comprising, a polymeric matrix and a dissolvable substance. The dissolvable substance is located at a work surface of the polishing pad and in a subsurface proximate the work surface. The method further comprises dissolving the dissolvable substance at the work surface while polishing the semiconductor device and wearing away the polishing pad while polishing the semiconductor device such that the subsurface becomes a new work surface that polishes the semiconductor device.
    Type: Grant
    Filed: May 19, 2004
    Date of Patent: June 7, 2005
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Heinz F. Reinhardt, John V. H. Roberts, Harry George McClain, William D. Budinger, Elmer William Jensen
  • Polymeric polishing pad having continuously regenerated work surface
    Patent number: 6439989
    Abstract: An article or polishing pad for altering a surface of a workpiece includes a polymeric matrix having a work surface and a subsurface proximate to the work surface. When the article is in contact with a working environment, the work surface is made relatively softer than the subsurface as a result of exposure to the working environment. As the work surface wears during use, the subsurface immediately adjacent to the work surface becomes exposed to the working environment and becomes the relatively softer work surface. As a result, the relatively softer work surface is continuously regenerated. In an alternative embodiment, an article for altering a surface of a workpiece includes a work surface having a texture, and the texture includes artifacts arranged in a fractal pattern.
    Type: Grant
    Filed: August 4, 1999
    Date of Patent: August 27, 2002
    Assignee: Rodel Holdings Inc.
    Inventors: Heinz F. Reinhardt, John V. H. Roberts, Harry George McClain, William D. Budinger, Elmer William Jensen
  • Method for planarizing a semiconductor device surface with polymeric pad containing hollow polymeric microelements
    Patent number: 5900164
    Abstract: The present invention relates to an article of manufacture or polishing pad for altering a surface of a workpiece, such as polishing or planarizing a semiconductor device. The article includes a polymeric matrix impregnated with a plurality of polymeric microelements, each polymeric microelement having a void space therein. The article has a work surface and a subsurface proximate to the work surface. When the article is in contact with a working environment, polymeric microelements at the work surface of the article are less rigid than polymeric elements embedded in the subsurface. As the work surface of the article is abraded during use, the work surface of the pad may be continuously regenerated. In alternative preferred embodiments, the work surface may further include a minitexture and/or a macrotexture. Preferably, the minitexture is formed by fractal patterning at least a portion of the work surface.
    Type: Grant
    Filed: October 20, 1997
    Date of Patent: May 4, 1999
    Assignee: Rodel, Inc.
    Inventors: William D. Budinger, Elmer William Jensen, Harry George McClain, John V. H. Roberts, Heinz F. Reinhardt
  • Image reproduction system
    Publication number: 20040141196
    Abstract: The present invention provides a system for the reproduction of a work of fine art comprising a work of art, which may be a painting, etching, drawing, collage, or any other two dimensional form of fine art, being mounted vertically at a precision distance from a camera, and floodlamps for illuminating said work of art. The floodlamps are computer controlled by feedback from said camera so that intensity, focus, and spread will be even over the full surface of the work of art. The control of the illumination is provided by an illumination computer via optical fiber cables. The present invention also provides the process for reproduction of a work of fine art.
    Type: Application
    Filed: November 12, 2003
    Publication date: July 22, 2004
    Inventors: Elmer William Jensen, Franklin Delano Davis
  • Polymeric polishing pad containing hollow polymeric microelements
    Patent number: 5578362
    Abstract: The present invention relates to an article of manufacture or polishing pad for altering a surface of a workpiece, such as polishing or planarizing a semiconductor device. The article includes a polymeric matrix impregnated with a plurality of polymeric microelements, each polymeric microelement having a void space therein. The article has a work surface and a subsurface proximate to the work surface. When the article is in contact with a working environment, polymeric microelements at the work surface of the article are less rigid than polymeric elements embedded in the subsurface. As the work surface of the article is abraded during use, the work surface of the pad may be continuously regenerated. In alternative preferred embodiments, the work surface may further include a minitexture and/or a macrotexture. Preferably, the minitexture is formed by fractal patterning at least a portion of the work surface.
    Type: Grant
    Filed: July 12, 1994
    Date of Patent: November 26, 1996
    Assignee: Rodel, Inc.
    Inventors: Heinz F. Reinhardt, John V. H. Roberts, Harry G. McClain, William D. Budinger, Elmer W. Jensen
  • Polymeric polishing pad having continuously regenerated work surface
    Publication number: 20050221741
    Abstract: The polishing pad is useful for polishing a surface of an electronic substrate. The pad comprises a polymeric matrix and polymeric microelements within the polymeric matrix. The polymeric microelements have a mean diameter of less than 150 ?m (0.0059?). The pad has grooves forming artifacts and a depth less than 2000 times the mean diameter of the polymeric microelements; and the artifacts are spaced apart 0.1 to 10 mm (0.0039? to 0.39?) and have a width of 1 to 5 mm (0.039? to 0.20?).
    Type: Application
    Filed: May 27, 2005
    Publication date: October 6, 2005
    Inventors: Heinz Reinhardt, John Roberts, Harry McClain, William Budinger, Elmer Jensen
  • Pad material for grinding, lapping and polishing
    Patent number: 4927432
    Abstract: An improved polishing pad material is produced by modifying conventional poromeric materials in which a porous thermoplastic resin matrix, typically polyurethane, is reinforced with a fibrous network such as a felted mat of polyester fibers. The polishing material is modified by coalescing the resin among the fibers, preferably by heat treatment, to increase the porosity and hardness of the material as well increasing the surface activity of the resin. The polishing material may also incorporate polishing aids such as particulate abrasives and may also be used as a lapping or grinding material.
    Type: Grant
    Filed: March 25, 1986
    Date of Patent: May 22, 1990
    Assignee: Rodel, Inc.
    Inventors: William D. Budinger, Elmer W. Jensen
  • System for ordering and manufacturing a tangible device
    Publication number: 20010032111
    Abstract: A system, method and apparatus by which a customer determines ordering, manufacturing at a selected site and delivery without shipping of a tangible device sold by using a seller's computer (3) receiving an order for a tangible device from a customer, selecting manufacturing process commands to manufacture the device as ordered, verifying that the site has the capability and an open schedule to manufacture the device, scheduling the manufacturing during the open schedule, and providing an order fulfillment schedule and status tracking of the order, a manufacturing control computer (4) providing manufacturing process commands to a production unit (5) at the site, and providing a record of maintenance fulfillment indicating capability and readiness of the production unit to manufacture the tangible device.
    Type: Application
    Filed: December 27, 2000
    Publication date: October 18, 2001
    Inventors: Elmer W. Jensen, Lee Melbourne Cook, William D. Budinger
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