Search Patents
  • Current Distribution in DC-DC Converters
    Publication number: 20160380538
    Abstract: A DC-DC converter includes a substrate having opposing first and second sides, a power stage attached to the first side of the substrate and having active semiconductor components operable to provide an output phase of the DC-DC converter, an inductor attached to the first side of the substrate and electrically connected to the power stage through a first metal trace at the first side of the substrate, and a plurality of electrically conductive vias extending through the substrate from the first side to the second side. The vias are electrically connected to the first metal trace. At least some of the vias are disposed at least partly under the power stage. A corresponding method of assembling such a DC-DC converter also is disclosed.
    Type: Application
    Filed: June 29, 2015
    Publication date: December 29, 2016
    Inventors: Benjamim Tang, Allen Sakai, Scott Kawaguchi, Emil Todorov
  • Current distribution in DC-DC converters
    Patent number: 10050528
    Abstract: A DC-DC converter includes a substrate having opposing first and second sides, a power stage attached to the first side of the substrate and having active semiconductor components operable to provide an output phase of the DC-DC converter, an inductor attached to the first side of the substrate and electrically connected to the power stage through a first metal trace at the first side of the substrate, and a plurality of electrically conductive vias extending through the substrate from the first side to the second side. The vias are electrically connected to the first metal trace. At least some of the vias are disposed at least partly under the power stage. A corresponding method of assembling such a DC-DC converter also is disclosed.
    Type: Grant
    Filed: June 29, 2015
    Date of Patent: August 14, 2018
    Assignee: Infineon Technologies Austria AG
    Inventors: Benjamim Tang, Allen Sakai, Scott Kawaguchi, Emil Todorov
  • Discrete Power Stage Transistor Dies of a DC-DC Converter Under an Inductor
    Publication number: 20160352226
    Abstract: A DC-DC converter includes a substrate having opposing first and second sides, a first discrete power stage transistor die attached to the first side of the substrate and including a high-side power transistor, and a second discrete power stage transistor die attached to the first side of the substrate and including a low-side power transistor electrically connected to the high-side power transistor to form an output phase of the DC-DC converter. The DC-DC converter further includes an inductor attached to the first side of the substrate so as to electrically connect the output phase to a metal output trace on the substrate. The inductor at least partly covers at least one of the first and the second discrete power stage transistor dies.
    Type: Application
    Filed: May 29, 2015
    Publication date: December 1, 2016
    Inventors: Darryl Tschirhart, Benjamim Tang, Emil Todorov
  • Current distribution in DC-DC converters
    Patent number: 10020730
    Abstract: A DC-DC converter includes a substrate having opposing first and second sides, a power stage attached to the first side of the substrate and having active semiconductor components operable to provide an output phase of the DC-DC converter, an inductor attached to the first side of the substrate and electrically connected to the power stage through a first metal trace at the first side of the substrate, and a plurality of electrically conductive vias extending through the substrate from the first side to the second side. The vias are electrically connected to the first metal trace. At least some of the vias are disposed at least partly under the power stage. A corresponding method of assembling such a DC-DC converter also is disclosed.
    Type: Grant
    Filed: June 29, 2015
    Date of Patent: July 10, 2018
    Assignee: Infineon Technologies Austria AG
    Inventors: Benjamim Tang, Allen Sakai, Scott Kawaguchi, Emil Todorov
  • METHOD OF ASSEMBLING A DC-DC CONVERTER
    Publication number: 20210057996
    Abstract: A method of assembling a DC-DC converter includes: attaching first and second discrete power stage transistor dies to a first side of a substrate, the first discrete die including a high-side power transistor and the second discrete die including a low-side power transistor electrically connected to the high-side power transistor to form an output phase of the DC-DC converter; attaching an inductor to the first side of the substrate so as to electrically connect the output phase to a metal output trace on the substrate, the inductor partly covering at least one of the first and the second discrete power stage transistor dies such that each discrete power stage transistor die that is partly covered by the inductor comprises a plurality of pins that are not covered by the inductor; and visually inspecting the plurality of pins uncovered by the inductor.
    Type: Application
    Filed: November 10, 2020
    Publication date: February 25, 2021
    Inventors: Darryl Tschirhart, Benjamim Tang, Emil Todorov
  • Surface Mount Inductor for Placement Over a Power Stage of a Power Converter
    Publication number: 20170178797
    Abstract: An electrical conductor of a surface mount inductor includes a first section extending along a first side face of the magnetic core, a second section extending along a second side face of the magnetic core, and a third section connecting the first and second sections and extending through the magnetic core. A first straight lead extends downwards from the first section beyond the bottom main face of the magnetic core, and has an unbent distal end configured for surface mounting to a circuit board. A second straight lead extends downwards from the second section beyond the bottom main face, and has an unbent distal end configured for surface mounting to the circuit board. The straight leads each have a height and a width which allows for mounting of a power stage to the circuit board at least partly under the magnetic core.
    Type: Application
    Filed: December 21, 2015
    Publication date: June 22, 2017
    Inventor: Emil Todorov
  • DC-DC Converter Assembly with an Output Inductor Accommodating a Power Stage Attached to a Circuit Board
    Publication number: 20150116972
    Abstract: A DC-DC converter assembly includes a board having a first side and a second side opposite the first side, a power stage die of a DC-DC converter attached to the first side of the board, and an output inductor electrically connected to an output of the power stage die and disposed over the power stage die on the first side of the board. The output inductor includes a magnetic core and an electrical conductor having first and second terminals attached to the first side of the board. The output inductor accommodates the power stage die under the magnetic core so that the power stage die is interposed between the magnetic core and the board. A corresponding method of manufacturing the DC-DC converter assembly and method of manufacturing the output inductor are also disclosed.
    Type: Application
    Filed: October 28, 2013
    Publication date: April 30, 2015
    Inventors: Emil Todorov, Brian Molloy
  • Discrete power stage transistor dies of a DC-DC converter under an inductor
    Patent number: 10855178
    Abstract: A DC-DC converter includes a substrate having opposing first and second sides, a first discrete power stage transistor die attached to the first side of the substrate and including a high-side power transistor, and a second discrete power stage transistor die attached to the first side of the substrate and including a low-side power transistor electrically connected to the high-side power transistor to form an output phase of the DC-DC converter. The DC-DC converter further includes an inductor attached to the first side of the substrate so as to electrically connect the output phase to a metal output trace on the substrate. The inductor at least partly covers at least one of the first and the second discrete power stage transistor dies.
    Type: Grant
    Filed: May 29, 2015
    Date of Patent: December 1, 2020
    Assignee: Infineon Technologies Austria AG
    Inventors: Darryl Tschirhart, Benjamim Tang, Emil Todorov
  • MULTI-PHASE SWITCHING VOLTAGE REGULATOR HAVING ASYMMETRIC PHASE INDUCTANCE
    Publication number: 20160233766
    Abstract: A multi-phase switching voltage regulator includes a controller and a plurality of power stages each configured to deliver output current to a load through an inductor. At least one of the inductors has a higher open circuit inductance than the other inductors so that at least one of the power stages has a different output inductance compared to the other power stages. The controller is configured to control switching of the power stages so as to regulate an output voltage of the multi-phase switching voltage regulator, including allowing all of the power stages to provide current to the load through the respective inductors during a full power event at the load and preventing all of the power stages except for the at least one power stage having the higher open circuit inductance from providing current to the load during a low power event at the load.
    Type: Application
    Filed: February 5, 2015
    Publication date: August 11, 2016
    Inventors: Emil Todorov, Benjamim Tang
  • Power Stage Packages of a Multi-Phase DC-DC Converter Under a Coupled Inductor
    Publication number: 20160330831
    Abstract: A multi-phase DC-DC converter includes a substrate having opposing first and second sides, a plurality of power stage packages attached to the first side of the substrate, each power stage package including active semiconductor components operable to provide an output phase of the multi-phase DC-DC converter, and a coupled inductor attached to the first side of the substrate and at least partly covering two or more of the power stage packages. The coupled inductor includes separate windings wound on the same core. Each winding of the coupled inductor electrically connects an output of one of the power stage packages at least partly covered by the coupled inductor to a metal trace on the substrate such that the outputs of the power stage packages at least partly covered by the coupled inductor are electrically connected to the same metal trace on the substrate.
    Type: Application
    Filed: May 6, 2015
    Publication date: November 10, 2016
    Inventors: Emil Todorov, Benjamim Tang, Darryl Tschirhart
  • Through-Hole Inductor for Placement Over a Power Stage of a Power Converter
    Publication number: 20170178795
    Abstract: An electrical conductor of a through-hole inductor includes a first section extending along a first side face of the magnetic core, a second section extending along a second side face of the magnetic core, and a third section connecting the first and second sections and extending through the magnetic core. A first straight lead extends downwards from the first section beyond the bottom main face of the magnetic core, and has an unbent distal end configured for through-hole mounting to a circuit board. A second straight lead extends downwards from the second section beyond the bottom main face, and also has an unbent distal end configured for through-hole mounting to the circuit board. The straight leads each have a height which allows for mounting of a power stage to the circuit board at least partly under the magnetic core.
    Type: Application
    Filed: December 21, 2015
    Publication date: June 22, 2017
    Inventor: Emil Todorov
  • Membrane Electrode Assembly for High Temperature PEM Fuel Cells and Water Electrolysis
    Publication number: 20250118784
    Abstract: A membrane electrode assembly is provided for mitigating the detrimental effect of water or steam on HTPEM membranes. The membrane electrode assembly includes an ion conductive electrolyte membrane, an ion conductive interface layer, a cathode electrode and an anode electrode. The electrolyte membrane is laminated with the ion conductive interface layer on both the cathode side and the anode side or on only one side. The ion conductive interface layer includes a material having sufficiently high ion conductivity and a chemically stable structure to withstand the effect of the elevated temperatures and water. These ion conductive interface layers act as an effective barrier to electrolyte on the membrane side and to the water on the electrode side, while only marginally effecting the overall ion of the electrode conductivity because of the thinness of the layer.
    Type: Application
    Filed: October 6, 2024
    Publication date: April 10, 2025
    Inventors: Aleksei Ivanenko, Dietmar Trees, Artem Riazantsev, Alexander Todorov, Samuel Emil Ruben
  • Method of assembling a DC-DC converter
    Patent number: 11283356
    Abstract: A method of assembling a DC-DC converter includes: attaching first and second discrete power stage transistor dies to a first side of a substrate, the first discrete die including a high-side power transistor and the second discrete die including a low-side power transistor electrically connected to the high-side power transistor to form an output phase of the DC-DC converter; attaching an inductor to the first side of the substrate so as to electrically connect the output phase to a metal output trace on the substrate, the inductor partly covering at least one of the first and the second discrete power stage transistor dies such that each discrete power stage transistor die that is partly covered by the inductor comprises a plurality of pins that are not covered by the inductor; and visually inspecting the plurality of pins uncovered by the inductor.
    Type: Grant
    Filed: November 10, 2020
    Date of Patent: March 22, 2022
    Assignee: Infineon Technologies North America Corp.
    Inventors: Darryl Tschirhart, Benjamim Tang, Emil Todorov
  • DC-DC converter assembly with an output inductor accommodating a power stage attached to a circuit board
    Patent number: 9711279
    Abstract: A DC-DC converter assembly includes a board having a first side and a second side opposite the first side, a power stage die of a DC-DC converter attached to the first side of the board, and an output inductor electrically connected to an output of the power stage die and disposed over the power stage die on the first side of the board. The output inductor includes a magnetic core and an electrical conductor having first and second terminals attached to the first side of the board. The output inductor accommodates the power stage die under the magnetic core so that the power stage die is interposed between the magnetic core and the board. A corresponding method of manufacturing the DC-DC converter assembly and method of manufacturing the output inductor are also disclosed.
    Type: Grant
    Filed: October 28, 2013
    Date of Patent: July 18, 2017
    Assignee: Infineon Technologies Austria AG
    Inventors: Emil Todorov, Brian Molloy
  • DC-DC Converter Assembly, Method of Manufacturing a DC-DC Converter Assembly and Method of Manufacturing an Output Inductor for a DC-DC Converter Assembly
    Publication number: 20170263378
    Abstract: A DC-DC converter assembly a power stage die of a DC-DC converter attached to a board, an output inductor attached to the board and electrically connected to an output of the power stage die, the output inductor accommodating the power stage die under the output inductor, a plurality of input capacitors attached to the board and electrically connected to input terminals of the power stage die, an output capacitor attached to the board and electrically connected to the output inductor, and a plurality of decoupling capacitors attached to the board and electrically connected to power terminals of the power stage die. A total footprint of the power stage die, the output inductor, the input capacitors, the output capacitor and the decoupling capacitors is at least a third of the combined surface area of the power stage die, the output inductor, the input capacitors, the output capacitor and the decoupling capacitors.
    Type: Application
    Filed: May 26, 2017
    Publication date: September 14, 2017
    Inventors: Emil Todorov, Brian Molloy
  • Multi-phase switching voltage regulator having asymmetric phase inductance
    Patent number: 10069421
    Abstract: A multi-phase switching voltage regulator includes a controller and a plurality of power stages each configured to deliver output current to a load through an inductor. At least one of the inductors has a higher open circuit inductance than the other inductors so that at least one of the power stages has a different output inductance compared to the other power stages. The controller is configured to control switching of the power stages so as to regulate an output voltage of the multi-phase switching voltage regulator, including allowing all of the power stages to provide current to the load through the respective inductors during a full power event at the load and preventing all of the power stages except for the at least one power stage having the higher open circuit inductance from providing current to the load during a low power event at the load.
    Type: Grant
    Filed: February 5, 2015
    Date of Patent: September 4, 2018
    Assignee: Infineon Technologies Austria AG
    Inventors: Emil Todorov, Benjamim Tang
  • Power stage packages of a multi-phase DC-DC converter under a coupled inductor
    Patent number: 10333407
    Abstract: A multi-phase DC-DC converter includes a substrate having opposing first and second sides, a plurality of power stage packages attached to the first side of the substrate, each power stage package including active semiconductor components operable to provide an output phase of the multi-phase DC-DC converter, and a coupled inductor attached to the first side of the substrate and at least partly covering two or more of the power stage packages. The coupled inductor includes separate windings wound on the same core. Each winding of the coupled inductor electrically connects an output of one of the power stage packages at least partly covered by the coupled inductor to a metal trace on the substrate such that the outputs of the power stage packages at least partly covered by the coupled inductor are electrically connected to the same metal trace on the substrate.
    Type: Grant
    Filed: May 6, 2015
    Date of Patent: June 25, 2019
    Assignee: Infineon Technologies Austria AG
    Inventors: Emil Todorov, Benjamim Tang, Darryl Tschirhart
  • Nanoelectric System for Cooling Processors and RAM Memories
    Publication number: 20250112117
    Abstract: A nanoelectronic system for cooling processors and RAM memories comprises two cooling chips, located at a distance between 20 nanometres and 200 nanometres relative to both wide-area surfaces of a processor or RAM chip (2), whereby the spaces between the individual chips (1a), (1b) and (2) are two vacuum slots (3a), (3b), and the distance between the chips is maintained by point columns (4.1 . . . 4.k, 4.k+1 . . . 4.n), which are made using a photolithography technique with the minimum size allowable for the technology—between 5 nm and 10 nm, and are moulded on the surfaces of both cooling chips (1a), (1b), whereby the whole system of chips (1a), (1b) and (2) thus described is hermetically encapsulated by a common outer housing (5); the cooling chips (1a) and (1b) comprise on their surface areas facing the main functional chip (2)—respectively, arrays of rectenna photodetectors (6a) and (6b) of infrared emission.
    Type: Application
    Filed: June 17, 2022
    Publication date: April 3, 2025
    Inventors: Emil Stefanov MIlanov, Ivan Ignatov Michaylov, Valeri Todorov Hammer
  • DC-DC converter assembly, method of manufacturing a DC-DC converter assembly and method of manufacturing an output inductor for a DC-DC converter assembly
    Patent number: 9892851
    Abstract: A DC-DC converter assembly a power stage die of a DC-DC converter attached to a board, an output inductor attached to the board and electrically connected to an output of the power stage die, the output inductor accommodating the power stage die under the output inductor, a plurality of input capacitors attached to the board and electrically connected to input terminals of the power stage die, an output capacitor attached to the board and electrically connected to the output inductor, and a plurality of decoupling capacitors attached to the board and electrically connected to power terminals of the power stage die. A total footprint of the power stage die, the output inductor, the input capacitors, the output capacitor and the decoupling capacitors is at least a third of the combined surface area of the power stage die, the output inductor, the input capacitors, the output capacitor and the decoupling capacitors.
    Type: Grant
    Filed: May 26, 2017
    Date of Patent: February 13, 2018
    Assignee: Infineon Technologies Austria AG
    Inventors: Emil Todorov, Brian Molloy
  • Pressurized Steam Reversible High Temperature Proton Exchange Membrane Hydrogen Fuel Cell System
    Publication number: 20250118783
    Abstract: A reversible high temperature proton exchange membrane (HTPEM) fuel cell energy production and storage system includes an electrolysis mode and a fuel cell mode. The system operates at elevated temperatures (e.g., 130° C. to 270° C.) and, in an electrolysis mode, converts water vapor to hydrogen. The electrolysis occurs more energy efficiently at higher temperatures as reaction potentials decline and ionic conductivity increases. In addition, when water is in a gaseous state, oxygen removal from the anode is facilitated which improves the reaction kinetics. Coolant is circulated between the stack and a heat exchanger to use excess heat from the stack generated in electrolysis mode to heat water for further electrolysis. Components and subsystems may be powered by electricity generated during fuel cell mode. A series of heat exchangers, pumps, storage tanks, and compressors allow the system to capture efficiencies in both modes of operation.
    Type: Application
    Filed: October 7, 2024
    Publication date: April 10, 2025
    Inventors: Aleksei Ivanenko, Dietmar Trees, Artem Riazantsev, Alexander Todorov, Samuel Emil Ruben
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