Search Patents
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Publication number: 20130181239Abstract: Disclosed is a semiconductor light emitting device. The semiconductor light emitting device comprises a first semiconductor layer, a second semiconductor layer, an active layer formed between the first semiconductor layer and the second semiconductor layer, a first reflective electrode on the first semiconductor layer to reflect incident light, and a second reflective electrode on the second semiconductor layer to reflect the incident light.Type: ApplicationFiled: March 7, 2013Publication date: July 18, 2013Applicant: LG INNOTEK CO., LTD.Inventor: LG INNOTEK CO., LTD.
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Publication number: 20130105828Abstract: Disclosed is a light emitting device including a light emitting structure including a plurality of light emitting regions including a first semiconductor layer, an active layer and a second semiconductor layer, and a plurality of boundary regions disposed between the light emitting regions, a first electrode unit disposed on the first semiconductor layer in one of the light emitting regions, a second electrode unit disposed on the second semiconductor layer in another of the light emitting regions, at least one connection electrode to electrically connect the first semiconductor layer of one of adjacent light emitting regions to the second semiconductor layer of the other thereof, and an intermediate pad disposed on the first semiconductor layer or the second semiconductor layer in at least one of the light emitting regions, wherein the light emitting regions are connected in series through the connection electrode.Type: ApplicationFiled: October 26, 2012Publication date: May 2, 2013Applicant: LG INNOTEK CO., LTD.Inventor: LG INNOTEK CO., LTD.
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Publication number: 20130105827Abstract: Disclosed is a light emitting device including: a light emitting structure including a plurality of light emitting regions including a first semiconductor layer, an active layer and a second semiconductor layer; a first electrode unit disposed on the first semiconductor layer in one of the light emitting regions; a second electrode unit disposed on the second semiconductor layer in another of the light emitting regions; an intermediate pad disposed on the second semiconductor layer in at least still another of the light emitting regions; and at least one connection electrode to sequentially connect the light emitting regions in series, wherein the light emitting regions connected in series are divided into 1st to ith light emitting region groups and areas of light emitting regions that belong to different groups are different (where 1<i?j, each of i and j is a natural number, and j is a last light emitting region group).Type: ApplicationFiled: October 25, 2012Publication date: May 2, 2013Applicant: LG INNOTEK CO., LTD.Inventor: LG INNOTEK CO., LTD.
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Patent number: 8227815Abstract: A lighting device is provided. The lighting device comprises a first substrate and a plurality of second substrates. The plurality of second substrates are separately and electrically connected to the first substrate and comprise a light emitting device.Type: GrantFiled: July 28, 2008Date of Patent: July 24, 2012Assignee: LG Innotek Co., Ltd.Inventor: Jun Seok Park
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Patent number: 8692265Abstract: A lighting device is provided. The lighting device comprises a first substrate and a plurality of second substrates. The plurality of second substrates are separately and electrically connected to the first substrate and comprise a light emitting device.Type: GrantFiled: July 10, 2012Date of Patent: April 8, 2014Assignee: LG Innotek Co., Ltd.Inventor: Jun Seok Park
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Publication number: 20110169021Abstract: Provided is a package of a light emitting diode. The package according to an embodiment includes a base layer, a light emitting diode chip on the base layer, a lead frame electrically connected to the light emitting diode chip, a reflective coating layer directly on the lead frame, and a molding material covering the light emitting diode chip in a predetermined shape.Type: ApplicationFiled: March 21, 2011Publication date: July 14, 2011Applicant: LG INNOTEK CO., LTD.Inventor: Bo Geun PARK
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Patent number: 8297793Abstract: Disclosed is a light emitting device and a method of manufacturing the same. The light emitting device comprises a substrate comprising a cavity, a multi-color light emitting unit on a first region of the cavity, and a white light emitting unit on a second region of the cavity.Type: GrantFiled: September 13, 2007Date of Patent: October 30, 2012Assignee: LG Innotek Co., Ltd.Inventor: Wan Ho Kim
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Patent number: 8785952Abstract: A light emitting device is disclosed. The light emitting device includes a first electrode and a second electrode, which have different areas, thereby achieving enhanced bonding reliability.Type: GrantFiled: February 6, 2012Date of Patent: July 22, 2014Assignee: LG Innotek Co., Ltd.Inventor: Dongwook Park
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Patent number: 8653545Abstract: A semiconductor light emitting device that includes a first conductive type semiconductor layer, a first electrode, a insulating layer, and an electrode layer. The first electrode has at least one branch on the first conductive type semiconductor layer. The insulating layer is disposed on the first electrode. The electrode layer is disposed on the insulating layer.Type: GrantFiled: December 23, 2009Date of Patent: February 18, 2014Assignee: LG Innotek Co., Ltd.Inventors: Woo Sik Lim, Sung Ho Choo
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Patent number: 9172004Abstract: A light emitting device package includes a body having a cavity therein and first and second recesses inside the cavity of the body. The first and second electrode layers are provided in the first and second recesses, and a light emitting device is provided on the first and second electrode layers. The first and second bumps are provided under the light emitting device and attached to the first and second recesses.Type: GrantFiled: May 1, 2014Date of Patent: October 27, 2015Assignee: LG Innotek Co., Ltd.Inventors: Byeong Kyun Choi, Jae Won Seo, Sung Ho Choo
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Patent number: 8022415Abstract: Discussed is an LED package The LED package includes a body having a cavity at one side thereof, at least one of lead frames having a bottom frame and a sidewall frame in the cavity, and a light emitting device electrically connected with the lead frames.Type: GrantFiled: November 16, 2010Date of Patent: September 20, 2011Assignee: LG Innotek Co., Ltd.Inventors: Sung Min Kong, Choong Youl Kim, Hee Seok Choi
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Patent number: 8106404Abstract: Disclosed is a semiconductor light emitting device. The semiconductor light emitting device includes a plurality of compound semiconductor layers including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer; a dot type conductive layer on the compound semiconductor layers; and an electrode layer on the dot type conductive layer.Type: GrantFiled: November 19, 2009Date of Patent: January 31, 2012Assignee: LG Innotek Co., Ltd.Inventor: Jung Hyeok Bae
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Patent number: 8610144Abstract: A semiconductor light emitting device that includes a first conductive type semiconductor layer, a first electrode, a insulating layer, and an electrode layer. The first electrode has at least one branch on the first conductive type semiconductor layer. The insulating layer is disposed on the first electrode. The electrode layer is disposed on the insulating layer.Type: GrantFiled: December 23, 2009Date of Patent: December 17, 2013Assignee: LG Innotek Co., Ltd.Inventors: Woo Sik Lim, Sung Ho Choo
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Patent number: 7858993Abstract: Disclosed is an LED package. The LED package comprises a body comprising a cavity at one side thereof, at least one of lead frames comprising a bottom frame and a sidewall frame in the cavity, and a light emitting device electrically connected with the lead frames.Type: GrantFiled: April 17, 2008Date of Patent: December 28, 2010Assignee: LG Innotek Co., Ltd.Inventors: Sung Min Kong, Choong Youl Kim, Hee Seok Choi
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Publication number: 20140054622Abstract: The present invention discloses a light emitting package, including: a base; a light emitting device on the base; an electrical circuit layer electrically connected to the light emitting device; a screen member having an opening and disposed on the base adjacent to the light emitting device; and a lens covering the light emitting device, wherein a width of a cross-sectional shape of the screen member is larger than a height of the cross sectional shape of the screen member, wherein the lens is disposed on the screen member, and wherein the lens is connected to an uppermost surface of the screen member.Type: ApplicationFiled: October 29, 2013Publication date: February 27, 2014Applicant: LG INNOTEK CO., LTD.Inventor: Jun Seok PARK
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Patent number: 8299474Abstract: Disclosed is an LED package. The LED package includes a package body, a semiconductor light emitting device on the package body and at least one of frames on the package body. At least one of the frames includes a bottom frame on the package body, and at least two sidewall frames extending from the bottom frame and inclined with respect to the bottom frame.Type: GrantFiled: December 30, 2011Date of Patent: October 30, 2012Assignee: LG Innotek Co., Ltd.Inventors: Sung Min Kong, Choong Youl Kim, Hee Seok Choi
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Patent number: 8008098Abstract: A method of manufacturing a light emitting device is provided. An epitaxial layer is first formed at a plurality of separated regions on a substrate and a second electrode layer is formed on the epitaxial layer. Subsequently, the substrate is removed from the epitaxial layer and a first electrode layer is formed under the epitaxial layer, after which the second electrode layer is divided into chip units.Type: GrantFiled: July 17, 2008Date of Patent: August 30, 2011Assignee: LG Innotek Co., Ltd.Inventor: Hwan Hee Jeong
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Patent number: 10809596Abstract: An embodiment may have a substrate (110) including a predetermined cavity (C); a plurality of light emitting chips (120) spaced apart from the cavity (C) of the substrate (110); a frame (130), disposed on the substrate (110) including a support portion (132) and a guide portion (134) including a predetermined through hole (H1); and a lens unit (140) disposed in the through hole (H1) of the guide portion (134).Type: GrantFiled: May 19, 2017Date of Patent: October 20, 2020Assignee: LG Innotek Co., Ltd.Inventors: Jong Beom Choi, Tae Sung Lee, Min Ji Jin
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Patent number: 8269224Abstract: Disclosed are a light emitting device and a method for manufacturing the same. The light emitting device includes a substrate having a lead frame, a light emitting diode mounted on the substrate, a mold member formed on the substrate and the light emitting diode, and a reflecting member having an opening portion at one side thereof and being inclined at an outer portion of the mold member.Type: GrantFiled: December 9, 2010Date of Patent: September 18, 2012Assignee: LG Innotek Co., Ltd.Inventor: Bo Geun Park
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Patent number: 8148740Abstract: Provided are a semiconductor light emitting device and a method of manufacturing the same. The semiconductor light emitting layer comprises a first conductive type semiconductor layer, an active layer on the first conductive type semiconductor layer, and a second conductive type semiconductor layer on the active layer. The active layer comprises a quantum well layer, a quantum barrier layer, and a dual barrier layer.Type: GrantFiled: November 8, 2010Date of Patent: April 3, 2012Assignee: LG Innotek Co., Ltd.Inventors: Tae Yun Kim, Hyo Kun Son