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  • INTEGRATED CIRCUITS ON A WAFER AND METHOD OF PRODUCING INTEGRATED CIRCUITS
    Publication number: 20100155967
    Abstract: Integrated circuits (Ia, Ib) on a wafer (2) comprise first and second integrated circuits (Ia, Ib) which each include an electric circuit (3). Only the first integrated circuits (Ia) comprise each at least one bump (8) not contacting their relevant electric circuits (3).
    Type: Application
    Filed: July 10, 2008
    Publication date: June 24, 2010
    Applicant: NXP B.V.
    Inventor: Heimo Scheucher
  • Integrated circuits on a wafer and method of producing integrated circuits
    Patent number: 8264092
    Abstract: Integrated circuits (Ia, Ib) on a wafer (2) comprise first and second integrated circuits (Ia, Ib) which each include an electric circuit (3). Only the first integrated circuits (Ia) comprise each at least one bump (8) not contacting their relevant electric circuits (3).
    Type: Grant
    Filed: July 10, 2008
    Date of Patent: September 11, 2012
    Assignee: NXP B.V.
    Inventor: Heimo Scheucher