Abstract: A printed circuit board includes a laminate substrate. The laminate substrate includes catalytic material that resists metal plating except where a surface of the catalytic material is ablated. Metal traces are formed within in trace channels within the laminate substrate. The channels extend below the surface of the catalytic material.
Type:
Grant
Filed:
May 19, 2014
Date of Patent:
June 28, 2016
Assignee:
Sierra Circuits, Inc.
Inventors:
Konstantine Karavakis, Kenneth S. Bahl, Steve Carney