Abstract: The present invention relates to metal foil encapsulation of an electrochemical device. The metal foil encapsulation may also provide contact tabs for the electrochemical device. The present invention may also include a selectively conductive bonding layer between a contact and a cell structure.
Type:
Grant
Filed:
April 21, 2010
Date of Patent:
March 26, 2013
Assignee:
Infinite Power Solutions, Inc.
Inventors:
Shawn W. Snyder, Bernd J. Neudecker, Paul C. Brantner
Abstract: The present invention relates to metal foil encapsulation of an electrochemical device. The metal foil encapsulation may also provide contact tabs for the electrochemical device. The present invention may also include a selectively conductive bonding layer between a contact and a cell structure.
Type:
Grant
Filed:
March 16, 2007
Date of Patent:
August 7, 2012
Assignee:
Infinite Power Solutions, Inc.
Inventors:
Shawn W. Snyder, Bernd J. Neudecker, Paul C. Brantner
Abstract: The present invention relates to metal film encapsulation of an electrochemical device. The metal film encapsulation may provide contact tabs for the electrochemical device. The present invention may also include a selectively conductive bonding layer between a contact and a cell structure. The present invention may further include ways of providing heat and pressure resilience to the bonding layer and improving the robustness of the protection for the cell structure.
Type:
Grant
Filed:
April 29, 2008
Date of Patent:
March 12, 2013
Assignee:
Infinite Power Solutions, Inc.
Inventors:
Shawn W. Snyder, Paul C. Brantner, Joseph A. Keating, Timothy N. Bradow, Prativadi B. Narayan, Bernd J. Neudecker