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  • Metal film encapsulation
    Patent number: 8404376
    Abstract: The present invention relates to metal foil encapsulation of an electrochemical device. The metal foil encapsulation may also provide contact tabs for the electrochemical device. The present invention may also include a selectively conductive bonding layer between a contact and a cell structure.
    Type: Grant
    Filed: April 21, 2010
    Date of Patent: March 26, 2013
    Assignee: Infinite Power Solutions, Inc.
    Inventors: Shawn W. Snyder, Bernd J. Neudecker, Paul C. Brantner
  • Metal film encapsulation
    Patent number: 8236443
    Abstract: The present invention relates to metal foil encapsulation of an electrochemical device. The metal foil encapsulation may also provide contact tabs for the electrochemical device. The present invention may also include a selectively conductive bonding layer between a contact and a cell structure.
    Type: Grant
    Filed: March 16, 2007
    Date of Patent: August 7, 2012
    Assignee: Infinite Power Solutions, Inc.
    Inventors: Shawn W. Snyder, Bernd J. Neudecker, Paul C. Brantner
  • Robust metal film encapsulation
    Patent number: 8394522
    Abstract: The present invention relates to metal film encapsulation of an electrochemical device. The metal film encapsulation may provide contact tabs for the electrochemical device. The present invention may also include a selectively conductive bonding layer between a contact and a cell structure. The present invention may further include ways of providing heat and pressure resilience to the bonding layer and improving the robustness of the protection for the cell structure.
    Type: Grant
    Filed: April 29, 2008
    Date of Patent: March 12, 2013
    Assignee: Infinite Power Solutions, Inc.
    Inventors: Shawn W. Snyder, Paul C. Brantner, Joseph A. Keating, Timothy N. Bradow, Prativadi B. Narayan, Bernd J. Neudecker