Abstract: An instrument pickup including a stack of thin laminated printed circuit boards. Each layer includes an etched coil conductor structure with narrow lines and spaces defining the coil structure. The layers are connected via through holes. The etched lines are smaller than the insulated copper wire (also sometimes called magnetic wire) of a conventional instrument pickup, which means that the size, volume and/or height of the pickup may be reduced relative to a conventional wire wound instrument pickup.

Abstract: An instrument pickup including a stack of thin laminated printed circuit boards. Each layer includes an etched coil conductor structure with narrow lines and spaces defining the coil structure. The layers are connected via through holes. The etched lines are smaller than the insulated copper wire (also sometimes called magnetic wire) of a conventional instrument pickup, which means that the size, volume and/or height of the pickup may be reduced relative to a conventional wire wound instrument pickup.

Abstract: Various improvements and configurations for magnetic musical instrument pickups. Many of the embodiments discussed herein include printed circuit board (pcb) coils, but other embodiments may involve conventional wire wound coils. In some embodiments, the coils (pcb and/or wire wound) are encased in rigid encasement material (see DEFINITIONS section) to reduce microphony and make a quieter pickup. Also, the use of pcb coils allows for many and various new coil shapes and/or configurations because the footprint and stacking of pcb traces are relatively easy to control and/or change. Also disclosed are electromagnetic field interference reduction techniques and integration of multiple coils directly into a single pcb substrate and/or scratchpate. Also disclosed is the use of Hallbach biasing magnet arrays in connection with wire wound and/or pcb coils.