Abstract: A method of packaging a device and an apparatus formed by the method. According to one embodiment, the apparatus includes a base connected to the device, and a cover. The cover includes an injection molded plastic body and at least one electrically conductive lead. The body of the cover is connected to the base such that the device is enclosed by the cover, and the electrically conductive lead includes an exposed portion that is electrically connected to the device.

Abstract: A semiconductor chip includes a first integrated circuit chip and a depression substrate attached to the integrated circuit chip, wherein the integrated circuit chip and the depression substrate define a cavity therebetween. The semiconductor chip also includes a stress sensitive material located in the cavity and a chemical located in the cavity, wherein detection of tampering causes a reaction by the chemical such that the semiconductor chip is at least partially destroyed.

Abstract: A method of fabricating an electronic circuit including forming a first depression on a first surface of a first wafer and forming a second depression on the first surface of the first wafer. The second depression is adjacent the first depression and separated from the first depression by a wall. The method further includes locating an actuator on the wall and attaching a first surface of a second wafer to the first surface of the first wafer to cover the first and second depressions. A first portion of the second wafer and the first depression define a first reservoir to contain a first chemical, and a second portion of the second wafer and the second depression define a second reservoir to contain a second chemical.