Abstract: A coupler circuit that includes two parallel coupled transmission lines (first transmission line and second transmission line) and a third transmission line, one end of the third transmission line connects to the end of first transmission line at one side, the other end of the third transmission line connects to the end of the second transmission line at the other side. Various coupling value and impedance transforming ratio can be achieved by select corresponding even and odd mode impedance of the coupled transmission lines and characteristic impedance of the crossing transmission line.

Abstract: A coupler circuit that includes two parallel coupled transmission lines (first transmission line and second transmission line) and a third transmission line, one end of the third transmission line connects to the end of first transmission line at one side, the other end of the third transmission line connects to the end of the second transmission line at the other side. Various coupling value and impedance transforming ratio can be achieved by select corresponding even and odd mode impedance of the coupled transmission lines and characteristic impedance of the crossing transmission line.

Abstract: The present invention is directed to a coupler that includes a coupler structure including at least one first transmission line disposed on a first major surface of a coupler dielectric substrate and at least one second transmission line disposed on a second major surface of the coupler dielectric substrate. The coupler structure includes four symmetric ports such that each port of the four symmetric ports is characterized by substantially identical impedance characteristics. A first ground plane structure is coupled to the coupler structure and including a first outer dielectric material and a first conductive exterior layer disposed substantially parallel to the first major surface. A second ground plane structure is coupled to the coupler structure and including a second outer dielectric material and a second conductive exterior layer disposed substantially parallel to the second major surface.

Abstract: The present invention is directed to a method for making a hybrid material stripline device. The method includes providing an inner layer of material, the inner layer including a dielectric material and at least one conductive sheet. At least one stripline device is formed in the inner layer by processing the at least one conductive sheet. The at least one stripline device is characterized by a surface area footprint. A first exterior layer and a second exterior layer are provided. At least one of the first exterior layer and/or the second exterior layer includes at least one ceramic portion. The at least one ceramic portion has a ceramic surface area greater than or substantially equal to the surface area footprint of the at least one stripline device. At least one of the first exterior layer and/or the second exterior layer further includes a softboard dielectric material. The inner layer of material is sandwiched between the first exterior layer and the second exterior layer.