Abstract: An IC package including one or more z-axis interconnects for performing at least in part the fan-in/fan out interconnection for electrically coupling contacts of semiconductor die to external contacts of the package. The z-axis interconnect comprises a matrix of electrically conducting elements extending from the top to the bottom surface of the interconnect. Each conductive element is internally insulated from other conductive elements of the matrix. The semiconductor contacts may be electrically coupled to separate portions of the matrix by way of electrical connections to the top of the z-axis interconnect. Similarly, the external contacts of the package may be electrically coupled to the same separate portions of the matrix by way electrical connections to the bottom of the interconnect. The z-axis interconnect improves the miniaturization, integration, thermal and electrical performance of IC packages.

Abstract: A toggling punch for attaching a waveguide entry spinning to a waveguide entry panel wherein the cylindrical body portion of the waveguide entry spinning is deformed outwardly over the waveguide entry panel by means of a plurality of inclined movable pins which are moved to their crimping positions by means of a hydraulic cylinder operatively connected thereto.

Abstract: A method for irrigating and fertilizing rice using a sprinkler irrigation system. The method includes the steps of providing a sprinkler irrigation system, determining an amount of water to be applied to the rice, determining an amount of fertilizer to be applied to the rice, and applying the water and fertilizer to the rice through the sprinkler irrigation system. Depending upon rainfall, the irrigation water may be applied to the rice an average of about one to two times per week between its planting and emergence, about two to three times per week between its emergence and its panicle initiation stage, about three to five times per week between its panicle initiation stage and its initial ripening stage, and about three to four times per week between the rice's initial ripening stage and its harvest.

Abstract: In one aspect of watercraft automation and aquatic data utilization for aquatic efforts, an anchor point is obtained and a watercraft position maintenance routine is actuated to control the watercraft to maintain association with the anchor point. In another aspect, prior aquatic effort data is obtained in association with an anchor point. In yet another aspect, current aquatic effort data is generated in association with an anchor point. In still another aspect, current aquatic effort data and prior aquatic effort data are utilized for prediction generation. In yet another aspect, current aquatic effort data and prior aquatic effort data are utilized to obtain another anchor point for a watercraft.

Abstract: An apparatus for use in mass spectrometry comprising an injector body, an injection tube coupled to the injector body, and a shielding assembly disposed between the injector body and the injection tube. The shielding apparatus is suitable for shielding the injector body from heat generated by a plasma source.

Abstract: The application relates to a sprayable cooking composition having enhanced high heat performance. The cooking composition includes cottonseed oil, a crystal inhibitor, and a cookware release agent and does not polymerize at high cooking temperature, or exhibits reduced polymerization and/or browning at high cooking temperature.

Abstract: An integrated circuit including solder balls containing an elastic or resilient material core, a hard or rigid shell substantially enclosing the core, and an electrical contact layer substantially enclosing the shell. The elastic or resilient core serves as a stress buffer layer in a wafer level package (WLP) integrated circuit. The elastic or resilient material core may include an organic plastic material, such as a Divinilbenzene cross-linked co-polymer of relatively high resistance. This material has a relatively good elongation property so that it can effectively absorb forces exerted upon the integrated circuit by, for example, the flexing of a printed circuit board (PCB) or other structure to which the integrated circuit is attached. The hard or rigid shell serves to contain the elastic or resilient core and may include copper. The electrical contact layer serve to provide a good adhesive electrical contact to an under bump metallization (UBM) layer, may include a lead free, Tin-Gold (SnAg) material.

Abstract: An integrated circuit (IC) package is disclosed comprising a substrate including a plurality of substrate contacts; a semiconductor die including a plurality of die contacts; and a plurality of conductors for providing direct connections between substrate contacts and die contacts, respectively. By having the conductors directly route the connections between the die contacts and substrate contacts, many improvements may be realized including, but not limited to, improved package routing capabilities, reduced die and/or package size, improved package reliability, improved current handling capacity, improved speed, improved thermal performance, and lower costs.