Abstract: Improvement of the ability to detect selected resonant frequencies associated with the position of the piston in a piston position sensing system using electromagnetic waves in the fluid in a hydraulic cylinder is achieved by positioning the electric signal input and output probes with 90 degree separation around the circumferential periphery of the cylinder to suppress coupling into unwanted modes that diminish detectability of particular resonant frequency signals, In a coaxial sensing system "dummy" probes at 90 degree separation to each other and 90 degree separation to the input and output probes operate to improve symmetry and resonance shape and to suppress unwanted modes.

Abstract: Dynamic gain adjustment in hydraulic piston position sensing that continuously accommodates for changes in signal level is provided by attenuating the gain of the sensing system through a comparison of a measured value with a stored value at each piston position.

Abstract: The invention employs a post type fastening member that provides, at one end, an insertion friction connection to the circuit card and at the other end, extending through the heat sink, a compression spring means that urges the heat sink toward the circuit card. A plurality of the post type fasteners are positioned around the periphery of the chip package to retain the heat sink parallel to the circuit card and compressing the chip package. The packaging structure of the invention permits larger area heat sinks than the chip package area to be supported by the circuit card with the only relationship with the chip being that of a compression thermal transfer contact and radiation shield.

Abstract: A coaxial capacitor contacting and sealing structure, for electrical continuity between parts that move in relation to each other at the ends of a cavity within a hydraulic cylinder employing electromagnetic wave position sensing. The structure employs a contacting and sealing member having a high surface conductivity that is mounted in one of the parts. The mounting of the contacting and sealing member provides force for pressure contact in oil between the parts and to enhance electrical continuity with the part in which the contacting and sealing member is located.

Abstract: A pad on pad type contact, and technology therefor, for electronic apparatus wherein a spring member, that by its shape and material in the motion when the contact comes together wipes the mating pad surfaces across each other and then retains them under permanent compressive force in service. In high density and high performance electronic apparatus interwiring, array quantities of the spring member of contact are fabricated in unitary assembly elements for connection assemblies between both rigid and flexible type wiring.

Abstract: The invention is a convertible display computer structure in which the display is centrally pivoted in a frame that in turn is hinged on one side on the keyboard so that the display can be positioned to face toward the user when the frame is positioned to be essentially vertical with respect to the keyboard and when it is desired to provide graphic information entry, the display can be turned over so as to serve as a writing surface when the hinged frame is positioned over the keyboard. The conversion from keyboard to graphic stylus input is accomplished by rotating the display on the pivot mountings and then closing the frame over the keyboard with the display surface up and in the proper orientation.

Abstract: A contacting and sealing structure, for electrical continuity, noise reduction and leakage reduction between parts that move in relation to each other at the ends of the cavity within a hydraulic cylinder employing electromagnetic wave position sensing, is provided by employing two springs having garter and canted coil spring functions that are retained in side by side grooves in one of the parts so that the spring coils extend directly across the intersection of the parts.

Abstract: A microwave processing system is provided wherein the material to be processed is in the form of a web type quantity configuration with a thickness that is small in relation to the wavelength of a particular microwave frequency. The material is passed through the field associated with a plurality of microwave standing waves of the particular frequency, each adjacent standing wave being offset 1/4 wavelength along the direction of movement of the web. A carrier gas removes volatile solvents from the material surfaces. Control is provided for the interrelationship of temperature, rate of movement, flow of carrier gas, and microwave power.

Abstract: An optical subassembly for transferring light between an optoelectronic converter and an optical fiber where the housing and the lens are of plastic in which the housing is made to dimensions within the precision of molded plastic and the lens imparts focusing properties that compensate for the limitations of the plastic technology. Alignment in the X-Y plane only is employed. The lens has a first surface focused on the optoelectronic converter which substantially collimates the light through the lens and a second surface that introduces deliberate longitudinal spherical aberration that compensates for component position. Attachment or fixing of the optoelectronic converter to the housing is accomplished by RF heating a TO can to quickly cure an epoxylayer.

Abstract: An optical subassembly for transferring light between an optoelectronic converter and an optical fiber where the housing and the lens are of plastic in which the housing is made to dimensions within the precision of molded plastic and the lens imparts focusing properties that compensate for the limitations of the plastic technology. Alignment in the X-Y plane only is employed. The lens has a first surface focused on the optoelectronic converter which substantially collimates the light through the lens and a second surface that introduces deliberate longitudinal spherical aberration that compensates for component position. Attachment or fixing of the optoelectronic converter to the housing is accomplished by RF heating a TO can to quickly cure an epoxylayer.

Abstract: The system employing and the processing of, an indirectly sensed signal representative of a periodic noise acoustic wave into an input signal for a noise cancelling system where the indirectly sensed signal is converted into a pulse signal per period that carries fundamental and harmonic frequency information of the periodic noise. A tachometer type RPM signal is processed in a counter circuit controlled by a logic circuit to produce a signal of one pulse per revolution with a controlled duration, the pulse amplitude is adjusted, the pulses are low pass filtered and any D.C. is blocked from the noise cancelling system input.

Abstract: A process of providing an external wiring and connecting package for a semiconductor chip wherein the chip is a major contributor to the strength of the package. External contacts and wiring are provided by a multilayer wiring member that may include a mesh ground plane with embedded power bus layer over a conductor layer for expansion mismatch control and impedance control, a protective encapsulation covers the bonds from the wiring conductors to the chip, and external contact connections employ fused metal through the contact members.

Abstract: An image projection system for all surfaces of a three dimensional object such as a polyhedron in which direct and angle reflected image patterns are projected from superpositioned non-overlapping mask patterns mounted on different levels where the separation of the levels is related to the size of the object. The apparatus and process permits simultaneous photolithigraphic printing of conductors on the top and all sides of a cube shaped stack of integrated circuit chips.

Abstract: A semiconductor chip package wherein the chip is a major contributor to the strength of the package. External contacts and wiring are provided by a multilayer wiring member that has a mesh ground plane with embedded power bus layer over a conductor layer for expansion mismatch control and impedance control, a protective encapsulation covers the bonds from the wiring conductors to the chip, and external contact connections employ fused metal through the contact members.

Abstract: An interconnecting structure in which circuit and componentry bearing cards are retained in contact with an intermediate card that has component and circuitry areas, and socket insertion contacts.

Abstract: A conductor attachment wherein each conductor is mounted on a dielectric tape and has an attachment portion that is supported by the tape to an adjacent location a uniform distance from the bonding location and that contacts on a level with the plane of the underside of the tape. One conductor supporting tape has portions of the tape that extend into a central contacting area opening to contact locations at contacting pads in rows remote from the edge. Another supporting tape has window openings at the contacting locations. The conductor ends are brought into the level of the underside of the tape by a manufacturing rolling operation between an elastomer surface roller and a solid backing roller.

Abstract: A controlled impedance power and distribution network wherein -x- and -y- direction planes of interpositioned power and signal conductors with a dielectric layer between planes and separating each plane from a ground plane are assembled. The network provides the ability to distribute many power levels with all power and signal conductors electrically referenced to ground along their length and each signal conductor also electrically referenced to its respective power level along its length. The network is of particular advantage in the TFM technology in distributing multiple power levels with fewer layers.

Abstract: In joining conductors at different levels on a carrier to contact locations on a planar substrate, mound shaped connections are employed, with the height of each mound shaped connection extending to the level of the particular conductor to which it is bonded. The mound shaped connections are formed using planar processes of controlled volume deposition, surface tension shaping on reflow, and physical deformation. The height of the mound shaped connections are calculated empirically from the volume deposited bounded by the substrate pad after surface tension limits the slump on reflowing.

Abstract: A contact member for thermocompression bonding in integrated circuit packaging has on a conductor end a uniform texture deformable layer with a hardness value in the range of that of soft gold which is approximately 90 on the Knoop scale and with a rough surface morphology having ridges with approximately 1 micrometer modulation frequency and a depth between ridges of from 1/4 to 1/2 that of the average integrated circuit pad. The deformable layer is produced by plating gold in a strong electronegative plating bath within a range of 0.03 to 0.05 mA/sq.mm. current density. Plating apparatus, for plating different areas, with different electronegative conditions, with separate independently powered anodes, is provided.

Abstract: A conductor attachment wherein each conductor is mounted on a dielectric tape and has an attachment portion that is supported by the tape to an adjacent location a uniform distance from the bonding location and that contacts on a level with the plane of the underside of the tape. One conductor supporting tape has portions of the tape that extend into a central contacting area opening to contact locations at contacting pads in rows remote from the edge. Another supporting tape has window openings at the contacting locations. The conductor ends are brought into the level of the underside of the tape by a manufacturing rolling operation between an elastomer surface roller and a solid backing roller.