Abstract: Method, system and program products for screening a program of a computing environment for debug processing are presented which employ a table that contains information identifying at least some program areas of storage of the computing environment where programs to be debugged may reside and information identifying programs of the computing environment to be excluded from debugging. After detecting a debug trigger point during execution of a program, screening is accomplished by referencing the table to first ascertain whether the trigger point is within a program area of storage meaning that the program under execution may comprise an application program to be debugged, and if so, referencing the table to determine whether the program has been explicitly excluded from the debug processing. If not excluded, debug processing may proceed.

Abstract: A cooling system is provided for cooling a heat generating component of an electronic device. The cooling system includes at least two cooling subsystems for a staged reduction of the temperature of a cooling fluid exposed to heat generated by the heat generated component. A first stage cooling subsystem reduces the temperature of the cooling fluid to ambient temperature or above, while a second stage cooling subsystem reduces the temperature of the cooling fluid exiting the first stage cooling subsystem to below ambient temperature. The first stage cooling subsystem is passive while the second stage cooling subsystem is active and can include one or more thermoelectric modules.

Abstract: A cooling system and method of fabrication are provided for cooling a heat-generating electronic element within a portable computer. The cooling system includes a cold plate assembly coupled to a heat-generating electronic element, and a heat exchange assembly disposed within the cover of the portable computer. The heat exchange assembly includes a hollow channel for carrying coolant, as well as a thermally conductive plate and air-cooled fins. The hollow channel is coupled to one main surface of the plate, while the air-cooled fins are coupled to an opposite main surface of the plate. A conduit carries coolant between the cold plate assembly and the hollow channel of the heat exchange assembly, and a circulation pump circulates coolant through the conduit between the cold plate assembly and the heat exchange assembly in a manner to remove heat from the heat-generating electronic component.

Abstract: Changes in locking configurations are managed. A locking configuration includes one or more locking facilities and the one or more locking facilities include one or more locks. When a change in a locking configuration, either planned or unplanned, is detected, one or more of the locks are redistributed. For example, one or more of the locks affected by the change are moved from one or more of the locking facilities to one or more other locking facilities. This redistribution is independent of the location of the data associated with the one or more locks being moved. Thus, data and locks may be moved independently of one another and without affecting one another. Further, the redistribution can take place while the system is available or mostly available, thereby minimizing downtime.

Abstract: To obtain connector connecting structure that makes it easy to connect connectors when a mounted part is mounted in a part-receiving part. In a keyboard unit mounted in a PC body of a notebook PC, a connector implemented on a flexible cable is movably supported through a cushion, which is made of urethane rubber and is fixed on a installation side 14B of the keyboard unit, and a support plate fixed to the cushion. Owing to this, by just mounting the keyboard unit in the PC body, the connector is connected to the connector in the PC body side, and hence connection becomes simple. Therefore, even if the misalignment between the connectors and arises, the connector moves according to an amount of the misalignment, and hence adequate connection can be performed.

Abstract: A server instance includes a first region to perform one or more privileged functions and a second region to perform one or more non-privileged functions. Thus, the privileged functions are separate from the non-privileged functions. The first region includes at least a portion of an object request broker, which is used in communicating with one or more clients coupled to the server instance. The second region executes non-privileged application code, and can be replicated within the server instance based on workload management criteria.

Abstract: A cooling system and method of fabrication are provided for cooling one or more heat-generating electronic elements within a portable computer. The cooling system includes a cold plate assembly thermally coupled to a heat-generating electronic element, and a heat exchange structure disposed within the cover of the portable computer. The heat exchange structure includes a hollow channel and an expansion chamber in fluid communication with the channel. A conduit carries coolant between the cold plate assembly and the hollow channel in the heat exchange structure, and a circulation pump circulates coolant through the conduit between the cold plate assembly and the heat exchange structure in a manner to remove heat from the heat-generating electronic component. The expansion chamber integrated within the heat exchange structure provides a reservoir for the circulation pump from which to draw coolant for circulation through the cold plate assembly.

Abstract: A set of management policies, selectable by the customer at object installation time, is used to manage one or more instances of an object. The set of policies includes at least one of an activation isolation policy, a passivation policy, a flush policy, and a refresh policy. The policies are managed by one or more containers of the computing environment.

Abstract: A heat exchanger using thermoelectric structures is provided for cooling a heat generating component of an electronic device. The heat exchanger includes a row of spaced passages, for example, formed by two or more separate tubes or a single coiled tube, for carrying a first cooling fluid. The heat exchanger further includes a thermoelectric structure disposed between adjacent spaced passages and exposed to a second cooling fluid. In one embodiment, the heat exchange also includes fins disposed between the same adjacent spaced passages so that the thermoelectric structure is disposed between the adjacent passages and the fins.

Abstract: Management functions typically performed by containers of a server instance are delegated to resource managers coupled to the server instance. For example, responsibility for such management functions as locking, security control, multisystem caching and commitment control are removed from the containers and delegated to the resource managers. This enables ongoing improvements and functional extensions provided in the underlying resource managers to be immediately leveraged transparently in the server instance.

Abstract: A transactional name server. One or more objects of the name server are managed as transactional objects, thereby providing a transactional name server. Atomic updates are provided in the name server by the addition of transactional semantics. The transactional semantics include making the objects of the name space managed objects and providing a local interface to a directory service that propagates a transactional context from the name server through a directory down to a resource manager.

Abstract: An electronic module and method of fabrication are provided employing an integrated thermal dissipation assembly. The thermal dissipation assembly includes a thermoelectric assembly configured to couple to an electronic device within the module for removing heat generated thereby, and a programmable power control circuit integrated with the thermoelectric assembly. The programmable power control circuit allows cooling capacity of the thermoelectric assembly to be tailored to anticipated heat dissipation of the electronic device by adjusting, for a given power source, voltage level to the thermoelectric elements of the thermoelectric assembly. Power to the thermoelectric assembly can be provided through conductive power planes disposed within a supporting substrate. The power control circuit includes one or more voltage boost circuits connected in series between the given power source and the thermoelectric elements of the associated thermoelectric assembly.

Abstract: The frequency at which a multisystem log stream is compressed by a system of a multisystem environment is adjusted in real-time. The rate at which the multisystem log stream is compressed by the system is ascertained. That rate is relative to how frequently the multisystem log stream is compressed by other systems of the multisystem environment. The frequency with which the system compresses the multisystem log stream is then adjusted in real-time. Thus, the frequency at which one system of the multisystem environment compresses the log stream is relative to the frequency at which other systems of the multisystem environment are compressing the log stream.

Abstract: Impingement plate and jet nozzle assemblies are presented for use in cooling an electronic module. The assemblies include a thermally conductive plate having a first main surface and a second main surface with a plurality of concave surface portions formed in the second main surface extending towards the first main surface. Each concave surface portion has a conic section profile. A plurality of jet nozzles are disposed above the thermally conductive plate with each jet nozzle being aligned over a respective concave surface portion, wherein fluid introduced into a concave surface portion through the respective jet it nozzle impinges upon a lower portion thereof and flows outward along the concave surface portion. Each conic section profile is one of an elliptical section, a circular section, or a parabolic section.

Abstract: The complexity of networks (e.g., I/O configurations) is determined. An entropy index is calculated for a plurality of possible networks and from that set of possible networks, a network is selected. This network typically has less entropy or complexity than the other possible networks.

Abstract: Resolution of a compound name of an object may indicate that a disjunction exists within the object name. This disjunction represents a foreign binding indicating that the resolve cannot be completed on one system or an alias name of the object. When a disjunction in the object name is identified, the object associated with the disjunction is obtained. Thereafter, a resolve operation on that object is performed using at least a portion of the object name.

Abstract: A composed business object of a server instance is provided. The server instance is coupled to a plurality of resource managers using a container of the server instance. A data object corresponding to the business object is populated with data retrieved using the plurality of resource managers. Thus, a business object is composed of data from multiple and/or diverse resource managers using a single container.

Abstract: An electronic module is provided having an integrated thermoelectric cooling assembly disposed therein coupled to the module's electronic device. The thermoelectric assembly includes one or more thermoelectric stages and a thermal space transformer, for example, disposed between a first thermoelectric stage and a second thermoelectric stage. The electronic device is mounted to a substrate with the thermoelectric assembly disposed in thermal contact with the electronic device and a thermally conductive cap is positioned over the thermoelectric assembly, and is also in thermal contact with the thermoelectric assembly. Power to the thermoelectric assembly can be provided using electrically conductive springs disposed between one or more stages of the assembly and pads on an upper surface of the substrate, which electrically connect to power planes disposed within the substrate.

Abstract: A capping structure and capping method are presented for an electronics package having a substrate and one or more electronics devices disposed on the substrate. The capping structure includes a capping plate sized to cover the electronics device(s) disposed on the substrate, and two or more force transfer pins. The force transfer pins are disposed between the capping plate and the substrate so that when a force is applied to the capping plate or the substrate, the force is transferred therebetween via the force transfer pins. Various capping plate and pin configurations are presented.

Abstract: Workload management of a computing environment is facilitated. A location service agent located within a server instance of the computing environment is used to facilitate workload management of the computing environment. The location service agent receives a request for an object of the computing environment. The location service agent then requests a workload manager of the server instance to determine which server instance of a plurality of server instances is to handle the request. The request is forwarded to the selected server instance using a direct reference.