Abstract: The frequency at which a multisystem log stream is compressed by a system of a multisystem environment is adjusted in real-time. The rate at which the multisystem log stream is compressed by the system is ascertained. That rate is relative to how frequently the multisystem log stream is compressed by other systems of the multisystem environment. The frequency with which the system compresses the multisystem log stream is then adjusted in real-time. Thus, the frequency at which one system of the multisystem environment compresses the log stream is relative to the frequency at which other systems of the multisystem environment are compressing the log stream.

Abstract: Cavity plate and jet nozzle assemblies are presented for use in cooling an electronic module. The assemblies include a cavity plate having one or more blind holes formed therein and one or more jet nozzles each configured to reside within a respective blind hole of the cavity plate. A lower surface of the blind hole and/or jet nozzle is curved to facilitate the flow of fluid from the blind hole after impinging upon the lower surface of the blind hole. Various jet nozzle configurations are also provided which employ pedestals or radially extending fins. Further, the radially extending fins may interdigitate with inwardly extending fins on the inner sidewall of a respective blind hole in the cavity plate. Methods of fabricating the cavity plate and jet nozzle assemblies are also presented.

Abstract: A thermal dissipation subassembly is provided for an electronic device. The subassembly includes a thermal spreader configured to thermally couple to a surface of a heat generating component of the electronic device. The heat generating component, e.g., an integrated circuit chip, has a non-uniform thermal distribution across the surface thereof between at least one first region of the surface and at least one second region of the surface, with the at least one first region having a higher heat flux than the at least one second region. The subassembly further includes at least one thermoelectric device aligned to at least a portion of each first region having the higher heat flux, wherein the at least one thermoelectric device facilitates dissipation of the higher heat flux. In one embodiment, one or more thermoelectric devices are embedded within the thermal spreader and thermally isolated therefrom.

Abstract: An object factory is registered under multiple interface names. The interface names have an inheritance relationship with an object implementation associated with the object factory. The names are registered in a repository of a name space, such as a Life Cycle Repository. Thus, an object factory can be located using any one of the interface names.

Abstract: A cooling system and method of fabrication are provided for cooling an electronics device. The cooling system includes a cooling unit and an evaporator plate having at least one isolated refrigerant loop therein for receiving coolant from the cooling unit. A thermal buffer unit having a phase change material therein is thermally coupled to the evaporator plate to maintain temperature of the evaporator plate within a predefined range for a period of time upon failure or shut down of the cooling unit. A thermal conductor structure, such as a metal foam structure and/or thermal transfer rods, is disposed within the thermal buffer unit to facilitate heat transfer between the phase change material and the evaporator plate.

Abstract: A thermal dissipation assembly is provided for an electronic device. The assembly includes a thermal spreader configured to thermally couple to a surface of a heat generating component of the electronic device. The heat generating component, e.g., an integrated circuit chip, has a non-uniform thermal distribution across a surface thereof between at least one first region of the surface and at least one second region of the surface, with the at least one first region having a higher heat flux than the at least one second region. The assembly further includes a thermal interface for attaching to the surface of the thermal spreader and aligning to contact a portion of the surface of the heat generating component when the thermal dissipation assembly is placed in contact therewith. The thermal interface is patterned to cover only a portion of the surface of the heat generating component to selectively thermally couple the thermal spreader to the surface of the heat generating component.

Abstract: Repositioning within an input/output device is accomplished without any knowledge of where the input/output device is currently positioned. The input/output device is repositioned to a predetermined position, in order for a program to be retried. The predetermined position is determined from a previously executed program. The previously executed program is scanned looking for commands. For each command found, a position identifier is adjusted based upon the type of command. When the scan and adjustments are complete, the position identifier represents the predetermined position used for repositioning the input/output device.

Abstract: Repositioning within an input/output device is accomplished without any knowledge of where the input/output device is currently positioned. The input/output device is repositioned to a predetermined position, in order for a program to be retried. The predetermined position is determined from a previously executed program. The previously executed program is scanned looking for commands. For each command found, a position identifier is adjusted based upon the type of command. When the scan and adjustments are complete, the position identifier represents the predetermined position used for repositioning the input/output device.

Abstract: Apparatus for cooling an electronic device, and a resultant fluid-cooled electronic apparatus are provided. In one embodiment, the apparatus includes a heat sink member with a surface for making thermal contact with the electronic device. The heat sink member has a first plurality of channels for carrying coolant fluid. The first plurality of channels are positioned in a first group and a second group such that coolant flow alternates across the member. The heat sink member further includes a second plurality of channels disposed above the first plurality of channels such that the first and second pluralities of channels comprise tiered channels. The second plurality of channels further includes a third group of channels and a fourth group of channels, wherein the third group of channels and fourth group of channels are positioned generally alternately across the member so that coolant flow also alternates direction therebetween.

Abstract: Repositioning within an input/output device is accomplished without any knowledge of where the input/output device is currently positioned. The input/output device is repositioned to a predetermined position, in order for a program to be retried. The predetermined position is determined from a previously executed program. The previously executed program is scanned looking for commands. For each command found, a position identifier is adjusted based upon the type of command. When the scan and adjustments are complete, the position identifier represents the predetermined position used for repositioning the input/output device.

Abstract: Apparatus for cooling an electronic device, and a resultant fluid-cooled electronic apparatus are provided. In one embodiment, the apparatus includes a heat sink member with a surface for making thermal contact with the electronic device. The heat sink member has a plurality of channels for carrying coolant fluid. The plurality of channels are positioned in a first group and a second group such that coolant flow alternates across the member. At least one cross-flow opening is provided between at least some adjacent channels of the plurality of channels so that coolant flow can flow within the member between the first group of channels and the second group of channels.

Abstract: The frequency at which a multisystem log stream is compressed by a system of a multisystem environment is adjusted in real-time. The rate at which the multisystem log stream is compressed by the system is ascertained. That rate is relative to how frequently the multisystem log stream is compressed by other systems of the multisystem environment. The frequency with which the system compresses the multisystem log stream is then adjusted in real-time. Thus, the frequency at which one system of the multisystem environment compresses the log stream is relative to the frequency at which other systems of the multisystem environment are compressing the log stream.

Abstract: Apparatus for cooling an electronic device, and a resultant fluid-cooled electronic apparatus are provided. In one embodiment, the apparatus includes a heat sink member with a surface for making thermal contact with the electronic device. The heat sink member has a plurality of channels for carrying coolant fluid. The plurality of channels are positioned in a first group and a second group such that coolant flow alternates across the member. At least one channel of the plurality of channels has a fluid flow cross-section that varies over a length thereof to selectively enhance a heat transfer coefficient of the coolant fluid within the channel and thereby produce a more uniform temperature at the surface of the heat sink member when making thermal contact with the electronic device.

Abstract: A thermosyphon system is employed in conjunction with compact and/or dense configurations of electrical and/or electronic components to provide cooling. The thermosyphon cooling system is particularly advantageous in those systems in which the compact arrangement of circuit modules precludes the use of direct air cooling. The thermosyphon cooling system repositions the air cooling aspect of its cooling function to an exterior cabinet location distant from the circuit modules which can therefore be placed more closely together to shorten signal paths.