Abstract: A computer system (10) and method for automating manufacture of a photomask. The computer system (10) has a product database (21) that stores information used to manufacture the photomask. In addition, a semiconductor device is manufactured using the information stored in the product database (21). The information is transmitted to the product database (21) from semiconductor satellite systems such as a fabrication facility (14), a first mask shop (12), and a second mask shop (13). The computer system (10) chooses a mask shop for producing the photomask by using the information transmitted form the first mask shop (12) and the second mask shop (13).

Abstract: A transconductance amplifier (67) includes a multiple-stage amplifier (99) for amplifying an Intermediate Frequency (IF) signal. The transconductance amplifier includes a feedback path (103) having a resistance (105) for providing a feedback signal from an output of the multiple-stage amplifier (99) to an input of the multiple-stage amplifier (99). The resistance (105) of the feedback path (103) is selected so that an input impedance of the transconductance amplifier is equal to a source impedance at an input terminal (82) of the transconductance amplifier (67) and an output impedance of the transconductance amplifier (67) is equal to a load impedance at an output terminal (84) of the transconductance amplifier (67).

Abstract: An electronic component assembly (10) is formed by mounting an electronic component (15) to the leads (12) of a leadframe (18). The portions of the leadframe (18) that come in physical contact with the electronic component (15) are electrically connected to the electronic component with bonding wires (31) or by placing the bonding regions (30) of the electronic component (15) in direct physical contact with the tips (35) of the leads (12). A package (20) is used to encapsulate the leads (12) and the electronic component (15).

Abstract: A semiconductor component (31) and a method for coupling a semiconductor device (36) to a substrate (81). The semiconductor component (31) includes a saddle (34) and the semiconductor device (36). The saddle (34) has a plurality of sides (51, 52, 53, 54, 55) that form a semiconductor device receiving area (58). The semiconductor device (36) is inserted into the semiconductor device receiving area (58) and secured in the semiconductor device receiving area (58) using tabs (66, 67). The saddle (34) is coupled to the substrate (81) by fasteners (82,83).

Abstract: An apparatus and method are provided for removing gases produced during off-service cleaning of a processing chamber which operates under vacuum in a wafer fabrication tool. The apparatus includes a ventilation fixture providing a manifold having an internal cavity in fluid communication with a source of vacuum and at least one intake aperture, and a quick disconnect fitting connected to the source of vacuum and in fluid communication with the internal cavity. The manifold is portable and located adjacent to the processing chamber during cleaning.

Abstract: A two step wire bonding process is used to ultrasonically attach a wire (18) to a contact pad (13) on a semiconductor device (10). A first step is used to flatten a rounded tip (19) of the wire (18), and to start the bonding process. This is accomplished by applying a relatively large force to the rounded tip (19), and a relatively low vibrating displacement to the flattened wire tip (19). During a second step the large force is reduced, however; the vibrating displacement is increased. The total time for the two step wire bonding process is slightly less than a prior art one step process.

Abstract: A distributed airbag firing system (10) includes a controller (12) receiving sensor signals from a sensor (20) over a two-wire bus (18). The controller provides a firing command over to the two-wire bus to a squib driver circuit (26), which provides the firing current necessary to detonate a squib device (32) and inflate the airbag. The squib driver circuit includes a rectifier (42) with its first and second inputs interchangeably connected to the two-wire bus. The rectifier circuit converts the voltage orientation on the first and second conductors to a positive potential on a first output conductor and a negative or ground potential on a second output conductor. The interchangeability of the first and second inputs of the rectifier to the two-wire bus makes the connection arbitrary and fail-safe.

Abstract: A pickup tool (30) has reflective surfaces (42, 44, 46, 48) attached thereto. The pickup tool (30) picks up an object (38) and moves the object (38) over a light source (51). The reflective surfaces (42, 44, 46, 48) reflect a light beam (61) emitted from the light source (51), generating deflected light beams (63, 65, 67, 69) which back light the object (38). The deflected light beams (63, 65, 67, 69) form silhouette images of the object (38) in cameras (52, 54, 56, 58). A visual inspection of the object (38) is performed by analyzing the images.

Abstract: A serial communication device (10) and a method for serially communicating. The serial communication device (10) has a first transceiver (11) and a second transceiver (12) that send data to each other. The first transceiver (11) is capable of providing power or the operating potential to the second transceiver (12). The first transceiver (11) sends command data at a variable data rate to the second transceiver (12) using a voltage signal (30). The second transceiver (12) receives the command data and sends response data to the first transceiver (11) using a current signal (40).

Abstract: A Vertical Cavity Surface Emitting Laser (VCSEL) (10) and a method for manufacturing the VCSEL (10). The VCSEL (10) includes a ridge structure (34), a first confinement layer (36) disposed adjacent to a portion of the ridge structure (34), and a second confinement layer (37) disposed on the first confinement layer (36) and disposed adjacent to a portion of the ridge structure (32). Carriers injected into the ridge structure (34) are confined by the first confinement layer (36).

Abstract: A method and circuit for dynamically adjusting the supply voltage in a digital circuit determines the propagation delay of a signal along a signal path in the digital circuit and adjusts the supply voltage so that the determined propagation delay equals a predetermined period, such as the clock period of the clock signal which clocks the digital circuit. When the determined propagation delay equals the predetermined period, the adjusted supply voltage is applied to the digital circuit. This technique can be used to optimize power consumption and processing capability.

Abstract: An electronic assembly (20) having an insulated metal heat sink (10) and a method of manufacturing the electronic assembly (20). The electronic assembly (20) has a heat dissipater (11), a dielectric material (12), and a conductive layer (13). A semiconductor chip (21) is attached to the insulated metal heat sink (10). Heat generated by the semiconductor chip (21) is conducted to the conduction surface (14) of the heat dissipater (11). In one embodiment a convection surface (16) of the heat dissipater (11) is present and the heat is transferred from the convection surface (16) of the heat dissipater (11) to a fluid by convection. The fluid is directed by a manifold (64).

Abstract: A circuit (70) includes a reset stage (72) and a Phase-Locked Loop (PLL) device (73). The PLL device (73) includes a phase detector (74), a charge pump (75), a filter (76), and a Voltage-Controlled Oscillator (77). The reset stage (72) receives a reference signal and is connected to the phase detector (74). The phase detector (74) receives the reference signal and a feedback signal. When the reference signal switches from a first clock signal to a second clock signal, the reset stage (72) places the phase detector (74) in an inactive state until the reset stage (72) detects a falling edge in the reference signal.

Abstract: An electronic component includes a semiconductor substrate (101, 301, 401), an electrically conductive layer (102, 103, 302, 303, 402, 403) supported by the semiconductor substrate (101, 301, 401), and a lead (110, 120, 210, 310, 410, 420) having an electrical coupling portion (112, 122, 212, 312, 412, 422) coupled to and supported by the electrically conductive layer (102, 103, 302, 303, 402, 403) wherein the electrical coupling portion (112, 122, 212, 312, 412, 422) has at least one notch (115, 215, 315) adjacent to the electrically conductive layer (102, 103, 302, 303, 402, 403).

Abstract: An image rejection circuit (10) receives an incoming signal (RF.sub.IN) and an oscillator signal (V.sub.OSC) generated by a local oscillator (26). Output signals (I.sub.OUT20 and I.sub.OUT40) are generated by first mixer circuits (14 and 34) by multiplying the incoming signal (RF.sub.IN) with the oscillator signal (V.sub.OSC) Second mixer circuits (24 and 44) multiply the output signals (I.sub.OUT20 and I.sub.OUT40) with a counter signal that is a divided oscillator signal (V.sub.OSC). A summing circuit (46) sums the signals generated by the second mixer circuits (24 and 44) and provides a signal (IF.sub.OUT). Phase shift circuits (22, 29, 31, and 42) provide a shifted oscillator signal (V.sub.OSC) and a shifted counter signal to the first and second mixer circuits (14, 24, 34, and 44) that cause cancellation of unwanted image signals in the signal (IF.sub.OUT).

Abstract: A power cut detection and recovery system (36) provides for the recovery of an electronic apparatus (20) in response to a momentary interruption in the voltage level of a power supply (46) coupled to that apparatus. The system includes a level detecting circuit (80) coupled to the power supply (46) for monitoring the voltage supplied to the apparatus (20). The system further includes internal reference supply circuits (86) that provide voltage and current references to operate the apparatus (20). A power cut monitor and reference control circuit (84) is coupled to the level detecting circuit (80) and is capable of causing the internal reference supply circuits (86) to remain enabled upon the detection of a momentary cut in the externally supplied power (46).

Abstract: A circuit (30) and method for translating a spectrum of a modulated signal. The circuit (30) includes a mixer (33), a summing device (36), and a synthesizer (37). The circuit (30) receives and transmits modulated Radio Frequency (RF) signals. The synthesizer (37) generates a transmitter modulated RF signal (TX.sub.RF) using a modulating signal (TX.sub.MOD). The mixer (33) generates an intermediate frequency signal (IF) by mixing a receiver modulated RF signal (RX.sub.RF) with the transmitter modulated RF signal (TX.sub.RF). The summing device (36) removes modulation of the transmitter modulated RF signal (TX.sub.RF) by combining the intermediate frequency signal (IF) with the modulating signal (TX.sub.MOD).

Abstract: An integrated transceiver circuit (10) includes a single side-band mixer (12) and a phase locked loop (30). The phase locked loop (30) includes a phase detector (32) coupled to a voltage controlled oscillator (36) via a summing circuit (33) and a low pass filter (34). A feedback signal from the voltage controlled oscillator (36) is transferred to the phase detector (32) through a counter (38). Either a phase modulation signal or a frequency modulation signal are inputs of summing circuit (33) and modulate the transmitter carrier signal generated by the voltage controlled oscillator (36). The carrier signal generated at an output terminal (40) of the transmitter tracks the frequency of the local oscillator signal that is supplied at an input terminal of the single side-band mixer (12) in the receiver.

Abstract: A data converter (10) and a method for attenuating noise in an output signal generated by the data converter (10). The data converter (10) includes a sigma-delta modulator (16), a digital-to-analog converter (17), a clock generator (19) connected to the digital-to-analog converter (17), and a clock control circuit (18) connected to the clock generator (19). The clock control circuit (18) enables or disables the clock generator (19) in accordance with the single-bit digital signal to cause a notch characteristic in the output signal for attenuating noise in the output signal.

Abstract: A method of detecting defects (14, 16, 17, 44, 47, 49, and 51) in objects is presented. A first grey level image (18) of a first object (10) is formed and a second grey level image (19) of a second object (12) is formed. The first (18) and second (19) grey level images are converted to a first (21) and a second (22) edge feature image, respectively. The first edge feature image is dilated (26) and the second edge feature image is skeletonized (27). The dilated (26) and skeletonized images (27) are compared. An alternate method includes forming a grey level image (40) of an object. A principal axis of the grey level image is identified, and a shifted grey level image is formed by shifting the grey level image a distance along the principal axis. The grey level image (40) is then compared to the shifted grey level image.