Patents Represented by Attorney Arthi K. Tirey
  • Patent number: 6689200
    Abstract: Aqueous water repellent coating compositions comprising admixtures of (i) water-based water repellent compositions and (ii) water-reducible film-forming polymers are disclosed.
    Type: Grant
    Filed: July 25, 2002
    Date of Patent: February 10, 2004
    Assignee: The Sherwin-Williams Company
    Inventors: Victoria D. Scarborough, Timothy G. Teague, Cedric M. Wilson, Heath G. Saunders
  • Patent number: 6663467
    Abstract: An abrading composition and a process for abrading factory pre-finished surface coverings, wherein the abrading composition comprises an effective amount of wear-resistant particles, a rheology modifier, and a solvent. This invention further relates to a process to abrade wood floor surfaces and factory pre-finished wood floor surfaces, as well as a process for refinishing a factory pre-finished wood floor using the abrading composition.
    Type: Grant
    Filed: January 10, 2003
    Date of Patent: December 16, 2003
    Assignee: The Sherwin-Williams Company
    Inventors: George R. Mayerhauser, William J. Fernandez, Jr., Michael T. Triolo, Robert P. DeHart
  • Patent number: 6649687
    Abstract: A chemical resistant water reducible coating composition comprising: (i) an active hydrogen functional water dispersible polyurethane polymer; (ii) a crosslinking agent reactive with the active hydrogen functional polymer under curing conditions: (iii) a mixture of polymeric beads dispersed within the polymer wherein the mixture comprises: (a) polyolefin beads having a mean particle size as measured by laser diffraction analysis of about 5 to 40 microns; and (b) polyurea polymeric beads having a mean particle size of less than 15 microns wherein the mixture of polymeric beads is present at a level to provide an 85° gloss less than 3 and a 60° gloss less than 3.
    Type: Grant
    Filed: December 21, 2001
    Date of Patent: November 18, 2003
    Assignee: The Sherwin-Williams Company
    Inventors: Sunil C. Gheewala, Mark J. Wytiaz