Abstract: A coating for weatherstrips, windshield wipers, door seals, trunk seals, sunroof seals, windshield seals and the like. The coating comprises a water-based formula that provides high abrasion resistance and, optimally, also provides excellent weathering resistance. The abrasion resistance property is achieved via a combination of boron nitride and a high molecular weight silicone resin. Flexibility and weathering resistance are achieved via the addition of an acrylic/polyurethane/fluoropolymer resin binder blend and high UV-stabilizers and absorbers. Also provided is a method of manufacturing such coatings that comprises the steps of pre-dispersing the boron nitride in water and then combining the pre-dispersed boron nitride with the silicone resin and other ingredients.

Abstract: A cross-linkable and cross-linked organosilicon polymer which is prepared from a mixture of a reactive polysiloxane resin having both reactive carbon-carbon double bonds and silicone-hydrogen groups, characterized by alternating structures of polycyclic polyene residue and cyclic (or tetrahedral) polysiloxane residue, and either vinyl terminated fluorine-containing polysiloxane or vinyl terminated phenyl-substituted siloxane. In an alternative embodiment, the polymer comprises a mixture of vinyl terminated phenyl-substituted polysiloxane and vinyl functional fluorosilicone elastomer with the cross-linkable and cross linked organosilicon polymer.

Abstract: A cross-linkable and cross-linked organosilicon polymer which is prepared from a mixture of a reactive polysiloxane resin having both reactive carbon-carbon double bonds and silicone-hydrogen groups, characterized by alternating structures of polycyclic polyene residue and cyclic (or tetrahedral) polysiloxane residue, and either vinyl terminated fluorine-containing polysiloxane or vinyl terminated phenyl-substituted siloxane. In an alternative embodiment, the polymer comprises a mixture of vinyl terminated phenyl-substituted polysiloxane and vinyl functional fluorosilicone elastomer with the cross-linkable and cross linked organosilicon polymer. In an alternative embodiment, the polymer comprises vinyl functional polydimethyl siloxane, and preferably high molecular weight methyl divinyl siloxane, with or without phenyl substituted siloxane.

Abstract: High green strength reactive hot melt adhesives are prepared using relatively low levels of reactive acrylic, and may be prepared with one or more difunctionals having cyclic or polycyclic structures.

Abstract: High green strength reactive hot melt adhesives are prepared using crystalline monofunctional reactants.

Abstract: A composition that comprises a) an admixing of at least one epoxy resin and aliphatic amine wherein the ratio of epoxy function group/amine is greater than 1; b) a conductive filler; c) one or more corrosion inhibitors, oxygen scavengers or both; d) imidazole as a curing agent/catalyst; and e) optionally other additives such as organic solvents, flow additives, adhesion promoters and rheology modifiers. The reaction of epoxy and aliphatic amine with excess epoxy functionality results in a flexible resin with remaining active epoxy groups. The compositions exhibit improved electrical stability and impact resistance over other conductive adhesive compositions that do not comprise the admixture.

Abstract: A curable underfill encapsulant composition which is especially useful in the no-flow underfill encapsulation process. The composition contains an epoxy resin, a fluxing agent, a linear polyanhydride, a core shell polymer and a catalyst. In an alternative embodiment, the composition also contains a linear anhydride. Various additives, such as surfactants and coupling agents may also be added to the composition.

Abstract: The invention relates to a method for utilizing one or more B-stageable or pre-formed underfill encapsulant compositions in the application of electronic components, most commonly chip scale packages (CSP's) to substrates. One such composition comprises a thermoplastic resin system comprising a phenoxy resin, an expandable polymer sphere or thermosetting composition, optionally an epoxy resin such as higher molecular weight epoxy resin, a solvent, an imidazole-anhydride catalyst or comparable latent catalyst, and optionally, fluxing agents and/or wetting agents. The underfill encapsulant may be B-stageable to provide a coating on the substrate or component that is smooth and non-tacky. In an alternative embodiment, the underfill encapsulant is a pre-formed film. In both embodiments the expandable filler material expands upon the application of higher temperatures to form a closed-cell foam structure in the desired portion of the assembly.

Abstract: High green strength reactive hot melt adhesives are prepared using relatively low levels of reactive acrylic, and may be prepared with liquid crystalline or crystalline diols.

Abstract: A curable underfill encapsulant composition that is applied directly onto semiconductor wafers before the wafers are diced into individual chips. The composition comprises a thermally curable epoxy resin, a solvent, an imidazole-anhydride curing agent, fluxing agents, and optionally, wetting agents. Various other additives, such as defoaming agents, adhesion promoters, flow additives and rheology modifiers may also be added as desired. The underfill encapsulant is B-stageable to provide a coating on the wafer that is smooth, non-tacky and will allow the wafer to be cleanly diced into individual chips. A method for producing an electronic package containing the B-stageable material may also utilize an unfilled liquid curable fluxing material on the substrate to which the chip is to be attached.

Abstract: A composition which retards the spread of fire, protects assets at risk from fire damage and emits a material which aids in extinguishing the fire. The composition may be either in the form of a gel or a foam and may be used to protect any sort of object, such as personal property, real property or even humans, from fire. The gel form of the composition contains urea or a urea derivative that retains water and releases CO2 upon heating. In addition, a rheology modifier containing carboxyl groups is also employed. The foam form of the composition contains the urea or urea derivative and the rheology modifier, along with a foam generator such as sodium bicarbonate and citric acid. A method of retarding fire comprises the coating of an item with the fire retardant such that the retardant protects the item from the fire and aids in extinguishing the fire by releasing carbon dioxide.

Abstract: Versatile synthetic methodology has been established for the production of a variety of siloxane and silane-containing radial epoxy resins and intermediates. This chemical approach has been exploited to obtain a variety of hybrid organic/inorganic materials that can be described as epoxysiloxane or epoxysilane radial copolymers. The methodology can be used to access reactive, hydrophobic Si-containing resins with good organic compatibility that are structurally distinct from epoxy-functional siloxanes/silanes known in the prior art. These hybrid radial epoxy resins may be utilized for a variety of adhesive and coating applications including radiation and thermally curable sealants, encapsulants and adhesives.

Abstract: The present invention relates to a pressure sensitive fluxing underfill composition that may be pre-applied to electronic components, such as CSP's, in order to increase the reliability of the component against mechanical stresses such as impact and bending. The composition contains an epoxy resin, a solid anhydride curing agent, and catalyst. Other materials, such as air release agents and fillers, may also be added as desired. The composition may be applied selectively to parts of the CSP, for example to the solder bumps. The composition provides sufficient tack in order to hold the electronic assembly together during the assembly process.

Abstract: Hydraulic fixing agent that is based on Portland cement, a sulphate and aluminum component that is usual in this system, and optionally other additives. This is characterized in that, according to DIN 18156 (Part 2, Sec. 5.2.2.2, 5.2.2.3a) and 5.2.2.4), the hydraulic fixing agent has (1) an adhesive pull strength of at least approximately 0.15 N/mm2 when acted upon by water for 40 hours and (2) an adhesive pull strength of at most approximately 0.10 N/mmyy2 when acted upon by an aqueous sulphate solution and/or an aqueous solution of an aluminum salt, each of which has a pH value of 12.5, for a period of 40 hours.

Abstract: A method for utilizing one or more pre-formed underfill compositions in the application of surface mount components, most commonly chip scale packages (CSP's), to substrates for use in electronic devices. The pre-formed underfill of the invention is applied directly to the top and/or sides of the CSP before the reflow process and softens during reflow to flow across the circuit/board gap. One underfill composition utilized for this method comprises a thermoplastic film system that provides a coating on the component that is smooth and non-tacky. The film may be applied selectively to parts of the CSP such that it overhangs the top of the component and upon reflow flows over the edge of the CSP to form a connection with the substrate. A second pre-applied underfill composition or solder paste may be applied as an adhesive to provide sufficient tack in order to hold the electronic assembly together during the assembly process and to serve as a flux to facilitate solder wetting.

Abstract: The present invention is directed to a dispersion of polymer particles in a dispersing medium. The polymer particles each contain an average of more than two living radicals that are not chemically protected. The present invention is also directed to a free radical precipitation process involving combining at least one monomer in at least one solvent; dispersing said monomer solvent mixture in a dispersing medium that is non-miscible with the first solvent, using a surfactant, stabilizer or mixture thereof; initiating polymerization with at least one free-radical generating agent and conversion, to produce polymer particles containing radicals trapped by precipitation by virtue of being above the lower critical solution temperature of the system; and removing the precipitating agent either during or after free-radical generation to form a dispersion polymer in the dispersing medium having living, trapped radicals.

Abstract: A composition for use as a thermal interface material in a heat-generating electronic device is provided. The composition comprises a blend of nitrile rubber and carboxyl-terminated butadiene, carboxyl-terminated butadiene nitrile or a mixture thereof, and conductive filler particles.

Abstract: The present invention relates to a dispersion of polymer particles, the particle containing, on average, more than 1 living radicals each, the radicals not being chemically protected. The invention is also directed to a free radical polymerization process resulting in a dispersion containing polymer particles having on average one or more living radicals. The process involves carefully regulating the polymerization conditions to produce small size particles under monomer-starved conditions containing, on average, more than one living radical in every particle. These living polymer radicals can be further reacted to form polymers with a controlled architecture.

Abstract: A cross-linkable and cross-linked organosilicon polymer which is prepared from a mixture of a reactive polysiloxane resin having both reactive carbon-carbon double bonds and silicone-hydrogen groups, characterized by alternating structures of polycyclic polyene residue and cyclic (or tetrahedral) polysiloxane residue, and either vinyl terminated fluorine-containing polysiloxane or vinyl terminated phenyl-substituted siloxane. In an alternative embodiment, the polymer comprises a mixture of vinyl terminated phenyl-substituted polysiloxane and vinyl functional fluorosilicone elastomer with the cross-linkable and cross linked organosilicon polymer.

Abstract: The object of the invention is a redispersible material, particularly in powder form, which comprises a polymer containing silanol groups, the latter being provided with a protective group. The redispersible material can be in the form of a redispersible powder, an aqueous dispersion or an aqueous solution. The invention also makes available a process for the preparation of a redispersible material by reacting a silanol group-containing polymer with a compound having a protective function for the silanol groups, optionally with the subsequent recovery of a redispersible, pulverulent material from the polymer provided with the protective groups. The invention also relates to the use of the redispersible material in adhesives, plastic-containing, cement-bound systems, plastic-bound, cement-free binders, wallpaper pastes, disperse dyes, glass fibre composite systems, etc.