Abstract: A method for transmitting data over a data bus with minimized digital control and data inter-symbol interference. The voltage level on the data bus is not permitted to reach the quiescent negated voltage level set by the bus terminator voltage. Additional time is provided for data detection circuitry to detect a first segment of data transferred over the data bus. A pause time is enabled after the data bus has been idle or paused for a prolonged period. After the first segment of data has been transferred, the method returns to normal operation by pausing for a normal period of time for data detection circuitry to detect subsequent segments of data transferred over the data bus. Additionally, during prolonged synchronous data transfers with unchanged data bits, the data bus is inverted and driven for further regulating the data bus voltage.

Abstract: The present invention relates to a system for determining whether the flying height of a read/write head above a disk in a disk drive is within an acceptable range, in substantially real time. The system relies on variations in read signal resolution with flying height to make the determination. In one embodiment, read signal resolution is measured and compared to a predetermined threshold value to determine whether the present flying height is in the desired range. In another embodiment, the number of peaks in a read signal that are detected (and/or not detected) by a detector is used to determine whether the head is in the proper flying height range. Because of read signal resolution effects, the number of detected peaks will decrease as the flying height of the head is increased. Means are also provided for postponing a transfer of data to/from the disk when it is determined that the head is not within the acceptable range.

Abstract: In an embodiment of the invention, a method is provided for storing multimedia information to a medium. In another embodiment, a method is provided for retrieving multimedia information stored on a medium.

Abstract: A semiconductor package device includes an insulative housing, a semiconductor chip, a terminal and a lead, wherein the insulative housing includes a top surface, a bottom surface, and a peripheral side surface between the top and bottom surfaces, the chip includes a conductive pad, the terminal protrudes downwardly from and extends through the bottom surface and is electrically connected to the pad, the lead protrudes laterally from and extends through the side surface and is electrically connected to the pad, the terminal and the lead are spaced and separated from one another outside the insulative housing, and the terminal and the lead are electrically connected to one another inside the insulative housing and outside the chip.

Abstract: A semiconductor chip assembly includes a semiconductor chip that includes first and second opposing major surfaces, wherein the first surface of the chip includes a conductive pad, a substrate that includes first and second opposing major surfaces, wherein the first and second surfaces of the substrate include a conductive terminal and a dielectric base, the conductive terminal extends through the dielectric base to the first and second surfaces of the substrate, a cavity extends from the first surface of the substrate into the substrate, the first surfaces of the chip and the substrate face in a first direction, the second surfaces of the chip and the substrate face in a second direction, and the chip extends into the cavity, a conductive trace in an electrically conductive path between the conductive terminal and the pad, and an adhesive disposed between the conductive trace and the chip, the conductive trace and the substrate, and the chip and the substrate.

Abstract: Magnetic recording media having a protective carbon overcoat adapted to protect the magnetic recording layer from surface contact events and corrosion. The carbon overcoat includes at least two layers. A first layer is adapted to protect the magnetic recording layer from surface contact events and corrosion. The second layer is disposed on the first layer and is adapted to enhance the bonding of a lubricant to the carbon overcoat and to minimize head degradation. The magnetic recording media of the present invention advantageously enables the use of thin carbon overcoats, enhancing areal density, while maintaining good tribological properties.

Abstract: A method of making a semiconductor chip assembly includes providing a semiconductor chip, a conductive trace and a substrate, wherein the chip includes first and second opposing major surfaces and a conductive pad, the pad extends to the first surface of the chip, the substrate includes first and second opposing major surfaces, a conductive terminal and a dielectric base, the conductive terminal extends through the dielectric base to the first and second surfaces of the substrate, a cavity extends from the first surface of the substrate into the substrate, the first surfaces of the chip and the substrate face in a first direction, the second surfaces of the chip and the substrate face in a second direction, and the chip extends into the cavity, and then electrically connecting the conductive terminal to the pad using the conductive trace.

Abstract: A test probe includes a conductive trace with a bumped terminal, the bumped terminal includes a jagged contact surface and a cavity that face in opposite directions, and the contact surface includes a plated metal. The contact surface is jagged due to particles which may protrude, be covered or dislodged. Preferably, the test probe includes an elastomer that fills the cavity so that the bumped terminal is compliant. The test probe is well-suited for pressure contact with semiconductor chips, BGA packages and other electronic devices.

Abstract: A magnetic recording medium such as a magnetic disk includes a NiP or ceramic glass substrate on which a seedlayer is sputtered in a low pressure inert gas atmosphere, the seedlayer comprising a ternary or quaternary alloy formed from a B2 lattice type alloy such as NiAl, CoTi, CoAl, NiTi, FeTi, CoFe, CoHf, CuZn, CoZr, and MnAl. For quaternary alloys in which elements X and Y are added to the B2 type alloy, X can be chosen from one or more elements selected from the group consisting of Co, Ni, Fe, Cu, V, Mn, and Zn, and Y can be chosen from one or more elements selected from the group consisting of Al, Nb, Ta, Hf, Zr, Zn, Ag, Au, Pt and Pd. The resulting seedlayer preferably has an A2 lattice structure.

Abstract: Determining a phase error in a data signal includes detecting bits in an original data signal, determining a phase error in the original data signal based on the detected bits, adjusting a clock signal based on the phase error, sampling the original data signal with the clock signal to produce a sampled data signal, and repeating detecting, determining, adjusting and sampling using the sampled data signal instead of the original data signal.

Abstract: A method of connecting a conductive trace to a semiconductor chip includes providing a semiconductor chip, a conductive trace and a base, wherein the chip includes a conductive pad, the base includes a recess, the conductive trace includes a bumped terminal in the recess, the bumped terminal includes a cavity that extends into and faces away from the recess, the base contacts and covers the conductive trace on a side opposite the chip, and the conductive trace and the base are different metals, mechanically attaching the chip to the conductive trace using an insulative adhesive that extends into the cavity, etching the base to expose the conductive trace, and forming a connection joint that contacts and electrically connects the conductive trace and the pad. Preferably, the bumped terminal is inside a periphery of the chip, and the adhesive fills the cavity.

Abstract: An optoelectronic semiconductor package device includes a semiconductor chip, an insulative housing and a conductive trace, wherein the chip includes an upper surface and a lower surface, the upper surface includes a light sensitive cell and a conductive pad, the insulative housing includes a first single-piece non-transparent insulative housing portion that contacts the lower surface and is spaced from the light sensitive cell and a second transparent insulative housing portion that contacts the first housing portion and the light sensitive cell, and the conductive trace extends outside the insulative housing and is electrically connected to the pad inside the insulative housing.

Abstract: A method of making a semiconductor chip assembly includes providing a semiconductor chip and a laminated structure, wherein the chip includes a conductive pad, the laminated structure includes a conductive trace, an insulative base and a metal base, the conductive trace includes a routing line and a bumped terminal, the metal base and the routing line are disposed on opposite sides of the insulative base, and the bumped terminal includes a cavity that extends through the insulative base and into the metal base, removing a portion of the metal base that contacts the bumped terminal, and forming a connection joint that contacts and electrically connects the conductive trace and the pad.

Abstract: The present invention is directed to utilizing the capabilities of multi-stage actuators in disk drives to do self servo writing on the disk surfaces, thereby avoiding the use of a servo track writer. In one embodiment, a crash stop that limits the range of motion of a primary actuator is used as an initial reference point for a secondary actuator associated with a first head to position the first head to write a first servo track on a first disk surface. The first servo track is subsequently used as a reference point for a secondary actuator associated with a second head to position the second head for writing one or more servo tracks on a second disk surface. One of these servo tracks on the second disk surface is then used as the reference point relative to which the primary and/or secondary actuator associated with the first head moves the first head to write one or more servo tracks on the first disk surface.

Abstract: A three-dimensional stacked semiconductor package includes first and second semiconductor chip assemblies and a conductive bond. The first semiconductor chip assembly includes a first semiconductor chip and a first conductive trace with a first routing line and a first pillar. The second semiconductor chip assembly includes a second semiconductor chip and a second conductive trace with a second routing line and a second pillar. The chips are aligned with one another, the pillars are disposed outside the peripheries of the chips and aligned with one another, and the first pillar extends into a cavity in the second pillar. The conductive bond is within the cavity and contacts and electrically connects the pillars.

Abstract: A personal computer hard disk has disk media that comprises a primary portion and a backup portion; both portions are in the same hard disk housing. The backup portion is logically separate from the primary portion, and access to the logically separate backup portion is controlled by a backup access control mechanism. The backup access control mechanism may comprise a manually-actuable mechanism, such as a switch or a jumper, or it may comprise software provided in an ROM forming part of the internal memory of the hard disk.

Abstract: A method of testing a semiconductor package device includes providing a device that includes an insulative housing, a semiconductor chip, a terminal and a lead, wherein the terminal protrudes downwardly from and extends through a bottom surface of the housing, the lead protrudes laterally from and extends through a side surface of the housing, and the terminal and the lead are electrically connected to one another and a chip pad inside the housing, attaching the device to a test socket that electrically contacts the lead without electrically contacting the terminal, testing the test socket, and removing the device from the test socket. The method may include trimming the lead after removing the device from the test socket and the attaching the device to a printed circuit board that electrically contacts the terminal without electrically contacting the lead.

Abstract: A positioner (20) for a disk drive (10) that includes a magnet assembly (52), a conductor assembly (54), and a control system (22) is provided herein. The magnet assembly (52) includes a pair of magnet arrays (56A) (56B) and a pair of spaced apart flux return plates (75A) (75B). The conductor assembly (54) includes at least a first coil array (80) and a second coil array (82) that are substantially co-planar. The control system (22) directs current to electrically excite the coil arrays (80) (82) to maintain a data transducer (50) on a target track (32) of a storage disk (28).

Abstract: Methods and devices are provided that allow heads for use in disk drives to be tested in a helium environment in a cost-effective way with little or no impact on test time and with minimal consumption of helium.

Abstract: A three-dimensional stacked semiconductor package includes first and second semiconductor chip assemblies and a conductive bond. The first semiconductor chip assembly includes a first semiconductor chip and a first conductive trace with a first routing line and a first pillar. The second semiconductor chip assembly includes a second semiconductor chip and a second conductive trace with a second routing line and a second pillar. The chips are aligned with one another, and the pillars are disposed outside the peripheries of the chips and aligned with one another. The conductive bond contacts and electrically connects the pillars.