Abstract: The present invention provides a locking device and a high voltage shield connector having the same. The locking device of the present invention preferably includes a mounting hole configured to penetrate the circumferential surface of a female housing, a support member configured to be supported on an edge of the mounting hole, a restraining member extending to a lower portion of the support member and projecting to the inside of the female housing, and a locker formed on a male housing to restrain the restraining member to be connected to the female housing.
Type:
Grant
Filed:
April 21, 2010
Date of Patent:
September 6, 2011
Assignees:
Hyundai Motor Company, Kyungshin Industrial Company
Inventors:
Beob Mo Seong, Seung Cho Han, Ja Kyeom Kim
Abstract: A method of fabricating a membrane structure for a diffractive phased array assembly is provided. The method includes the steps of providing a wafer having a body and at least a membrane layer and a backside layer disposed on opposite faces of the body, forming a grating pattern on a surface of the membrane layer, and forming a window through the wafer to expose a back surface of the membrane, thereby allowing light to pass through the membrane.
Abstract: Disclosed is a method for producing an alcohol from a lactone or a carboxylic acid ester, which enables to produce an alcohol from a lactone or a carboxylic acid ester under relatively mild conditions with high yield and high catalytic efficiency. This method also enables to produce an optically active alcohol from an optically active lactone or an optically active carboxylic acid ester. Specifically disclosed is a method for producing an alcohol by hydrogen reducing a lactone or a carboxylic acid ester in the presence of a catalyst containing ruthenium and a phosphine compound represented by the following general formula (1): wherein R1 represents a spacer; R2, R3, R4, R5, R6 and R7 independently represent a hydrogen atom, an alkyl group having 1-12 carbon atoms, an aryl group or a heterocyclic group; and R8, R9, R10, R11, R12 and R13 independently represent an alkyl group having 1-12 carbon atoms, an aryl group or a heterocyclic group.
Type:
Grant
Filed:
April 2, 2008
Date of Patent:
September 6, 2011
Assignees:
Kaneka Corporation, Takasago International Corporation
Abstract: A wireless network system relays a broadcast signal in multiple stages and distributes data to terminals there around, and relay terminals determine whether to relay broadcast packets according to the direction vector and the position information, specified by the information transmission source terminal, referring to their own position information and direction, and relay and accept the packets or ignore them.
Abstract: The present disclosure provides various pumps and compressors for energizing fluids. In accordance with a preferred embodiment, pumps are provided for compressing hydrogen gas produced by electrolysis at a first location. The pump includes a bore with a piston disposed in the bore, and a magnetic drive external to the bore. The piston is moved through the bore to compress the fluid using permanent magnets or electromagnets. Using the disclosed embodiments, hydrogen compressed at a first location can be directed to a second location, such as a power plant or a fueling station.
Abstract: A heat dissipation package structure and method for fabricating the same are disclosed, which includes mounting and electrically connecting a semiconductor chip to a chip carrier through its active surface; mounting a heat dissipation member having a heat dissipation section and a supporting section on the chip carrier such that the semiconductor chip can be received in the space formed by the heat dissipation section and the supporting section, wherein the heat dissipation section has an opening formed corresponding to the semiconductor chip; forming an encapsulant to encapsulate the semiconductor chip and the heat dissipation member; and thinning the encapsulant to remove the encapsulant formed on the semiconductor chip to expose inactive surface of the semiconductor chip and the top surface of the heat dissipation section from the encapsulant.
Abstract: A mobile electronic device is provided with a housing, a loudspeaker, a cavity coupled to the loudspeaker, and a slide mechanism configured to move a portion of the housing between a first position and a second position. In the second position of the slide mechanism, an inner volume of the cavity is increased as compared to the first position.
Abstract: One end of an FPC (21) for supplying power to the driving section of a light amount control section provided in a shutter unit (20) is disposed between a second lens holder (17) and the shutter unit (20) secured to this second lens holder (17) and is held between the second lens holder (17) and the shutter unit (20). Thus, the FPC (21) is prevented from being spaced apart from the shutter unit (20), and a member for securing the FPC (21) to the shutter unit (20) is eliminated, reducing the number of part items. Further, the second lens holder (17) and the shutter unit (20) blocks unwanted light toward the FPC (21), so that a ghost image is prevented from appearing on an image due to unwanted light reflected on the FPC (21).
Abstract: This invention relates to certain aryl alkyl acid compounds, compositions, and methods for treating or preventing obesity and related diseases.
Type:
Grant
Filed:
September 5, 2008
Date of Patent:
September 6, 2011
Assignee:
Bayer Healthcare LLC
Inventors:
Roger A. Smith, Ann-Marie Campbell, Philip Coish, Miao Dai, Susan Jenkins, Derek Lowe, Stephen J. O'Connor, Ning Su, Gan Wang, Mingbao Zhang, Lei Zhu
Abstract: Provided is an optical image measuring apparatus capable of obtaining a high-accuracy image without being influenced by a movement of an object to be measured. Flash light is emitted from a xenon lamp (2) and converted into broad band light by an optical filter (2A). A polarization characteristic of the flash light is converted into linear polarization by a polarizing plate (3). Then, the flash light is divided into signal light (S) and reference light (R) by a half mirror (6). A polarization characteristic of the reference light (R) is converted into circular polarization by a wavelength plate (7). The signal light (S) and the reference light (R) are superimposed on each other by the half mirror (6) to produce interference light (L). A CCD (23) detects interference light having the same characteristic as that of the produced interference light (L).
Abstract: A method for controlling dosage of a reagent in a selective catalytic reduction (SCR) system includes the step of providing the system with a plurality of reagent injection nozzles, each nozzle being configured and adapted to be independently calibrated during an SCR reaction when the system is in operation. The method further includes determining an influence coefficient for each injection nozzle for a catalyst independently of the other injection nozzles, and optimizing the flow of reagent from each injection nozzle to minimize a sum of deviation across a surface of the catalyst. A system performs selective catalytic reduction (SCR) and a machine readable medium contains program instructions to controlling dosage of a reagent in a selective catalytic reduction (SCR) system.
Type:
Grant
Filed:
October 30, 2007
Date of Patent:
August 30, 2011
Assignee:
Babcock Power Environmental Inc.
Inventors:
Rajaram Jambhekar, Robert Lisauskas, William Medeiros, Clayton Erickson
Abstract: The present invention provides a data recognition apparatus for copy protection which recognizes software distributed through a disc in physically different ways through RFID and a USB memory, a method thereof, and storage mediums therefor. The apparatus comprises a disc insertion section for recognizing a first storage medium in the form of a disc with an RFID tag attached; an RFID reading section for reading the RFID tag; a USB port section for recognizing a second storage medium having the shape of a USB memory; a decoding section for decoding data stored in the first storage medium or the second storage medium; and a transmission section for transmitting the decoded data to the system.
Type:
Grant
Filed:
February 13, 2007
Date of Patent:
August 30, 2011
Assignee:
Sungkyunkwan University Foundation for Corporate Collaboration
Abstract: The present invention provides an organocatalyst of formula (I), wherein R1 is —H, —OH, —O—Si(R4)(R5)(R6) or C1-6alkoxy, in which R4, R5 and R6 are identical or different and independently selected from the group consisting of C1-6alkyl, phenyl and phenyl substituted with C1-6alkyl; R2 is —OH or ?O; X1 is one selected from the group consisting of —NH—, —S— and X2 is one selected from the group consisting of —C(?O)—, —CH2— and and X1 is different from X2. The high yield and enantioselectivity of an addition reaction are obtained by using the organocatalyst of the present invention.
Abstract: The present invention relates to a PVC product containing cyclodextrin derivative particles and capable of suppressing migration of a plasticizer and a method for manufacturing the same, which includes (S1) preparing cyclodextrin derivative particles, in which a hydroxyl functional group is replaced by a predetermined compound; (S2) inputting the cyclodextrin derivative particles, a water-based dispersion medium and a vinyl chloride monomer into a high-pressure reactor and performing polymerization to obtain cyclodextrin derivative particles-capsulated PVC particles, in which a plurality of the cyclodextrin derivative particles are dispersedly capsulated in PVC particles; and (S3) mixing the cyclodextrin derivative particles-capsulated PVC particles with a low molecular weight liquid plasticizer and molding the mixture in a predetermined shape using heat.
Abstract: A heat-dissipating semiconductor package structure and a method for manufacturing the same is disclosed. The method includes: disposing on and electrically connecting to a chip carrier at least a semiconductor chip and a package unit; disposing on the top surface of the package unit a heat-dissipating element having a flat portion and a supporting portion via the flat portion; receiving the package unit and semiconductor chip in a receiving space formed by the flat portion and supporting portion of the heat-dissipating element; and forming on the chip carrier encapsulant for encapsulating the package unit, semiconductor chip, and heat-dissipating element. The heat-dissipating element dissipates heat generated by the package unit, provides EMI shielding, prevents delamination between the package unit and the encapsulant, decreases thermal resistance, and prevents cracking.
Abstract: Multiple food storage systems are disclosed herein. One food storage system includes a main bowl that defines a first food receiving cavity. A secondary bowl is positioned in the first food receiving cavity and defines a second food receiving cavity. The secondary bowl includes a sidewall containing thermal energy storage material therein. A separate food storage system includes a main lid configured for use with a main bowl that defines a first food receiving cavity. A secondary bowl is positioned at least partially on and/or in the main lid. The secondary bowl includes a sidewall containing thermal energy storage material therein.
Abstract: The present invention provides a movable display device which has a high awareness of a display content while a sight line moving angle between a sight line connecting a driver's eye to display means and a sight line connecting the driver's eye to a target is small, thereby alleviating the driver's fatigue.
Type:
Grant
Filed:
November 11, 2008
Date of Patent:
August 30, 2011
Assignees:
Hyundai Motor Company, Kia Motors Corporation, Hyundai Motor Japan R&D Center, Inc.
Abstract: Disclosed is a thermosetting resin composition of excellent low-temperature curability comprising an oxetane compound and also disclosed is a cured article obtained therefrom. The thermosetting resin composition comprises an oxetane compound (A) containing two or more oxetane functional groups in the molecule represented by the following general formula (1) and a heteropolyacid (B) as essential components. A cured article obtained by heat curing of this composition shows excellent mechanical properties, electrical properties, adhesive properties, resistance to heat, moisture, and chemicals, and the like. In formula (1), R1 is a hydrogen atom, alkyl group of 1 to 6 carbon atoms, fluorine atom, fluoroalkyl group of 1 to 6 carbon atoms, allyl group, aryl group, aralkyl group, furyl group, or thienyl group.
Abstract: This invention provides biomarkers whose concentrations in blood plasma are associated with the presence or absence of PAD in the patient from whom the plasma sample is taken. The invention also provides biomarkers for distinguishing between PAD patients who are long claudicators and PAD patients who are not. In addition, the invention provides methods for identifying additional biomarkers, methods for detecting the biomarkers in patients, and methods for identifying agents, including pharmaceutical agents, which interact with the biomarkers and are useful for preventing or treating PAD in patients.
Type:
Grant
Filed:
May 26, 2005
Date of Patent:
August 30, 2011
Assignees:
Vermillion, Inc., Board of Trustees of the Leland Stanford Junior University
Inventors:
Eric T. Fung, John P. Cooke, Xiao-Ying Meng, Tai-Tung Yip, Fujun Zhang
Abstract: A semiconductor package with a heat dissipating structure is provided. The heat dissipating structure includes a flat portion, and a plurality of support portions formed at edge corners of the flat portion for supporting the flat portion above a chip mounted on a substrate. The support portions are mounted at predetermined area on the substrate without interfering with arrangement of the chip and bonding wires that electrically connect the chip to the substrate. The support portions are arranged to form a space embraced by adjacent supports and the flat portion, so as to allow the bonding wires to pass through the space to reach area on the substrate outside coverage of the heat dissipating structure; besides, passive components or other electronic components can be mounted on the substrate at area within or outside the coverage of the heat dissipating structure, thereby improving flexibility in component arrangement in the semiconductor package.