Abstract: A simplified tri-layer process for forming a thin film transistor matrix for a liquid crystal display is disclosed. By using a backside exposure technique, the masking step for patterning an etch stopper layer can be omitted. After forming an active region including a gate electrode and a scan line on the front side of a substrate, and sequentially applying an etch stopper layer and a photoresist layer over the resulting structure, the backside exposure is performed by exposing from the back side of the substrate. A portion of photoresist is shielded by the active region from exposure so that an etch stopper structure having a shape similar to the shape of the active region is formed without any photo-masking and lithographic procedure. Therefore, the above self-aligned effect allows one masking step to be reduced so as to simplify the process.

Abstract: A pair of slits (2a), a pair of first grooves (2b), a pair of second grooves (2c), and an engaging aperture (2d) are formed to the bottom plate (21) of an outer casing of the telephone set (1). An adapter plate member (3) has a base pate (3a), a pair of generally triangular plates (3b) standing on the base plate, a pair of elastic claws (3c) formed on the top edges of the triangular plates, and a mating tab (3d). One end of the adapter plate member is remobably and rotatably mounted at the front edge of the bottom plate. In a first condition where the telephone set is disposed with the bottom plate is not inclined, the triangular plates are inserted into the slits. In a second condition where the telephone set is disposed with an increased inclined angle, the claws are inserted into first grooves. In a third condition where the telephone set is mounted on a wall by the use of the adapter plate member. After the adapter plate member is removed from the bottom plate, turned upside down, and fixed onto the wall.

Abstract: A method for connecting an optical waveguide and an optical semiconductor device and an apparatus for connecting the same, capable of removing a working error and getting a high optical coupling coefficiency.

Abstract: The present invention is to provide a effective method for packing an electronic device including steps of: (a) putting an electronic device having a plurality of pins in a frame having a plurality of connecting members corresponding to said plurality of pins; (b) electrically connecting the plurality of pins of the electronic device with the corresponding connecting members; (c) mounting a fixing member on the electronic device to fix the electronic device with respect to the frame to form a semi-product; and(d) packing the semi-product with the fixing member.

Abstract: The invention concerns a method for forming a coating on conductive particles by grafting a polymer and/or a copolymer of the particles from a bath containing at least a monomer from which the polymer and/or copolymer is formed. The method consists of producing the grafting by electrochemical reduction of the monomer in an electrolytic solution, where at least a cathode and an anode are provided, and containing an aprotic solvent, a support electrolyte and the monomer(s) required for polymerizing or copolymerizing the coating, by suspending the particles and moving the solution so as to produce an intermittent contact between the particles and the cathode, and to form, by polymerization or copolymerization, the coating on the particles by applying an electric potential.

Abstract: In a connector device for use in connecting a connecting member (20) which has an end portion provided with a conductive portion, a plug connector (10) is removably coupled to a receptacle connector (30) by fitting therebetween. In the plug connector, an insulator (1) defines a receiving space (1a) for receiving the end portion of the connecting member. A conductive contact (3) is held in the insulator and formed to become in contact with a receptacle-side contact (33) of the receptacle connector when the plug connector is coupled to the receptacle connector. A slider member (5) is slidably inserted in the receiving space to make the conductive portion be brought in contact with the conductive contact in the receiving space.

Abstract: In a connector provided with a locking member (29) for locking a connection state between a connector (12) and a connection object (11), the locking member is assembled in an assembling portion (31) of a housing member (27) of the connector. The locking member has an engaging portion (29-1) at its one end, an operating portion (29-3) at the other end, and a pivot portion formed at a particular position between the engaging portion and the operating portion. The pivot portion has a first pivot (29-5) protruding on the side of one surface and a second pivot (29-6) protruding on the side of the other surface. The assembling portion has a pivot bearing portion (35) rotatably clamping the first and the second pivots. The engaging portion is engaged the connection object. The an operating portion is for receiving operation force. The housing member holds a contact member (25).

Abstract: A connector assembly (11) includes a connector element (21) for being connected to an counterpart connector (51) in a first direction and a manipulation mechanism (14) for manipulating the connection between the connector element and the counterpart connector. The manipulation mechanism includes a gear member (41) rotatably supported by the connector element and a lever member (45) engaged with the gear member in a rotating direction. The gear member has a gear section as an engaging arrangement for engaging with the counterpart connector in the first direction.

Abstract: To provide a conductive paste that exhibits a high thermal conductivity (a low thermal resistance) after adhesion and hardening and that enables an adhesive layer to be formed thin and to provide an electronic part that has an excellent radiating capability and that enables the thickness of films to be reduced. A conductive paste containing conductive particles, a hardenable resin, and a solvent has mixed therein fine spherical conductive particles such as Ag particles, the particle size is on the order of 0.05 to 1 &mgr;m, smaller than the first conductive particles. This conductive paste is used to mount an electronic part such as a semiconductor chip in producing a semiconductor package.

Abstract: A syringe comprises a barrel (1) having a plunger (7) in slidable and sealing engagement therewith. In order to provide an autodestruct system, so that the syringe can be used once only, being rendered disabled after one normal use, the barrel (1) has means interrupting the cylindrical surface of its inner wall in the form of grooves (10, 11) or a projection (29), and the plunger (7) has a locking means (17, 20) which operates on engagement with a groove (10, 11) or projection (29) on withdrawal of the plunger (7) to prevent further withdrawal movement. The locking means (17, 20) is provided on the head of the plunger (7) adjacent an elastomeric sealing cap (15). The locking means may comprise a pair of flukes (17) or a cross-shaped disc (20).

Abstract: The present invention provides a portable radio terminal comprising an off-memory 5-a in which a power-off time is stored, an on-memory 5-b in which a power-on time is stored, a difference memory 5-c in which a difference between the power-off time and the power-on is stored, a user data registration memory 4, and a portable terminal control unit 3, wherein, when a value stored in the difference memory 5-c reaches a predetermined time, the portable terminal control unit 3 waits for a password to be entered and, in response to the password entered, erases contents of the user data registration memory.

Abstract: A stacked-chip semiconductor device includes a rigid insulator board having therein a central opening and thereon a wiring pattern, and a base insulator bonded to the rigid insulator board and having a wiring pattern. Both the wiring patterns are connected together via through-holes formed in the rigid insulator board. A first semiconductor chip is mounted on the base insulator film within the opening of the rigid insulator board, whereas a second semiconductor chip is mounted on the rigid insulator board overlying the opening.