Abstract: In dissipating heat from miniature electronic devices, circuit modules, or the like, and particularly from dual-in-line package (DIP) type units having leads depending from opposite sides of a thin molded rectangular-parallelpiped body, an elongated sheet-metal strip of heat-radiating elements disposed above and in spaced relation to the top of the package has its opposite ends integrally connected with separate spaced heat-conducting clip members are cantilevered from it in different directions to fit respectively about the top and bottom surfaces of the package and to flex so as to accomodate insertion of the package between them and yet adjust themselves into abutments with those surfaces. Heat conducted away from the package by each of the cantilevered members first reaches a different end of the strip of heat-radiating elements, without interfering with the heat-exchange taking place along the opposite surfaces of the package clipped between the members.

Abstract: In a beverage dispenser of the type in which conditioned liquid is to be tapped through a bottom opening of a bowl normally closed from within by a valve member, unseating of the valve member and attendant gravitational release of liquid are conveniently brought about by tilting a wider Z-shaped sheet-metal handle which is keyed with the valve member to form an interlocked valving assembly further including only a spring and a suspension provided by external bowl flanges.

Abstract: Efficient dissipation and uniform spreading of heat from electronic solid-state devices by their associated heat-sink structures is promoted by thin broad-area thermally-conductive mountings built up from layers of a special form of substantially pure flexible and compressible flat graphite sheet material and a bonding-and-filling coating. At least one such 5-10 mil thickness layer of Grafoil flexible sheet, involving a crushable compressed mass of expanded graphite particles which are plate-like and oriented essentially parallel with the sheet surfaces, is intimately connected with a very thin bonding-and-filling coating substantially fully along its broad-area surfaces, and the latter coating is bonded at elevated temperature and pressure into a self-adhering relationship with surfaces of a heat-sink device intended to be disposed opposite surfaces of an electronic semiconductor device from which excess heat is to escape.

Abstract: Metering and related control of fluid flow are achieved both accurately and at high response speed by way of a unique sequencing of thermal exchanges with the fluid under closely-regulated and inter-dependent thermal conditions. The flowing fluid is first conditioned by being raised to a temperature above its highest anticipated ambient, preferably by way of a temperature-sensitive electrical heater resistance which is part of an exceptional self-balancing bridge and control-loop network, and the conditioned fluid is then similarly increased to yet higher temperature, with measurements related to energy involved in producing the second temperature increase being used to characterize the flow.