Abstract: An apparatus including a multiplexer configured to provide an output clock selected from a source clock, a destination clock, and a transition clock is provided. The apparatus further includes a phase difference calculation module configured to calculate a phase difference between the source clock and the destination clock and a clock generation module configured to generate a plurality of clocks. The apparatus further includes a clock selection module configured to select one of the plurality of clocks as the transition clock and a control circuit configured to provide: (1) a signal to the clock selection module for selecting one of the plurality of clocks as the transition clock based on the phase difference between the source clock and the destination clock and (2) a signal to the multiplexer to provide as the output clock one of the source clock, the destination clock, or the transition clock.

Abstract: Forming a gate stack of a non-volatile memory (NVM) over a substrate having an NVM region and non-NVM region which does not overlap the NVM region includes forming a select gate layer over the substrate in the NVM and non-NVM regions; simultaneously etching the select gate layer in the NVM and non-NVM regions; forming a charge storage layer over the substrate in the NVM and non-NVM regions; forming a control gate layer over the charge storage layer in the NVM and non-NVM regions; and simultaneously etching the charge storage layer in the NVM and the non-NVM regions. Etching the select gate layer in the NVM region results in a portion of the charge storage layer over a portion of the select gate layer and overlapping a sidewall of the select gate layer and results in a portion of the control gate layer over the portion of the charge storage layer.

Abstract: A data processing system and method are provided for allocating an entry in a branch target buffer (BTB). The method comprises: receiving a branch instruction to be executed in a data processor; determining that the BTB does not include an entry corresponding to the branch instruction; identifying an entry in the BTB for allocation, the identified entry in the BTB comprising a target identifier and a first prediction value for a previously received branch instruction; determining whether to allocate the branch instruction to the identified entry in the BTB based on a comparison of the first prediction value to a second prediction value, wherein the second prediction value is generated from a branch history table (BHT); and allocating the branch instruction to the identified entry if the second prediction value indicates a more strongly taken prediction than the first prediction value.

Abstract: A method for forming a through substrate via (TSV) comprises forming an opening within a substrate. An adhesion layer of titanium is formed within the via opening, a nucleation layer of titanium nitride is formed over the adhesion layer, and a tungsten layer is deposited over the nucleation layer, the tungsten layer having a thickness less than or equal to a critical film thickness sufficient to provide for film integrity and adhesion stability. A stress relief layer of titanium nitride is formed over the tungsten layer and a subsequent tungsten layer is deposited over the stress relief layer. The subsequent tungsten layer has a thickness less than or equal to the critical film thickness. The method further includes planarizing to expose the interlevel dielectric layer and a top of the TSV and backgrinding a bottom surface of the substrate sufficient to expose a bottom portion of the TSV.

Abstract: A method of fabricating a MOS transistor that comprises a dual-metal gate that is formed from heterotypical metals. A gate dielectric (34), such as HfO2, is deposited on a semiconductor substrate. A sacrificial layer (35), is next deposited over the gate dielectric. The sacrificial layer is patterned so that the gate dielectric over a first (pMOS, for example) area (32) of the substrate is exposed and gate dielectric over a second (nMOS, for example) area (33) of the substrate continues to be protected by the sacrificial layer. A first gate conductor material (51) is deposited over the remaining sacrificial area and over the exposed gate dielectric. The first gate conductor material is patterned so that first gate conductor material over the second area of the substrate is etched away. The sacrificial layer over the second area prevents damage to the underlying dielectric material as the first gate conductor material is removed.

Abstract: A method includes forming a first layer of gate material over a semiconductor substrate; forming a hard mask layer over the first layer; forming an opening; forming a charge storage layer over the hard mask layer and within the opening; forming a second layer of gate material over the charge storage layer; removing a portion of the second layer and a portion of the charge storage layer which overlie the hard mask layer, wherein a second portion of the second layer remains within the opening; forming a patterned masking layer over the hard mask layer and over the second portion, wherein the patterned masking layer defines both a first and second bitcell; and forming the first and second bitcell using the patterned masking layer, wherein each of the first and second bitcell comprises a select gate made from the first layer and a control gate made from the second layer.

Abstract: An inertial sensor has a transducer with a sense resonator. The sense resonator is oscillated. A signal responsive to the oscillation is provided. A first baseband signal and a second baseband signal are provided responsive to the signal responsive to the oscillation of the sense resonator. A signal for controlling a resonance frequency of the sense resonator is provided responsive to performing a Goertzel algorithm on the first baseband signal and the second baseband signal. One use of controlling the resonance frequency is to control an offset between the resonance frequency of the sense resonator and the frequency of the oscillation of drive masses in the sense resonator. Using the Goertzel algorithm is particularly efficient in controlling the resonance frequency.

Abstract: A device comprises a substrate, a micro electro-mechanical systems (MEMS) structure, and a dielectric film. The substrate has a first side and a second side, the second side opposite the first side. The MEMS structure is formed on the first side of the substrate. The cavity is formed in the substrate directly opposite the MEMS structure. The cavity has an opening formed on the second side. The dielectric film is attached to the second side of the substrate and completely covering the opening. In one embodiment, the MEMS structure is a diaphragm for a microphone. Another embodiment includes a method for forming the device.

Abstract: A method of processing semiconductor wafers includes applying reactive gas through a plurality of inlets to the semiconductor wafers. The method further includes removing exhaust gas resulting from the step of applying reactive gas. The removing of the exhaust gas is through a plurality of outlets coupled to a manifold. The manifold combines the exhaust gas from the plurality of outlets. The method further includes measuring a pressure in each outlet of the plurality of outlets during the step of removing.

Abstract: Negative photoresist over an insulating layer is exposed to radiation according to a pattern for an opening in the insulating layer for filling conductive material. A post of the negative photoresist is left over the location where the opening in the insulating layer is to be formed. A developable hard mask is formed over the post by a spin-on process so that the hard mask over the post is much thinner than directly over the insulating layer. An etch back is performed to remove the hard mask from over the post so that the post of negative photoresist is thus exposed. The post is removed to form an opening in the hard mask. An etch is performed to form the opening in the insulating layer aligned to the opening in the hard mask. The opening in the insulating layer is filled with the conductive material.

Abstract: A system includes a voltage controlled oscillator, a charge pump, and a current regulator circuit. The voltage controlled oscillator has a control input and a clock output that provides a clock signal at a clock frequency that is variable. The charge pump is coupled to the clock output and has an output that provides a boosted output voltage. The current regulator circuit is coupled to the control input of the voltage controlled oscillator to adjust the clock frequency based on a simulation of a rate of change of the boosted output voltage. This allows for a controlled slew rate for the output of the charge pump.

Abstract: A method of forming a micro-electromechanical system (MEMS) includes providing a cap substrate, providing a support substrate, depositing a conductive material over the support substrate, patterning the conductive material to form a gap stop and a contact, wherein the gap stop is separated form the contact by an opening, forming a bonding material over the contact and in the opening, wherein the gap stop and the contact prevent the bonding material from extending outside the opening, and attaching the cap substrate to the support substrate by the step of forming the bonding material. In addition, the structure is described.

Abstract: A translation look-aside buffer (TLB) has a TAG memory for determining if a desired translated address is stored in the TLB. A TAG portion is compared to contents of the TAG memory without requiring a read of the TAG memory because the TAG memory has a storage portion that is constructed as a CAM. For each row of the CAM a match determination is made that indicates if the TAG portion is the same as contents of the particular row. A decoder decodes an index portion and provides an output for each row. On a per row basis the output of the decoder is logically combined with the hit/miss signals to determine if there is a hit for the TAG memory. If there is a hit for the TAG memory, a translated address corresponding to the index portion of the address is then output as the selected translated address.

Abstract: A method for forming a semiconductor structure having a transistor region and an optical device region includes forming a transistor in and on a first semiconductor layer of the semiconductor structure, wherein the first semiconductor layer is over a first insulating layer, the first insulating layer is over a second semiconductor layer, and the second semiconductor layer is over a second insulating layer, wherein a gate dielectric of the transistor is in physical contact with a top surface of the first semiconductor layer, and wherein the transistor is formed in the transistor region of the semiconductor structure. The method also includes forming a waveguide device in the optical device region, wherein forming the waveguide device includes exposing a portion of the second semiconductor layer in the optical device region; and epitaxially growing a third semiconductor layer over the exposed portion of the second semiconductor layer.

Abstract: A system has a first plurality of cores in a first coherency group. Each core transfers data in packets. The cores are directly coupled serially to form a serial path. The data packets are transferred along the serial path. The serial path is coupled at one end to a packet switch. The packet switch is coupled to a memory. The first plurality of cores and the packet switch are on an integrated circuit. The memory may or may not be on the integrated circuit. In another aspect a second plurality of cores in a second coherency group is coupled to the packet switch. The cores of the first and second pluralities may be reconfigured to form or become part of coherency groups different from the first and second coherency groups.

Abstract: A method of making a phase change random access memory (PCM) device comprises forming a PCM stack that includes a heater layer, phase change material layer, and a top electrode layer. A top protection layer is formed overlying the PCM stack. The top protection layer and a first portion of the PCM stack are then patterned, wherein the first portion of the PCM stack excludes the heater layer. A sidewall protection feature is formed along a sidewall of the patterned top protection layer and first portion of the PCM stack. The heater layer is etched using (i) the sidewall protection feature and (ii) the patterned top protection layer and first portion of the PCM stack collectively as a mask to form a self-aligned heater layer bottom electrode of the PCRAM stack, thereby completing a memory bit of the PCRAM device.

Abstract: A method for processing a telephone number embedded in a voicemail received by a user of the handheld device comprising a processor and a memory is provided. The method includes playing back the voicemail. The method further includes in response to receiving a first marker set by the user to indicate a start of a telephone number, initiating storage of an audio sample corresponding to the telephone number in the memory. The method further includes terminating storage of the audio sample corresponding to the telephone number in the memory either automatically or in response to receiving a second marker set by the user to indicate an end of the telephone number. The method further includes using the processor, processing the stored audio sample to extract digits corresponding to the telephone number and communicating the extracted digits to an application executing on the processor.

Abstract: A semiconductor package includes an electrostatic discharge rail capable of being coupled to a first conductive contact and a second conductive contact, a first portion of a voltage triggerable material between the electrostatic discharge rail and the first conductive contact; and a second portion of the voltage triggerable material between the electrostatic discharge rail and the second conductive contact. The first and second conductive contacts may be coupled to the same semiconductor device or different semiconductor devices.

Abstract: A circuit comprises a delta phi generator, a startup circuit, and a level detector. The delta phi generator has a desirable operating state for developing a delta phi voltage at an output node in response to an input voltage, and an undesirable operating state. The startup circuit is coupled to the delta phi generator. The startup circuit ensures that the delta phi generator does not operate in the undesirable operating state. The level detector comprises a comparator with an offset. The comparator has a first input coupled to the output node, a second input coupled to a reference voltage, and an output coupled to the startup circuit. The level detector detects the delta phi voltage, and in response, disables the startup circuit.

Abstract: A method for forming a phase change memory cell (PCM) includes forming a heater for the phase change memory and forming a phase change structure electrically coupled to the heater. The forming a heater includes siliciding a material including silicon to form a silicide structure, wherein the heater includes at least a portion of the silicide structure. The phase change structure exhibits a first resistive value when in a first phase state and exhibits a second resistive value when in a second phase state. The silicide structure produces heat when current flows through the silicide structure for changing the phase state of the phase change structure.