Patents Represented by Attorney Kratz, Quintos & Hanson, LLP
  • Patent number: 8334647
    Abstract: A technology is provided, which obtains an organic EL device free from any reduction in the luminescent efficiency, even if an electrode layer is formed on a surface of a charge injection layer by a sputtering method. An organic EL device of the present invention includes a first charge injection layer, a first organic layer, and a second charge injection layer. The second charge injection layer is formed as a mixed layer in which a matrix organic material and a charge injectable metallic material are mixed. Even when the electrode layer is formed on a surface of this second charge injection layer by the sputtering method, the luminescent efficiency does not decrease.
    Type: Grant
    Filed: September 25, 2009
    Date of Patent: December 18, 2012
    Assignee: Ulvac, Inc.
    Inventor: Toshio Negishi
  • Patent number: 8333619
    Abstract: A connector according to the invention includes an insulative body, and a first contact and a second contact that are disposed in the body at different height levels from each other, the first contact or the second contact being elastically deformable. The first contact includes an mismatched portion having an higher impedance than that of another portion of the first contact. The second contact includes an adjusting portion to be brought close to the mismatched portion by elastic deformation of the first contact or the second contact in a direction close to the second contact or the first contact.
    Type: Grant
    Filed: November 19, 2009
    Date of Patent: December 18, 2012
    Assignee: Hosiden Corporation
    Inventors: Hayato Kondo, Toshiharu Miyoshi
  • Patent number: 8334461
    Abstract: A wiring board adapted for mounting an electronic component has the form of a structure in which a plurality of wiring layers are stacked one on top of another with an insulating layer interposed therebetween and are interconnected through via holes formed in the insulating layers, respectively. A plurality of openings are formed through the structure in a region where a wiring is not formed, extending through the structure in a thickness direction thereof. Further, solder resist layers are formed on the outermost wiring layers, respectively, and exposing pad portions defined in desired locations in the outermost wiring layers.
    Type: Grant
    Filed: October 31, 2008
    Date of Patent: December 18, 2012
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Yuichi Taguchi, Teruaki Chino, Kiyoshi Oi
  • Patent number: 8328579
    Abstract: The invention provides a shield case to cover a body, the body having a main body and first and second connecting portions projecting from the main body and lying adjacent to each other along a first direction. The shield case includes first to forth conductive shells. The first and second shells cover an outer circumference of the main body; the third shell covers the first connecting portion; and the fourth shell covers the second connecting portion. The third shell is in contact with at least one of the first and second shells. The first or fourth shell is in contact with the second shell. The fourth shell is provided integrally with the first shell and is adjacent to the third shell along the first direction. The first or fourth shell may not contact the second shell if the third shell is contactable with both the first and second shells.
    Type: Grant
    Filed: April 8, 2011
    Date of Patent: December 11, 2012
    Assignee: Hosiden Corporation
    Inventors: Daisuke Sasaki, Junichi Arai
  • Patent number: 8331101
    Abstract: A wiring board to be used with being mounted on a packaging board includes a chip component surface-mounted on a surface facing the packaging board. The chip component includes terminal electrodes at both end portions of the component body thereof. Each of the terminal electrodes is provided in a form in which a plated film (Sn) formed on the surface of the terminal electrode is separated into two portions, one portion being on the wiring board side, and another portion being on the packaging board side. In one aspect, each of the terminal electrodes of the chip component is separated into a portion on the wiring board side and a portion on the packaging board side, and the plated film (Sn) is formed on a surface of each of the separated portions of each of the terminal electrodes.
    Type: Grant
    Filed: January 26, 2010
    Date of Patent: December 11, 2012
    Assignee: Shinko Electronic Industries Co., Ltd.
    Inventors: Toshiaki Aoki, Masayoshi Ebe, Kiyotaka Shimada
  • Patent number: 8326566
    Abstract: When an acquisition and reporting control unit of a measurement data processing unit in a development support device sends a sensor measurement start request to a portable information device in response to a collection operation start command from an application under development, an acquisition and reporting control unit of a measurement data processing unit in the portable information device starts measurement operations by a sensor. The measured raw data is continuously sent to the development support device. Data which match the collection condition are collected by a data collection unit. In response to a data request from the program under development, a data reporting unit reports the measurement data which satisfy a reporting condition to the application under development. As a result, when developing an application program which uses the results of measurement by the sensor, it is possible to provide a satisfactory development environment.
    Type: Grant
    Filed: January 17, 2008
    Date of Patent: December 4, 2012
    Assignee: Vodafone Group PLC
    Inventors: Daisuke Tsujino, Yasuhiro Nishide, Jun Yamazaki, Hirohisa Kusuda
  • Patent number: 8326235
    Abstract: There is provided a communication device including: a first node connected to an antenna; a transmission unit outputting a signal to the antenna via the first node; a reception unit having a signal input thereto from the antenna via the first node; a first switch provided between the first node and the transmission unit; and a second switch provided between the first node and the reception unit, and in which the second switch is alternately turned on and off repeatedly, and the reception unit includes an amplifier amplifying a signal that the transmission unit outputs via the first and second switches and a mixer mixing a signal amplified in the amplifier and a local signal.
    Type: Grant
    Filed: July 16, 2010
    Date of Patent: December 4, 2012
    Assignee: Fujitsu Limited
    Inventor: Masaru Sato
  • Patent number: 8322024
    Abstract: There is provided a method of manufacturing a magnetic field generator (10) that includes a pair of plate yokes (12a), (12b) which are opposed to each other, with their opposing faces provided with respective permanent magnet assemblies (14a), (14b) which have faces opposing to each other, to which pole pieces (16a), (16b) are fixed respectively, and include permanent magnets (18). The permanent magnets (18), (28) include R—Fe—B magnets. During manufacturing, the assembled magnetic field generator (10) is heated in its entirety at a temperature not lower than 40° C. and not higher than 70° C., whereby the R—Fe—B magnets are magnetized to a magnetization rate not smaller than 80% and not greater than 99.9%.
    Type: Grant
    Filed: March 9, 2009
    Date of Patent: December 4, 2012
    Assignee: Hitachi Metals, Ltd.
    Inventors: Masaaki Aoki, Tsuyoshi Tsuzaki
  • Patent number: 8323878
    Abstract: A via hole is formed in a first cladding layer laminated on a wiring board. A conductive material is filled in the via hole so as to form a first conductor portion (a portion of a conductive via) having a mushroom-like shape projecting from a surface of the first cladding layer. Then, a second cladding layer is formed to cover the first conductor portion, the first cladding layer and a core layer, and a via hole is formed in the second cladding layer. A conductive material is filled in the via hole so as to form a second conductor portion (a remaining portion of the conductive via) connected to the first conductor portion.
    Type: Grant
    Filed: June 14, 2010
    Date of Patent: December 4, 2012
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventor: Kenji Yanagisawa
  • Patent number: 8323786
    Abstract: The invention provides a lightweight cement panel which achieves light weight, high strength, and durability, is free of degraded strength or deformation due to water absorption or fluctuation of ambient temperature, etc., provides satisfactory processing capabilities including nailing, etc. and can be used as a concrete formwork panel, floor material, wall material, ceiling material, and others of architectural structures. A panel proper 2 is formed by a porous compact 8 produced by filling, curing, and solidifying a mixture prepared by kneading cement, water, reinforcing fibers, and foam obtained by prefoaming a foaming agent in a hermetically sealed cement form block block, contains the reinforcing fibers 7 and foam in a dispersion state in the compact 8, and provides the specific gravity within the range between 0.5 and 1.0.
    Type: Grant
    Filed: October 23, 2007
    Date of Patent: December 4, 2012
    Assignee: Kanaflex Corporation Inc.
    Inventor: Shigeki Kanao
  • Patent number: 8319229
    Abstract: An optical semiconductor device is disclosed including an active region including an active layer and a diffraction grating having a ?/4 phase shift; passive waveguide regions each including a passive waveguide and a diffraction grating, disposed on the side of an emission facet and on the side of a rear facet sandwiching the active region between the passive waveguide regions, respectively; and an anti-reflection coating applied on the emission facet, wherein the passive waveguide region on the side of the emission facet has a length shorter than a length of the passive waveguide region on the side of the rear facet side.
    Type: Grant
    Filed: September 13, 2010
    Date of Patent: November 27, 2012
    Assignee: Fujitsu Limited
    Inventors: Tsuyoshi Yamamoto, Manabu Matsuda
  • Patent number: 8321573
    Abstract: A communication terminal includes a CPU (28). The CPU (28) issues to a router (16) a send request for requesting the router (16) to send an ask signal for repetitive responses to a server (14). Then, the ask signal is sent to the server (14) by the router (16), and a receive port is temporarily opened. From the server (14), a response signal is repeatedly sent in response to the ask signal. To the response signal, time information representative of a waiting time from receiving an ask signal to its reply is attached. A response signal sent back while the receive port is opened arrives at the communication terminal through the router (16), but a response signal sent back after the receive port is closed is discarded in the router (16). The CPU (28) repeatedly issues a send request to the router (16) regarding a time indicated by time information attached to the response signal lastly received as an issuance cycle (T).
    Type: Grant
    Filed: September 1, 2005
    Date of Patent: November 27, 2012
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Keiji Hirao, Motoe Sakanaka, Tomohiro Yamada
  • Patent number: 8314878
    Abstract: An image pickup apparatus includes: an image pickup substrate on which an image pickup device is mounted on an object side; an optical unit having a lens for imaging an object light on the image pickup device; a blade member adjusting an amount of the object light entering into the lens; a drive unit having a motor driving the blade member; and a motor substrate supplying the motor with a drive power. The optical unit is provided in the image pickup substrate. The drive unit is provided in the optical unit so as to be spaced apart from the image pickup substrate. The motor substrate is provided in the drive unit so as to face the image pickup substrate. The conductive member electrically connecting the image pickup substrate with the motor substrate is disposed between the image pickup substrate and the motor substrate.
    Type: Grant
    Filed: February 6, 2009
    Date of Patent: November 20, 2012
    Assignee: Seiko Precision Inc.
    Inventor: Hisashi Kawamoto
  • Patent number: 8314349
    Abstract: A lead pin includes a shaft portion, a connection head portion provided to a top end side of the shaft portion, and having a diameter which is larger than a diameter of the shaft portion, wherein the connection head portion includes a bonding surface on an opposite side to the shaft portion side, and the bonding surface includes a flat surface provided in a center part, a convex surface which is provided like a ring shape to an outside of the flat surface and rounded by a radius R like a convex shape, and a concave surface which is provided like a ring shape to an outside of the convex surface and rounded by a radius R like a concave shape.
    Type: Grant
    Filed: October 25, 2010
    Date of Patent: November 20, 2012
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventor: Masakuni Kitajima
  • Patent number: 8313256
    Abstract: A focal plane shutter includes: an electromagnet; a board including an opening; a blade movable between a position where the blade recedes from the opening and a position where the blade covers at least part of the opening; and a drive lever driving the blade, and including: a spindle portion provided at its one end with a flange portion; an iron piece provided at the other end of the spindle portion and capable of being adsorbed to the electromagnet; a support portion including a through hole through which the spindle portion penetrates with a play; and a guide portion provided along the iron piece.
    Type: Grant
    Filed: September 16, 2011
    Date of Patent: November 20, 2012
    Assignee: Seiko Precision Inc.
    Inventors: Hiroshi Takahashi, Seiichi Oishi
  • Patent number: 8315869
    Abstract: A speech recognition apparatus for recognizing a plurality of sequential words contained in a speech includes an acoustic model reading part for reading an acoustic model, a dictionary management part for reading required data from dictionary data, and a recognition part for successively recognizing the sequential words by matching a group of words represented by the dictionary data with the inputted speech, using the acoustic model, wherein the dictionary data contains a beginning part dictionary representing beginning parts of words, and a group of ending part dictionaries storing data representing ending parts, the ending part dictionary and/or the beginning part dictionary are read in accordance with the word recognized by the recognition part, and the recognition part matches a subsequent speech with the beginning parts of words contained in the beginning part dictionary while the dictionary management part is reading the ending part dictionary and/or the beginning part dictionary.
    Type: Grant
    Filed: July 19, 2006
    Date of Patent: November 20, 2012
    Assignee: Fujitsu Limited
    Inventor: Shouji Harada
  • Patent number: 8310661
    Abstract: An image of an installed state of an optical fiber is captured by a camera. The optical fiber is provided with position marks at fixed intervals, the position marks each indicating a distance from a predetermined position and a direction of the optical fiber. An installed state analyzing apparatus performs image processing on the captured image and analyzes the installed state of the optical fiber by using the optical fiber installation tools and the position marks.
    Type: Grant
    Filed: October 14, 2011
    Date of Patent: November 13, 2012
    Assignee: Fujitsu Limited
    Inventors: Kazushi Uno, Fumio Takei, Takeo Kasajima
  • Patent number: 8307758
    Abstract: A continuous stir-fry cooking apparatus of a rotating drum type includes a heating drum having a cooking ingredient charging portion at one end and a product discharging portion at the other end, a swing arm 23 swingable about a swing shaft provided on an axis line of the heating drum 14, a rotating shaft 24 provided to a swing end of the swing arm to be parallel to the axis line of the heating drum, and a stirring blade member 26 provided to the rotating shaft with a tip end coming in close proximity to an inner peripheral surface of the heating drum. The stirring position of the stirring blade member can be optimized by regulating the swing angle of the swing arm according to the conditions, such as the rotating velocity of the heating drum.
    Type: Grant
    Filed: March 26, 2010
    Date of Patent: November 13, 2012
    Assignee: Ajinomoto Co., Inc.
    Inventors: Teruo Kobayashi, Eiji Kawase
  • Patent number: D671636
    Type: Grant
    Filed: October 21, 2010
    Date of Patent: November 27, 2012
    Assignee: Daiichi Sankyo Company, Limited
    Inventor: Hiroshi Nishino
  • Patent number: D672716
    Type: Grant
    Filed: March 7, 2012
    Date of Patent: December 18, 2012
    Assignee: Hosiden Corporation
    Inventor: Takayuki Nagata