Abstract: An aqueous acidic electrolyte of the chloride, sulfate and mixed chloride-sulfate types suitable for electrodepositing a zinc-nickel alloy on a conductive substrate comprising an aqueous solution containing zinc ions and nickel ions, and an additive agent of a class selected from the group consisting of (a) aromatic sulfonic acids, (b) aromatic sulfonamides, sulfonimides and mixed carboxamides/sulfonamides, (c) acetylene alcohols as well as the bath soluble and compatible salts and mixtures thereof. The invention further encompasses the process for electrodepositing a zinc-nickel alloy employing the aforementioned electrolyte.

Abstract: An improved electrolytic apparatus and process particularly applicable for high-speed electrodeposition of a metallic plating on a substrate such as on a printed wiring board of the type employed in the electronic industry. The apparatus employs a manifold assembly adapted to be immersed in the electrolyte and positioned adjacent to each of the anodes immersed therein for withdrawing electrolyte past the anode to provide a controlled rate of flow across the anode surface to achieve a substantially uniform mass transport rate across the fluid film on the surface of the anode. The apparatus is also adapted for returning at least a portion of the withdrawn electrolyte to the tank which can be arranged so as to impinge upon the article being plated.

Abstract: An improved process and aqueous electrolyte for imparting improved corrosion resistance to chromium substrates, and particularly nickel-plated substrates having a chromium plating thereover deposited from a trivalent chromium electrolyte. The post-treating solution contains solution soluble and compatible hexavalent chromium compounds including chromates and dichromates present in an amount sufficient to deposit a protective film on the chromium substrate and phosphate ions present in an amount of about 2.5 g/l up to the limit of solubility in the electrolyte. The electrolyte optionally, but preferably, further contains a buffering agent present in an amount to stabilize the pH of the solution within a range from about 2.5 up to about 10.

Abstract: Copper may be deposited non-electrolytically from a composition comprising copper ions, a complexor to keep the copper ions in solution, and glyoxylate ions as a reducing agent. The use of formaldehyde is therefore avoided.

Abstract: A citrate-free electroplating bath for the high speed deposition of gold alloy plates on substrates comprises a source of gold (for example gold (I) potassium cyanide), a source of alloying metal (for example, nickel sulfate), oxalic acid and formic acid. As citrate is not used, higher plating speeds are obtained and precipitates of certain citrate salts (for example, nickel citrate) are avoided.

Abstract: An improved aqueous acidic electrolyte suitable for electrodepositing zinc alloys comprising a combination of zinc and at least one metal selected from the group consisting of nickel, cobalt, iron, and mixtures thereof incorporating an effective amount of an additive agent for providing improved grain-refinement and enhancing the codeposition of the alloying metals in the zinc alloy deposit. The additive agent comprises a bath soluble anionic carboxylated polyoxyalkylene compound derived from the carboxylation of:(a) the polymerization of alkylene oxides selected from the group consisting of ethylene oxide, propylene oxide, glycidol, butylene oxide and mixtures thereof; and(b) the alkoxylation of mono and polyhydroxy compounds selected from the group consisting of hydroxyl containing alkyl, alkenyl, alkynyl, aryl, as well as mixtures thereof.

Abstract: The present invention includes an aqueous acidic chromate solution, suitable for forming colored chromate coatings on zinc-nickel alloy electrodeposits containing up to about 15% by weight nickel, which solutions have a pH within the range of about 1.3 to about 2.7, a hexavalent chromium concentration of at least 0.5 grams per liter, and preferably about 0.5 to about 100 grams per liter, and which contain sulfate in a weight ratio of SO.sub.4 :Cr.sup.+6 of about 0.025-1.5:1.The zinc-nickel alloy electrodeposits are preferably immersed in the chromating solution for a period sufficient to form the desired colored chromate coating. In some instances, a flash electrodeposit of zinc may be applied to the zinc-nickel alloy electrodeposit before it is immersed in the chromating solution.

Abstract: An aqueous acidic peroxide-free solution and process for treating receptive metal surfaces to impart a chromium passivate film thereon containing chromium ions substantially all of which are present in the trivalent state, hydrogen ions to provide a pH of about 1.2 to about 2.5, at least one additional metal ion selected from the group consisting of iron, cobalt, nickel, molybdenum, manganese, aluminum, lanthanum, cerium, lanthanide mixtures as well as mixtures thereof present in an amount effective to activate the formation of the chromate passivate film and nitrate ions as the essential oxidizing agent present in an amount to provide a mol ratio of nitrate ions to chromion ions and activating metal ions of at least about 4:1 and sufficient to activate the hydrated trivalent chromium to form a chromate film on the substrate.

Abstract: An improved electrolyte composition and process for electrodepositing bright, level and ductile copper deposits on a substrate enabling use of conventional electroplating equipment for high-speed copper plating employing average cathode current densities substantially higher than heretofore feasible. The electrolyte contains an additive system comprising carefully controlled relative concentrations of:(a) a bath soluble polyether compound;(b) a bath soluble organic divalent sulfur compound;(c) a bath soluble adduct of a tertiary alkyl amine with epichlorohydrin; and(d) a bath soluble reaction product of polyethyleneimine and an alkylating agent.

Abstract: An improved process for producing a composite nickel-containing electroplate on a substrate including an inner nickel-containing layer, of an average sulfur content of less than about 0.03 percent by weight, an intermediate nickel-containing layer of an average sulfur content of about 0.05 to about 0.5 percent by weight and an adjacent adherent outer nickel layer of an average sulfur content of about 0.02 to about 0.15 percent but less in sulfur than the intermediate layer and higher in sulfur than the inner layer. The controlled amount of sulfur is introduced into at least the intermediate layer by employing an aqueous acidic nickel solution containing a controlled amount of a thiazole and/or thiazoline additive compound so as to provide an intermediate nickel-containing deposit containing the specified average sulfur content.

Abstract: A palladium electroplating bath capable of plating highly ductile palladium metal. The bath comprises a palladium amine complex salt as a source of the palladium metal, ammonium sulfate, an ammonium halide, an alkali metal pyrophosphate, a stress reducing agent, and a minor amount of cyanide ions. In general, the cyanide ions are furnished to the bath by the addition of alkali metal cyanide. The pH of the bath will range from about 7 to 9. Electrolytic deposition will be carried out at a temperature of from about 50 to 80 degrees C. at high current densities up to about 3000 ASF. The method of depositing ductile palladium foil on a variety of substrates is also described and claimed.

Abstract: An aqueous acidic electrolyte and process for electrodepositing zinc alloys comprising zinc-nickel, zinc-cobalt and zinc-nickel-cobalt on a conductive substrate incorporating a brightener system including a ductilizing agent present in an amount sufficient to reduce stress and fracturing of the zinc alloy electrodeposit providing for improved corrosion resistance of the deposit. The ductilizing agents are sulfonates of an aldehyde or ketone.

Abstract: An improved aqueous acidic zinc electrolyte and process for electrodepositing zinc on a conductive substrate in which the electrolyte contains a brightening amount of a bath soluble anionic sulfated polyoxyalkylene surfactant derived from the sulfation of:(a) the polymerization of alkylene oxides selected from the group consisting of ethylene oxide, propylene oxide, glycidol, butylene oxide and mixtures thereof; and(b) the alkoxylation of mono and polyhydroxy compounds having radicals selected from the group consisting of hydroxyl containing alkyl, alkenyl, alkynyl, aryl, and carboxylic derivatives thereof as well as mixtures thereof.The zinc electrolyte can further contain conventional additives and agents of the types employed in acid zinc electrolytes to provide modifications and desired characteristics of the zinc electrodeposit.

Abstract: An improved aqueous cyanide-free electrolyte and process for depositing ductile, fine-grained adherent copper deposits on conductive substrates in which the electrolyte contains copper ions in an amount sufficient to electrodeposit copper, a complexing agent present in an amount sufficient to complex an effective amount of the copper ions present, a bath soluble and compatible buffering agent present in an amount sufficient to stabilize the pH of the electrolyte, hydroxyl and/or hydrogen ions present in an amount to provide a pH of about 6 to about 10.5, and sulfamic acid and the bath soluble and compatible salts thereof present in an amount effective to increase the anode efficiency during the electrodeposition of copper from said electrolyte. The electrolyte can optionally, but preferably further contain ammonium ions in combination with the sulfamic acid constituent to further enhance the anode efficiency and a wetting agent present in an amount up to about 2 g/l.

Abstract: An aqueous acid electroplating solution and process for electrodepositing an adherent, ductile zinc, zinc-cobalt, zinc-nickel, zinc-cobalt-nickel alloy deposit on a conductive substrate which contains a comparatively low concentration of boric acid to inhibit formation of bath insoluble polyborate compounds and contains an effective amount of a polyhydroxy additive agent containing at least 3 hydroxyl groups and at least 4 carbon atoms of the structural formula: ##STR1## as hereinafter more specifically defined. The electroplating solution further contains conventional acid zinc and zinc alloy bath constituents and supplemental additive agents of the types known in the art.

Abstract: An aqueous concentrate adapted for dilution with water for use in the make-up and replenishment of zinc or zinc alloy electroplating baths of the chloride and the mixed chloride types comprising an aqueous solution containing zinc chloride in an amount of about 10 to about 400 g/l, a hydrophobic organic brightening agent selected from the group consisting of aryl aldehydes, halo aryl aldehydes, aryl alkenyl ketones, aryl alkenyl aldehydes, heterocyclic alkenyl ketones and aldehydes as well as mixtures thereof generally present in an amount of about 10 up to about 200 g/l and a solubilizing agent comprising an alkyl phenyl sulfonate compound present in an amount of at least about 10 g/l up to an amount in consideration of the concentration of the zinc chloride and organic brightening agent present in the concentrate.

Abstract: A plating cell for plating edge connector tabs of printed circuit boards comprises a pair of anode structures 119, each of which has a pair of elongate anodic platinized titanium plates 131 spaced apart by an anode divider 150. Castellations in the anode structures give rise to holes 132 through which electrolyte can flow. By means of this configuration of the anode structures an even deposit of plated metal may be obtained.

Abstract: An aqueous bath suitable for electrodepositing zinc and alloys of zinc including zinc-nickel, zinc-cobalt, zinc-nickel-cobalt, zinc-iron, zinc-iron-nickel, and zinc-iron-cobalt containing a brightening amount of an AB-type polyamide brightener in an amount effective to produce an electrodeposit of the desired brightness. The invention further contemplates the process of electrodepositing zinc and zinc alloys of the foregoing types on a conductive substrate employing the aqueous electrolyte.

Abstract: Particular electroplating baths suitable for obtaining white deposits of palladium metal. The bath comprises (a) palladosamine chloride; (b) an ammonium salt such as ammonium sulfate or ammonium chloride; (c) chloride ions; and (d) a brightener selected from the group of organic brighteners, inorganic brighteners, and mixtures thereof. The process of using such electroplating baths to produce white deposits of palladium metal on substrates is also disclosed and claimed.

Abstract: A plating barrel is constructed of a perforated cylindrical side section clamped between a pair of end plates. The end plates are provided with positioning grooves that receive edge portions of the side section. Each end plate includes a plurality of concentric grooves so that the same end plates may be used with side sections of different diameters. The barrel is rotatably mounted on a support disposed within a seamless tank containing a plating bath. The support has adjustable upstanding arms which rotatably support the barrel and permit the height thereof to be adjusted for controlling the extent to which the barrel is immersed in the plating bath, with such adjustment being dictated in part by the extent of the areas to be plated and the number of work pieces in the barrel.