Abstract: An improved aqueous electroless nickel plating bath and process for chemically depositing nickel on a substrate comprising an aqueous solution containing nickel ions, hypophosphite ions, a complexing agent, preferably a buffering agent and a wetting agent, and a small but effective amount of a sulfonium betaine compound sufficient to control the rate of nickel deposition and the concentration of phosphorus in the nickel deposit, preferably, in further combination with supplemental organic and/or inorganic rate stabilizers. The invention further contemplates a process for rejuvenating an electroless nickel bath which has been rendered inoperative due to the presence of excessive concentrations of supplemental stabilizing agents by the addition of a controlled effective amount of a sulfonium betaine compound sufficient to restore the bath to an operative plating condition.

Abstract: An improved composition for selectively stripping gold from a metal substrate, especially copper metal, wherein the gold deposit is rapidly and effectively stripped without an attendant attack on the metal substrate. A minor amount of an organo mercapto compound, e.g. mercaptobenzothiazole, is added to the stripping composition to inhibit attack on the metal substrate.

Abstract: An aqueous acidic trivalent chromium electrolyte and process for electrodepositing chromium platings comprising an electrolyte containing trivalent chromium ions, a complexing agent, halide ions, ammonium ions and a reducing agent comprising a metal ion selected from the group consisting of Gold, Silver, Platinum, Palladium, Rhodium, Iridium, Osmium, Ruthenium, Rhenium, Gallium, Germanium, Indium, Samarium, Europium, Gadolinium, Terbium, Dysprosium, Holmium, Erbium, Thulium, Ytterbium, Lutetium, and Praseodymium present in an amount effective to maintain the concentration of hexavalent chromium ions formed in the bath at a level at which satisfactory chromium electrodeposits are obtained.

Abstract: An aqueous acidic trivalent chromium electrolyte and process for electrodepositing chromium platings comprising an electrolyte containing trivalent chromium ions, a complexing agent, halide ions, ammonium ions and a reducing agent comprising an ion selected from the group consisting of scandium, yttrium, lanthanum, titanium, zirconium, hafnium, molybdenum, arsenic, selenium, tellurium, cerium, uranium, and tin present in an amount effective to maintain the concentration of hexavalent chromium ions formed in the bath at a level at which satisfactory chromium electrodeposits are obtained.

Abstract: Electroless gold plating baths for plating metallized ceramics wherein the bath comprises (a) alkali metal gold cyanide, (b) alkali metal fluoride, and (c) alkali metal hydroxide. The baths may optionally contain a buffering agent and/or ammonium hydroxide and/or an organic chelating agent. The metallized ceramics contain tungsten, molybdenum, electroless nickel, copper and the like. The gold constituent in the alkali metal gold cyanide may be monovalent, trivalent or mixtures thereof. The method of utilizing such electroless or autocatalytic plating baths is also described and claimed.

Abstract: Improved electroplating ternary gold alloy plating baths wherein the gold ingredient is an alkali metal auricyanide, the gold metal being in the plus three oxidation state, and the alloying metals are both cobalt and molybdenum. The electroplating baths also contain citric acid. A wetting agent or surfactant as well as a stress reducer-brightener are also advantageously utilized in the bath. The ternary alloys may be deposited on various electronic and decorative substrates, and the deposits were characterized by unique physical and mechanical properties. Most importantly, there is a substantial improvement in wear resistance. The method of utilizing such improved electroplating baths on various substrates is also described and claimed.

Abstract: A cyanide-free electrolyte and process for depositing a ductile, fine-grained, adherent copper plate usually of a thickness of about 0.015 to about 5 mils on ferrous-base, copper-base, zinc-base and the like conductive substrates. The electrolyte contains controlled effective amounts of cupric ions complexed with an organo-phosphonate chelating agent, an alkali carbonate as a bath stabilizing and buffering agent, hydroxyl ions to provide a pH on the alkaline side and preferably, a wetting agent. The copper plate is applied by electrolyzing the aforementioned electrolyte employing a combination of a bath soluble copper anode and an insoluble ferrite anode to provide a copper to ferrite anode surface area ratio within a range of about 1:2 to about 1:6.

Abstract: A process for electrodepositing chromium on a conductive substrate employing an electrolyte containing trivalent chromium ions, a complexing agent, and hydrogen ions to provide an acidic pH in which a conductive substrate to be electroplated is immersed in the electrolyte and is cathodically charged and current is passed between the substrate and an anode at least a portion of the surfaces of which is comprised of ferrite whereby the formation of detrimental hexavalent chromium ions in the electrolyte is inhibited and the stability of the pH of the electrolyte is improved.

Abstract: A process for depositing a ductile, fine-grained adherent copper plate on a conductive substrate employing an electrolyte containing controlled effective amounts of cupric ions, a complexing agent for the cupric ions, a bath stabilizing and buffering agent, and hydroxyl and/or hydrogen ions to provide a pH from about 6 to about 10.5. The process includes electrolyzing the aforementioned electrolyte employing a combination of a bath soluble copper anode and an insoluble nickel-iron alloy anode containing about 10 percent to about 40 percent by weight iron and about 0.005 to about 0.06 percent sulfur to provide a copper anode area to nickel-iron alloy anode surface area ratio within a range of about 1:2 to about 4:1. The invention further contemplates a novel nickel-iron alloy anode for use in the practice of the disclosed process.

Abstract: An aqueous bath and process suitable for the electrodeposition of bright, high-leveling nickel-iron alloy deposits on a conductive substrate comprising controlled, effective amounts of nickel ions, iron ions, an iron solubilizing agent, a buffering agent, a primary brightening agent, hydrogen ions to provide a pH of about 2.6 to 4.5 and at least one bath soluble additive agent present in an amount of at least about 2 mg/l, selected from propargyl sulfonic acid, 1-butyne-3-sulfonic acid, 1-pentyne-5-sulfonic acid, 2-butyne-1-sulfonic acid and the alkali metal and ammonium salts thereof. A particularly preferred additive agent comprises propargyl sulfonic acid and the alkali metal and ammonium salts thereof. The invention further contemplates the use of the aforementioned additive agent as a replenishing agent for nickel-iron electroplating solutions and as a rejuvenating agent for restoring the activity and capacity of such aqueous baths to deposit bright, high-leveling nickel-iron alloy deposits.

Abstract: A process and composition for use in electroless copper plating where the process includes contacting a substrate with a solution comprising copper, a complexing agent, a reducing agent, and a pH adjuster. A stabilizer may also be used. The improvement of the present invention includes contacting the substrate with a solution further comprising ammonium ions present in an amount effective to function as a plating rate controller. The improved solution is relatively stable, easy to control, and is of versatile use.

Abstract: A process for treating a polymeric plastic substrate to render it receptive to electroless plating in a process of the type including the steps of etching the substrate and activating the etched substrate. The present improvement includes the step of accelerating the activated substrate with an improved aqueous accelerating solution containing an aqueous soluble compatible oxidizing agent present in an amount effective to increase the activity of the accelerating solution. The improved accelerating solution inhibits the plating of stop-off coatings and plating racks and is of versatile use.

Abstract: A zinc/iron alloy electroplating bath comprising a conductive aqueous solution containing zinc ions, iron ions, and a brightening additive which is a derivative of B-aminopropionic acid or a polymer thereof. A semi-bright to bright zinc/iron alloy deposit can be electrodeposited from the bath onto a substrate.

Abstract: A process and electroplating bath for use in electrodepositing nickel on a base where the electroplating bath includes a coumarin compound and an aryl hydroxy carboxylic acid compound, such as salicylic acid, present in a combined amount effective to provide a ductile, self-leveling nickel deposit. The bath may further include hexyne diol and/or a material selected from the group consisting of primary acetylenic alcohols and adducts of primary acetylenic alcohols, as well as mixtures thereof. It has been found that excellent leveling and physical properties can be maintained utilizing such a bath, while at the same time, the usual coumarin concentration level can be reduced significantly and process life can be dramatically extended. In addition, additives such as butyne diol, and/or aldehydes such as formaldehyde and chloral hydrate may be utilized. It has also been found that corrosion resistance is substantially improved utilizing the process and electroplating bath of the present invention.

Abstract: An aqueous acidic trivalent chromium electrolyte and process for electrodepositing chromium platings comprising an electrolyte containing trivalent chromium ions, a complexing agent, halide ions, ammonium ions and a reducing agent comprising neodymium ions present in an amount effective to maintain the concentration of hexavalent chromium ions formed in the bath at a level at which satisfactory chromium electrodeposits are obtained.

Abstract: The present invention relates to an improved electroplating bath and process for producing semi-bright to bright zinc cobalt alloy electrodeposits on substrates, and particularly non-planar substrates, to provide enhanced resistance to salt spray corrosion. The invention further contemplates the application of a thin passivate coating directly on the zinc-cobalt electrodeposit, or alternatively, on a substantially pure zinc flash over plate of a thickness sufficient to enable the zinc flash to be converted to an adherent substantially continuous zinc passivate.

Abstract: An electroplating bath solution comprising an alkali metal or ammonium gold sulphite, a water soluble salt of thallium metal to effect brightening and grain refining, and a non-hydroxy, non-amino carboxylic acid such as formic acid and oxalic acid to ensure that the bright gold metal deposit has a hardness lower than about 90 Knoop. The method of depositing the bright gold metal on various substrates from such electroplating solutions is also described and claimed.

Abstract: An improved aqueous acidic trivalent chromium electrolyte and process for increasing the tolerance of such electrolytes to the presence of deleterious contaminating metal ions which normally progressively increase during commercial operation of the electrolyte ultimately resulting in chromium electrodeposits which are commercially unsatisfactory due to the presence of streaks, clouds and hazes in the deposit. The improved composition contains controlled effective amounts of thiazole and benzothiazole compounds which are effective to mask the adverse effects of such contaminating metal impurities and which also enhance the codeposition of such metal contaminants on the parts being plated thereby reducing, and in some instances preventing the progressive accumulation of such contaminating metal ions in the electrolyte.

Abstract: The present invention is based on the discovery that addition of certain amino alcohol compounds enhance the brightening of deposits incorporating tin and cobalt or zinc and improve the process, rendering it capable of producing good deposits with less careful control on the thickness of the coating being required.According to the present invention a bath composition for electroplating a bright alloy deposit of cobalt and tin or cobalt and zinc on a substrate, is characterized by the present of a brightening amount of a compound having the formula: ##STR1## wherein: R.sup.1 represents an alkyl group having 1 to Y carbon atoms or an alkyl group having from 1 to Y carbon atoms at least one of which is substituted by a hydroxyl group; andR.sup.2 or R.sup.3 or both represent a hydrogen atom or an alkyl group of 1 to Y carbon atoms or an alkyl group of 1 to Y carbon atoms at least one of which is substituted by a hydroxyl group or an amino group and R.sup.2 and R.sup.

Abstract: An electrolytic bath for the production of mirror bright silver deposits comprising an alkali metal silver cyanide as the source of silver; boric acid, citric acid, alkali or ammonium metal salts of such acids, as well as mixtures thereof; selenous acid or alkali metal selenite; and, in certain preferred baths, antimony in the form of an alkali metal carboxylic acid salt. The bath is designed to be operated at high current densities of from 200 to 5,000 ASF, i.e. about 20 to 500 ASD. The process of utilizing such as electrolytic bath is also disclosed and claimed.