Patents Represented by Attorney Slater & Matsil, L.L.P.

Find this attorney in the Justia Lawyer Directory

  • Fixing full-chip violations using flip-flops
    Patent number: 8316340
    Abstract: A method of forming an integrated circuit includes providing a first design of the integrated circuit; analyzing the first design to identify a first flip-flop having setup/hold violations and a second flip-flop not having setup/hold violations; and replacing the first flip-flop with a third flip-flop having a substantially same cell delay as the first flip-flop to form a second design of the integrated circuit. The first flip-flop and the third flip-flop have different setup and hold windows.
    Type: Grant
    Filed: May 3, 2010
    Date of Patent: November 20, 2012
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventor: Wen-Hao Chen
  • Methods of optical proximity correction
    Patent number: 8316327
    Abstract: Systems and methods of optical proximity correction are disclosed. A preferred embodiment comprises a method of determining optical proximity correction, which includes providing a design for a lithography mask. The design comprises a layout for a material layer of a semiconductor device. A predicted wafer image producible by the design for the lithography mask is calculated, and an amount of error between a target image and the calculated predicted wafer image is measured over a plurality of pixels of the predicted wafer image. The plurality of pixels comprises a plurality of different sizes.
    Type: Grant
    Filed: April 19, 2011
    Date of Patent: November 20, 2012
    Assignee: Infineon Technologies AG
    Inventor: Klaus Herold
  • Optoelectronic component and method for the manufacture of a plurality of optoelectronic components
    Patent number: 8314430
    Abstract: An optoelectronic component with a semiconductor body includes an active region suitable for generating radiation, and two electrical contacts arranged on the semiconductor body. The contacts are electrically connected to the active region. The contacts each have a connecting face that faces away from the semiconductor body. The contact faces are located on a connection side of the component and a side of the component that is different from the connection side is mirror-coated. A method for the manufacture of multiple components of this sort is also disclosed.
    Type: Grant
    Filed: April 25, 2008
    Date of Patent: November 20, 2012
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Stefan Illek, Andreas Ploessl, Alexander Heindl, Patrick Rode, Dieter Eissler
  • Method, system and board apparatus for implementing automatic protection switching between active board and standby board
    Patent number: 8315155
    Abstract: A method for implementing Automatic Protection Switching (APS) between an active board and a standby board includes detecting Synchronous Digital Hierarchy (SDH) data of main services, wherein the SDH data is received by a working port of the active board from a working line. If the SDH data received by the working port is detected as abnormal, SDH data of main services received by a protection port of the standby board is selected from a protection line, and service processing is performed for the SDH data.
    Type: Grant
    Filed: June 29, 2010
    Date of Patent: November 20, 2012
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Yaowen Zhang, Guojun Zou
  • Methods for forming programmable transistor array comprising basic transistor units
    Patent number: 8314635
    Abstract: A method of designing integrated circuits includes providing a first chip and a second chip identical to each other. Each of the first chip and the second chip includes a base layer including a Logic Transistor Unit (LTU) array. The LTU array includes LTUs identical to each other and arranged in rows and columns. The method further includes connecting the base layer of the first chip to form a first application chip; and connecting the base layer of the second chip to form a second application chip different from the first application chip.
    Type: Grant
    Filed: November 12, 2009
    Date of Patent: November 20, 2012
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Oscar M. K. Law, Kuo H. Wu
  • Hole first hardmask definition
    Patent number: 8313959
    Abstract: A semiconductor device and a method of manufacture are provided, such as a MTJ device and a method of manufacturing a MTJ device. The MTJ device may include a bottom electrode, a MTJ stack, and a top electrode, wherein the top electrode is formed using a hole-filling technique. The top electrode may have slanted sidewalls. The MTJ stack may be formed by depositing corresponding MTJ layers. A patterned mask may be formed and patterned over the MTJ layers to form an opening defining the top electrode. The opening is filled with a conductive material to form the top electrode. The top electrode is then used as a mask to pattern the MTJ layers, thereby forming a MTJ stack.
    Type: Grant
    Filed: August 17, 2011
    Date of Patent: November 20, 2012
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Hang Huang, Shih-Chang Liu, Chern-Yow Hsu, Fu-Ting Sung, Chia-Shiung Tsai
  • System and method for scheduling of spectrum sensing in cognitive radio systems
    Patent number: 8315645
    Abstract: System and method for scheduling spectrum sensing in cognitive radio systems. A method comprises sensing an availability of a spectrum band, computing a duration of an inter-sensing time block based on the availability of the spectrum band, and scheduling an occurrence of the spectrum sensing operation using the duration of the inter-sensing time block. Computing the duration of the inter-sensing time block based on the availability of the spectrum band allows for an optimization of communications of the cognitive radio system, thereby increasing spectral efficiency and reducing interference to licensed communications.
    Type: Grant
    Filed: October 24, 2008
    Date of Patent: November 20, 2012
    Assignee: FutureWei Technologies, Inc.
    Inventors: Xiangwei Zhou, Young Hoon Kwon, Anthony C. K. Soong
  • Electroluminescent organic semiconductor element and a method for repair of an electroluminescent organic semiconductor element
    Patent number: 8314418
    Abstract: An electroluminescent organic semiconductor element includes a substrate and a first electrode arranged on the substrate. The semiconductor element additionally contains a second electrode and at least one organic layer, which is arranged between the first electrode and the second electrode. The organic layer is a layer that generates light by recombination of charge carriers. At least one of the first and the second electrode contains a highly conductive organic sublayer.
    Type: Grant
    Filed: February 1, 2008
    Date of Patent: November 20, 2012
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Markus Klein, Tilman Schlenker
  • System and method for rate matching to enhance system throughput based on packet size
    Patent number: 8316286
    Abstract: A system and method for rate matching to enhance system throughput based on packet size is provided. A method for transmitting information includes encoding a block of N bits, where N is an integer, demultiplexing the encoded block of N bits into at least one subblock of systematic bits and at least one subblock of parity bits, and permuting the at least one subblock of systematic bits and the at least one subblock of parity bits to generate at least one permuted subblock. The method also includes forming at least one output block from the at least one permuted subblock, computing a starting position of a redundancy version for a hybrid automatic repeat request (HARQ) transmission based on a relationship between N and a threshold, and transmitting the redundancy version. The redundancy version begins at the computed starting position and ends when a specified number of bits has been transmitted.
    Type: Grant
    Filed: September 4, 2009
    Date of Patent: November 20, 2012
    Assignee: FutureWei Technologies, Inc.
    Inventors: Jung Woon Lee, Shiau-He Tsai, Anthony C. K. Soong
  • System and method of dosage profile control
    Patent number: 8309444
    Abstract: A system and method for controlling a dosage profile is disclosed. An embodiment comprises separating a wafer into components of a grid array and assigning each of the grid components a desired dosage profile based upon a test to compensate for topology differences between different regions of the wafer. The desired dosages are decomposed into directional dosage components and the directional dosage components are translated into scanning velocities of the ion beam for an ion implanter. The velocities may be fed into an ion implanter to control the wafer-to-beam velocities and, thereby, control the implantation.
    Type: Grant
    Filed: July 7, 2010
    Date of Patent: November 13, 2012
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Keung Hui, Chun-Lin Chang, Jong-I Mou
  • System and method for 3D integrated circuit stacking
    Patent number: 8309396
    Abstract: A method and system of stacking and aligning a plurality of integrated circuits. The method includes the steps of providing a first integrated circuit having at least one funnel-shaped socket, providing a second integrated circuit, aligning at least one protrusion on the second integrated circuit with the at least one funnel-shaped socket, and bonding the first integrated circuit to the second integrated circuit. The system includes a first integrated circuit having at least one funnel-shaped socket, a metallization-diffusion barrier disposed on the interior of the funnel-shaped socket, and a second integrated circuit. The at least one funnel-shaped socket is adapted to receive a portion of the second integrated circuit.
    Type: Grant
    Filed: November 12, 2009
    Date of Patent: November 13, 2012
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventor: Kai-Ming Ching
  • System and method for producing devices including a semiconductor part and a non-semiconductor part
    Patent number: 8309465
    Abstract: A system produces devices that include a semiconductor part and a non-semiconductor part. A front end is configured to receive a semiconductor part and to process the semiconductor part. A back end is configured to receive the processed semiconductor part and to assemble the processed semiconductor part and a non-semiconductor part into a device. A transfer device is configured to automatically handle the semiconductor part in the front end and to automatically transfer the processed semiconductor part to the back end.
    Type: Grant
    Filed: January 21, 2011
    Date of Patent: November 13, 2012
    Assignee: Infineon Technologies AG
    Inventors: Oskar Neuhoff, Tobias Gamon, Norbert Martin Haueis, Dirk Pikorz, Michael Wolfgang Larisch, Franz Reithner
  • Method for processing telephone call
    Patent number: 8311198
    Abstract: A method for processing telephone call includes: access number configuration information corresponding to a called number is stored in an access number configuration equipment in a communication system; the calling party requests for the pre-call registration in the communication system, the communication system adds a corresponding pre-call registration record into a pre-call registration list according to the access number configuration information; the calling party initiates the call to the called party, after the communication system receives the call request of the calling party and before calling the called party, the communication system determines whether the calling party has been registered in the pre-call registration list, if the calling party has been registered, connects the call request and initiates the call to the called party; otherwise, refuses to initiate the call to the called party.
    Type: Grant
    Filed: April 29, 2006
    Date of Patent: November 13, 2012
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Zhengwei Wang, Qian Sun
  • Crack stops for semiconductor devices
    Patent number: 8309435
    Abstract: Crack stops for semiconductor devices, semiconductor devices, and methods of manufacturing semiconductor devices are disclosed. In one embodiment, a barrier structure for a semiconductor device includes a plurality of substantially V-shaped regions. Each of the plurality of substantially V-shaped regions is disposed adjacent another of the plurality of substantially V-shaped regions.
    Type: Grant
    Filed: June 14, 2011
    Date of Patent: November 13, 2012
    Assignee: Infineon Technologies AG
    Inventors: Erdem Kaltalioglu, Michael Beck
  • System and method for driving a cascode switch
    Patent number: 8310281
    Abstract: In accordance with an embodiment, a method of driving switches includes sensing a control node of a first switch, sensing a control node of a second switch, and driving the control node of the first switch to a first active state after the control node of the second switch transitions to a second active state. The method also includes driving the control node of the second switch to a second inactive state after the control node of the first switch transitions to a first inactive state. Driving the control node of the first switch is based on sensing the control node of the second switch, and driving the control node of the second switch is based on based on sensing the control node of the first switch.
    Type: Grant
    Filed: November 30, 2010
    Date of Patent: November 13, 2012
    Assignee: Infineon Technologies AG
    Inventor: Dieter Draxelmayr
  • Electronic device and manufacturing method thereof
    Patent number: 8310027
    Abstract: Embodiments relate to a bipolar transistor that includes a body region having a fin structure. At least one terminal region may be formed over at least a portion of the body region. The at least one terminal region may be formed as an epitaxially grown region. Embodiments also relate to a vertically integrated electronic device that includes a first terminal region, a second terminal region and a third terminal region. The second terminal region may be arranged over at least a portion of the third terminal region, and at least two of the first, second and third terminal regions may be formed as epitaxially grown regions.
    Type: Grant
    Filed: June 12, 2008
    Date of Patent: November 13, 2012
    Assignee: Infineon Technologies AG
    Inventors: Christian Russ, Christian Pacha, Snezana Jenei, Klaus Schruefer
  • Memory management in network processors
    Patent number: 8312243
    Abstract: System and method for storing information units is provided. The system includes a memory comprising a plurality of contiguous memory segments, a local memory storing a plurality of pointers, each pointer pointing to one contiguous memory segment, a receiving unit configured to arrange incoming information units into queues and memory control logic configured to allocate pointers to the queues and configured to cause the incoming information units to be written into contiguous memory segments. The incoming information units form at least one queue and wherein pointers form a linked list of pointers if the information units are written into more than one contiguous memory segment.
    Type: Grant
    Filed: July 16, 2009
    Date of Patent: November 13, 2012
    Assignee: Lantiq Deutschland GmbH
    Inventors: Shreeharsha Balan, Naveed Alam, Joby Abraham
  • Impact initiated venting system and method of using same
    Patent number: 8307767
    Abstract: An initiator includes a detonation port and a reactive panel coupled with the detonation port. The reactive panel includes an inner panel, an outer panel, and an explosive sheet disposed between the inner panel and the outer panel and operatively associated with a venting device. A system for venting a container includes a venting device and an initiator coupled with the venting device. The initiator includes a detonation port and a reactive panel coupled with the detonation port. The reactive panel includes an inner panel, an outer panel, and an explosive sheet disposed between the inner panel and the outer panel and operatively associated with the venting device. A method of venting a container includes providing a venting system operatively associated with a container, detonating an explosive sheet of the venting system, and venting the container as a result of detonating the explosive sheet.
    Type: Grant
    Filed: May 2, 2005
    Date of Patent: November 13, 2012
    Assignee: Lockheed Martin Corporation
    Inventors: Anthony T. Skinner, Michael L. Fortner
  • Process for eliminating delamination between amorphous silicon layers
    Patent number: 8309441
    Abstract: One embodiment is a method of forming a circuit structure. The method comprises forming a first amorphous layer over a substrate; forming a first glue layer over and adjoining the first amorphous layer; forming a second amorphous layer over and adjoining the first glue layer; and forming a plurality of posts separated from each other by removing a first portion of the first amorphous layer and a first portion of the second amorphous layer. At least some of the plurality of posts each comprises a second portion of the first amorphous layer, a first portion of the first glue layer, and a second portion of the second amorphous layer.
    Type: Grant
    Filed: July 5, 2011
    Date of Patent: November 13, 2012
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jiou-Kang Lee, Chun-Ren Cheng, Shang-Ying Tsai, Ting-Hau Wu, Hsiang-Fu Chen
  • Electronic module and a process for operating a system module
    Patent number: 8312191
    Abstract: The invention relates to an electronic module, in particular a micro-processor and/or micro-controller module, and a process for operating a system module, able to be connected with a bus, in particular a LIN bus system. The process includes operating the system module in a first operating mode, and operating the system module in a second operating mode, when, within a pre-determined time period after the start of the first operating mode, a mode start and/or mode change signal—not provided for by the system protocol—is received via the bus system.
    Type: Grant
    Filed: November 29, 2005
    Date of Patent: November 13, 2012
    Assignee: Infineon Technologies AG
    Inventors: Andreas Jansen, Tan Ban Huat