Abstract: A semiconductor device package contains column leads which are electrically connected to a chip. The column leads, chip and electrical connection means are encapsulated to form a package body, from which the column leads extend for connection to a substrate such as a printed circuit board. A lead frame for the column leads can be formed by etching the column leads and a die pad out of a section of column lead material with a polyimide layer backing. Alternatively, a lead frame having parallel side rails on either side of a die pad can be used as an assembly frame for rows of column leads. Mass production of this package body using either type of lead frame produces high reliability packages in a simple and cost-effective way.

Abstract: An atomic instruction is executed without the use of a dedicated atomic unit. A store instruction is transmitted from a front-end of one of a plurality of processors to a write-cache to cause the write-cache to obtain exclusive access to a control memory of a shared resource. A first signal is then transmitted to the front end of the processor indicating that the write-cache has obtained exclusive access to the control memory of the shared source. At least one next instruction is executed, and a second signal is transmitted from the front end to the write cache indicating that execution of the at least one next instruction has been completed. Data from the write cache is stored in the control memory of the shared resource in response to the second signal transmitted to the write cache.

Abstract: A staticized flop circuit converts a dynamic signal appearing across the output of a logic circuit into a static signal, and includes a dynamic-to-static convertor which minimizes glitching in the static output. The dynamic-to-static convertor includes a pull-down device, operatively coupled between an output node and a ground, which is closed while an input node is at a precharge potential and which is open while the input node is at a ground potential, and a pull-up device, operatively coupled between a source voltage and the output node, which is closed while the input node is at the ground potential and which is open while the input node is at the precharge potential.

Abstract: A method of concentrating chemicals for semiconductor devices, which includes the steps of heating a sample container by using a high-energy light source, vaporizing the chemicals by injecting a high-temperature gas into the sample container through an injection opening in the sample container and discharging the vaporized chemicals by the pressure of the gas through a gas outlet formed on the sample container. An apparatus of concentrating chemicals for semiconductor devices includes a sample container having a sample-supply window, a gas-injection opening and a gas outlet. A high-energy light source heats the sample container and a gas-supply source supplies the gas through a gas-injection opening in the sample container. A gas-heating device located between the sample container and the gas-supply source heats the gas provided by the gas-supply source.

Abstract: A semiconductor memory device includes a memory array for outputting data stored in a memory cell at an address corresponding to an address signal generated according to an address control signal synchronized with a clock pulse, a data reading circuit for reading a data signal outputted from the memory array, an activation signal generating circuit for receiving a delay signal generated based on the address signal and generating an activation signal for activating the data reading circuit to read the data signal outputted from the memory array into the data reading circuit, and a data output circuit for outputting a data signal outputted from the data reading circuit according to the input of an output enable signal synchronized with the clock pulse.

Abstract: An apparatus for thermal processing of semiconductor wafers includes a table having in lateral sequence a heating chamber, a holding chamber, and a cassette stage and a boat for holding the wafers being processed. The apparatus further includes a boat transfer part for moving the boat between the holding chamber and the heating chamber, a wafer charging part for transferring the wafers loaded in a cassette on the cassette stage to the boat while it is in the holding chamber, and a wafer discharging part for transferring the wafers loaded in the boat back to the cassette on the cassette stage.

Abstract: A semiconductor chip is provided comprising a semiconductor substrate having determined circuit elements on it, a surface-smoothing layer deposited on the substrate, a bonding pad formed on the smoothing layer and connected electrically to the circuit elements, a passivation layer formed on the surface-smoothing layer, the passivation layer having a window for exposing a part of the bonding pad, and a second metal layer having a same height as the passivation layer and occupying peripheral parts of the window to form a reduced bonding windows for the bonding pad.

Abstract: To make a read/write test on a redundant memory and to realize the detection of faults of the redundant memory cell array in advance, there are provided a first control circuit which inhibits the activation of word lines for selecting a normal memory cell array in response to a test signal and a second control circuit which activates redundant word lines for selecting a redundant memory cell array in response to the test signal.

Abstract: The present invention provides a method for inspecting only a contamination which there is a possibility to have an actual influence during exposure on a mask. In this method, a mask comprises at least two areas, each of which has a shade pattern, a first inspection light is introduced to the one face of a first area, a second inspection light to another face of a second area. An image transmitting through the first area and an image reflected by the second area are received and composed to obtain a first composite image. Then, an image reflected by the first area and an image transmitting through the second area are received and composed to obtain a second composite image. Thereafter, a contamination on the mask is indicated based on the first composite image and the second composite image.

Abstract: A data sampling circuit samples radio signal data made up of plural successive sets of data, each set of data having a given number of data bits. A first shift register holds and shifts the data bits of the radio signal data to successively obtain sampled radio signal data for each set of data of the radio signal data. A data holding section successively receives and holds each set of the sampled radio signal data held by the first shift register. Also, a processor successively receives, bit by bit, each set of sampled radio signal data held by the data holding section, and processes each set of sampled radio signal data in accordance with a given processing procedure. The data holding section completes reception of each set of sampled radio signal data from the first shift register before the first shift register holds a first data bit of each next set of data of the radio signal data.

Abstract: A lead-on-chip semiconductor device package is formed by attaching a lead frame having a single adhesive layer to a semiconductor chip. Electrode pads of the chip are electrically connected by bonding wires and mechanically connected by the adhesive layer to the lead frame, and then encapsulated by an encapsulant such as molding compound. The adhesive layer is formed from a liquid adhesive having a certain viscosity. The adhesive material is continuously applied to spaces between adjacent inner leads as well as the top surface of the leads and then cured. The leads are disposed at the same intervals and include some side leads with a larger width in order to form the adhesive layer with a uniform thickness. Thermoplastic resins are preferably used as the adhesive, but thermosetting resins may be used as well. In the case of thermoplastic resins, the temperature of a cure step is about 200.degree. C. and that of chip attachment step is about 400.degree. C.

Abstract: A semiconductor wafer cleaning apparatus is disclosed including a cleaning solution supply line for supplying a cleaning solution to a surface of a wafer, one end of which is connected to a cleaning solution supply source. A gas supply line is connected to a gas supply source to supply a gas to the surface of the wafer. A nozzle assembly is connected to respective second ends of the cleaning solution supply line and the gas supply line, the nozzle assembly having a spray nozzle facing the surface of the wafer, wherein the cleaning solution and gas supplied are mixed in the nozzle assembly.