Abstract: An electronic device has a case enclosing at least one heat producing component. The at least one heat producing component is capable of transmitting heat energy outside of the case. The electronic device further has a thermal sensor connected to control logic that is capable of sensing the heat energy outside of the case. The control logic is coupled to the at least one heat producing component such that it is capable of regulating the heat energy from the at least one heat producing component in response to the sensed heat energy from the thermal sensor.

Abstract: A print cartridge is used in a printing system in which there is a requirement to provide two distinct rates of ink usage corresponding to two different types of printing done with the printing system. The print cartridge includes an ink replenishment path which selectively provides two flow rates into the print cartridge. The print cartridge also includes a controller which selects one of the two flow rates into the print cartridge based on which type of printing is being performed by the printing system.

Abstract: A power adapter for an electronic device, such as a notebook computer, includes a speaker to generate low audio frequencies, such as below 150 Hz. The speaker can be mounted in a variety of arrangements, i.e. closed-box, bass-reflex, or a more intricate shape which adds resonance (poles and zeros) to the acoustic filtering properties of the enclosure. An exemplary bass-reflex mounting includes a driver with resonance at 140 Hz, a chamber size of 7.74 in3 and a port determined by Thiele-Small equations. This gives a low frequency response beginning at 70 Hz. This low frequency component is combined in free space with the higher frequency components emanating from the portable electronic device's internal speaker(s). The audio signal connection can be made when the AC adapter is connected to the notebook computer by using two additional wires in the power cord. Since users generally carry their AC adapters with them, they can enjoy full harmonic sound without taking anything extra along.

Abstract: A process for creating and an apparatus employing reentrant (pointing or directed inward) shaped orifices in a semiconductor substrate. A layer of graded dielectric material is deposited on the semiconductor substrate. A masked photoimagable material is deposited upon the graded dielectric material and exposed to electromagnetic energy such that a patterned photoimagable material is created. The patterned photoimagable material is developed to unveil the graded dielectric material which is then anisotropically etched. The bore in the graded dielectric material is then isotropically etched to complete the creation of holes in the substrate.

Abstract: An electronic device has a heat producing component thermally coupled to a heat dissipation structure. The electronic device further has control circuitry connected to a temperature sensor that senses the component temperature of the heat producing component. The control circuit is further connected to a cooling device also thermally coupled to the heat dissipation structure. The control circuit varies the cooling rate in a manner that cancels out a lag time which occurs during a change from a steady state condition of the component temperature. The cooling rate of the cooling device is varied by the control circuit in proportion to variation in sensed component temperature from the temperature sensor.

Abstract: An inkjet storage container sealing mechanism is comprised of a cover, a receptacle, a gasket compressed normal to its insertion and a support member to maintain a seal that is resistant to ink and air penetration. The receptacle has sidewalls that form an opening. A gasket is stretched over a portion the cover, then the gasket and the portion of the cover is inserted into the opening of the receptacle. The gasket forms a seal between the cover and the receptacle. The compressive forces acting on the gasket to form the seal do not contribute additional forces to a mechanical joining mechanism, which attaches the cover to the receptacle. The support member prevents the sidewalls of the receptacle from deflecting to help maintain the seal.

Abstract: An electronic device has a heat pipe containing a heat transfer fluid. The heat pipe has a first section and a second section. Inside the heat pipe is a valve disposed between the first section and second section of the heat pipe. The valve has an actuator that is used to regulate the flow of the heat transfer fluid between the first section and the second section of the heat pipe in response to a changed state detected by a sensor.

Abstract: A process for creating and an apparatus employing shaped orifices in a semiconductor substrate. A first layer of material is applied on the semiconductor substrate then a second layer of material is then applied upon the first layer of material. An orifice image is then transferred to the first layer of material and a fluid-well image is transferred to the second layer of material. That portion of the second layer of material where the orifice image is located is then developed along with that portion of the first layer of material where the fluid well is located to define an orifice in the substrate.

Abstract: A printhead for ejecting fluid has a nozzle on a first surface and a fluid feed channel defined within a second surface. The printhead includes an aggregate of thin-film layers, a portion of which is exposed by the fluid feed channel. The aggregate of thin-film layers contains at least one energy dissipation element suspended over the fluid feed channel. A heat spreader is mesially interposed within the aggregate of thin-film layers. The heat spreader proximally abuts to the energy dissipation element and extends from the energy dissipation element to extend past the fluid feed channel definition. The heat spreader is capable of dissipating heat from the energy dissipation element to a portion of the first surface of the printhead.

Abstract: An electronic device has a heat pipe containing a heat transfer fluid. The heat pipe has a first section and a second section. Inside the heat pipe is a valve disposed between the first section and second section of the heat pipe. The valve has an actuator that is used to regulate the flow of the heat transfer fluid between the first section and the second section of the heat pipe in response to a changed state detected by a sensor.

Abstract: A controller drives a fan's motor to proportionally control fan speed based on changes in heat output from electrical components in a local environment. The controller is connected to a temperature sensor and the fan motor. The temperature sensor senses local environment temperature, while exhibiting a lag time. The controller provides closed loop control and implements a system pole which cancels out the temperature sensor lag time during steady state operations. The controller implements an integration of a difference between sensed temperature and a reference temperature to generate the system pole.

Abstract: A one-shot air purge apparatus for an inkjet cartridge for removing air accumulated within the cartridge. The inkjet cartridge comprises a print cartridge base and a replaceable ink receptacle. The replaceable ink receptacle comprises an ink supply coupled to an ink supply seal and a vacuum chamber coupled to an air purge seal. The print cartridge base comprises a printhead, a sub-receptacle coupled to the printhead and an ink supply needle which has an eyelet, an air pocket reserve in which the air accumulates coupled to an air purge needle that has an eyelet. The ink supply needle eyelet is coupled to the ink supply seal before the air purge needle eyelet is coupled to the air purge seal of the vacuum chamber.

Abstract: A heat conductive substrate is mounted within a through-opening of a printed circuit board. An integrated circuit then is mounted to one side of the heat conductive substrate, while a heat sink is fixed in thermal contact to the other side of the substrate. There is no direct thermal contact between the IC and the PC board. The heat conductive substrate is mounted to the PC board by applying a controlled pressure to normal surfaces of multiple portions of the substrate. Such pressure reducing the thickness and expands the area of the pressed portions locking the substrate to the PC board. An air gap occurs between the substrate and the PC board everywhere except for the pressed regions of the substrate. Such pressed regions occur along the periphery of the substrate.

Abstract: A notebook computer has a lower housing with a keyboard and an upper housing with a display, a central processing unit (CPU), and a conductive plate. The CPU is attached directly to the conductive plate to achieve maximum heat transfer. The conductive plate is exposed to the air outside the notebook computer through air vents in the upper housing. Other heat generating elements in the upper housing are directly attached to thermally isolated islands within the conductive plate to allow each element to maintain a separate operating temperature while still conducting heat out of the notebook computer to the outside air. Additionally, the conductive plate is used as part of an electromagnetic interference enclosure to reduce unwanted radiation from leaving the notebook.

Abstract: A controller drives a fan's motor to proportionally control fan speed based on changes in heat output from electrical components in a local environment. The controller is connected to a temperature sensor and the fan motor. The temperature sensor senses local environment temperature, while exhibiting a lag time. The controller provides closed loop control and implements a system pole which cancels out the temperature sensor lag time during steady state operations. The controller implements an integration of a difference between sensed temperature and a reference temperature to generate the system pole.