Abstract: The present invention relates to a delivery door having anti-theft security means, more particularly to a door structure consists of a pair of casings, area adjustable mounting plate, hinge means and actuation means, which are installed on an entrance door or a window for delivering articles or products thereof. A delivery door installed on an entrance door or a window comprise an outer casing (4) and an inner casing (5) pivotally mounted on hinge means (3, 8, 9, 10), actuation means (12, 13, 15, 16) associated with the outer casing (4) and the inner casing (5) for opening and closing operation of casings and the mounting plate (6) having area adjustable means between the outer casing (4) and the inner casing (5) is characterized in that the mounting plate (6) is rotatable while in the transporting operation which securely controlled by the actuation means.

Abstract: The present invention relates to a sun visor with a variety of office apparatuses that is capable of handling a user's work in a car. The sun visor with the variety of apparatuses with a keyboard that are mounted in an attachable and detachable manner, such that when the apparatuses are attached on the sun visor, the sun visor functions to prevent the driver's eyes from bright sunshine, and when they are detached therefrom, they can be available on a steering wheel in a car, the sun visor includes a holding frame to which the office work apparatus detachably mounted, and a frame fixing member which installed to a ceiling of a vehicle, the frame fixing member detachably engaging with the holding frame.

Abstract: A flip chip semiconductor device having an improved structure and a method of manufacturing the flip chip semiconductor device, in which a semiconductor chip can be more securely joined to a lead frame while preventing contact defects between the two. The flip chip semiconductor device includes: a semiconductor chip having electrode pads formed on one side; conductive bumps formed on the electrode pads of the semiconductor chip; and a lead frame including a plurality of leads, the ends of which are electrically connected to the conductive bumps, wherein each of the leads has at least one groove formed thereon, and a solder plating layer is provided on the leads in and about the groove and melted to secure the connection with the conductive bumps.

Abstract: A parent or master substrate for a semiconductor package is provided, which can provide a plurality of unit substrates by cutting into pieces for producing a semiconductor device. The parent substrate includes an insulation layer, conductor patterns formed on first and second surfaces of the insulation layer, and PSR (photo solder resist) layers respectively formed on the first and second surfaces of the insulation layers and covering the conductor patterns. The parent substrate includes an upper part and a lower part divided by a reference surface which passes through the center of the insulation layer. When an equivalent thermal expansion coefficient ?upper of the upper part is defined by the Equation of ? upper = ? i = 1 n ? ? i × E i × v i ? i = 1 n ? E i × v i , where ?i is respective thermal expansion coefficients of, Ei is respective elastic moduli of, and vi is respective volume ratios of first through nth components constituting the upper part (e.g.

Abstract: Disclosed herein is a novel gene which is isolated from Arabidopsis thaliana and shows senescence-specific expression. The expression of the gene is under the regulation of a promoter which is also disclosed herein. The gene in combination with the promoter can be utilized at the molecular level to control plant senescence in an environmentally friendly manner.

Abstract: Disclosed herein is a method and a lotto supply server of providing lotto using a bill or a receipt of a credit or debit card, and utilizing the front and the back side of a receipt or a lotto as an advertising space, in which, a financial VAN company accumulates and manages the paid back money for financial resources to purchase lotto, and a real lotto number printed on a bill or a receipt is provided to a user, thereby increasing sales of a member store due to customers who use credit or debit cards.

Abstract: A method of managing a user's data files in a portable digital apparatus which can receive and discharge a recording medium and has a display device. In the method, first, when a representative-voice request signal is received from a user, a new directory and a representative-voice file corresponding to the new directory are produced or stored in the recording medium. Next, the user is guided to record a representative voice message for the directory, and simultaneously, user's representative-voice recording data produced from the voice message are stored in the representative-voice file. Thereafter, if user data files are produced, the produced user data files are stored in the new directory. Then, if a reproduction-mode signal used to reproduce the data files is received from the user, a representative data file of each of the directories is displayed, and the representative-voice file corresponding to the directory of a representative data file selected by the user is reproduced.

Abstract: Provided is a computer with a case and a plurality of parts, including heat generating components that generate heat when operated, installed in the case, wherein the case includes a plurality of plates, and heat generated by at least one of the heat generating components when operated is transmitted to at least one of the plates via a heat conduction unit, which connects the at least one of the heat generating parts and the plate, and externally dissipated from the case. The heat generating components mounted in the case can be noiselessly and efficiently cooled without a noise-generating cooling fan.

Abstract: A gas turbine engine includes an interstage seal assembly positioned in a plenum between the compressor section and turbine section. The seal assembly includes an annular seal member positioned in the plenum adjacent to the compressor section for restraining a fluid flow between the compressor section and the turbine section, and an annular heat shield member positioned in the plenum adjacent to the turbine section for limiting heat transfer from the turbine section to the compressor section. The annular heat shield member includes a plurality of slots formed on a surface of the heat shield member in a radial direction of the annular heat shield member.

Abstract: Provided is a method of producing a semiconductor package including at least two rows of leads in which the leads of each row separately connecting a semiconductor chip to an external substrate. The method includes: forming a lead frame, the lead frame including a die pad and a plurality of leads arranged about the die pad; attaching an adhesive tape to a surface of the lead frame covering at least substantially the die pad and the plurality of leads; removing portions of the leads and the adhesive tape disposed in a dividing region and thereby separating at least some of the plurality of leads to form multiple rows of leads; and mounting a semiconductor chip on the die pad, electrically connecting the semiconductor chip with the lead frame, and molding the lead frame and the semiconductor chip to provide a semiconductor package. The adhesive tape attached at undesirable locations of the lead frame is preferably removed after provision of the semiconductor package.