Patents Assigned to AAC Acoustic Technologies (Shenzhen) Co. Ltd.
  • Patent number: 11974109
    Abstract: Provided is an MEMS device, including: a base, a rear cavity; a vibrating diaphragm, the vibrating diaphragm including an upper diaphragm and a lower diaphragm, and an accommodation space being formed between the upper and lower diaphragms; a counter electrode arranged in the accommodation space; and supporting members concentrically arranged and spaced apart. The supporting members are arranged between the upper and lower diaphragms and are spaced apart from the counter electrode, two opposite ends of each supporting member are connected to the upper and lower diaphragms, and at least one of the supporting members is provided with first cavities. An upper ventilation hole and a lower ventilation hole are respectively formed at a position of the upper diaphragm and a position of the lower diaphragm corresponding to one of the first cavities; and the upper ventilation hole, the first cavity and the lower ventilation hole communicate with each other.
    Type: Grant
    Filed: May 27, 2022
    Date of Patent: April 30, 2024
    Assignee: AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD.
    Inventors: Euan James Boyd, Scott Lyall Cargill
  • Patent number: 11968497
    Abstract: The present invention discloses a Micro-Electro-Mechanical System MEMS) chip including a substrate with a back cavity; a capacitance system disposed on the substrate including a back plate, a membrane opposite to the back plate forming an inner cavity; a protruding portion accommodated in the inner cavity, fixed on one of the back plate and the membrane and spaced apart from the other along a vibration direction; a reinforce portion fixed to the membrane, having an area smaller than that of the membrane; a support system configured to support the capacitance system, including a first fixation portion suspending the membrane on the substrate, and a second fixation portion suspending the back plate on the substrate. The MEMS chip has higher sensitivity, higher resonance frequency and higher low frequency property.
    Type: Grant
    Filed: May 9, 2022
    Date of Patent: April 23, 2024
    Assignee: AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD.
    Inventors: Zhengyu Shi, Linlin Wang, Rui Zhang
  • Patent number: 11950053
    Abstract: The present invention discloses a MEMS chip including a substrate with a back cavity; a capacitance system disposed on the substrate including a back plate, a membrane opposite to the back plate forming an inner cavity; a protruding portion accommodated in the inner cavity, fixed on one of the back plate and the membrane and spaced apart from the other along a vibration direction; a support system configured to support the capacitance system, including a first fixation portion suspending the membrane on the substrate, and a second fixation portion suspending the back plate on the substrate; the protruding portion comprises an annular first protruding portion and an annular second protruding portion surrounding the first protruding portion. The MEMS chip has higher sensitivity, higher resonance frequency and higher low frequency property.
    Type: Grant
    Filed: May 9, 2022
    Date of Patent: April 2, 2024
    Assignee: AAC Acoustic Technologies (Shenzhen) Co., Ltd.
    Inventors: Zhengyu Shi, Linlin Wang, Rui Zhang
  • Patent number: 11950054
    Abstract: Provided is a MEMS condenser microphone, including a base plate, a spacer and a membrane. The membrane is supported above the base plate by the spacer. The base plate, the spacer, and the membrane enclose a vacuum cavity. An end of the membrane close to the vacuum cavity is connected, by means of a connecting rod, to an electrostatic clutch. The electrostatic clutch is connected to a capacitive sensing structure. The microphone has the advantage of allowing microphone performance over a wide range of atmospheric pressures which is likely expected by customers. This is achieved electrostatically in a purely passive way which has an advantage over other designs which require complex electronics and active control. Physically decoupling the membrane and sense structure simplifies the design of the sense structure as only small AC perturbations of the rotor need to be considered with no DC changes in rotor position.
    Type: Grant
    Filed: June 28, 2022
    Date of Patent: April 2, 2024
    Assignee: AAC Acoustic Technologies (Shenzhen) Co., Ltd.
    Inventors: Anup Patel, Euan James Boyd, Yannick Pierre Kervran
  • Patent number: 11917366
    Abstract: An MEMS optical microphone, including: a shell including an inner cavity and a sound inlet that communicates the inner cavity with outside; an MEMS module including a diaphragm suspended in the inner cavity, when an acoustic pressure is applied, an aperture is formed in the diaphragm, and the size of the aperture increases or decreases with the magnitude of the acoustic pressure applied to the diaphragm; an optoelectronic module including an electromagnetic radiation source and a sensor, the electromagnetic radiation source and the sensor are arranged on opposite sides of the diaphragm, and a light beam emitted by the electromagnetic radiation source passes through the aperture and reaches the sensor; and an integrated circuit module electrically connected with the MEMS module and the optoelectronic module. Advantages of high sensitivity and flat frequency response can be achieved, which provides the potential to further improve the performance of the device.
    Type: Grant
    Filed: September 26, 2022
    Date of Patent: February 27, 2024
    Assignee: AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD.
    Inventor: Taimoor Ali
  • Patent number: 11891297
    Abstract: The present invention provides a motion control structure and a actuator. The motion control structure includes a motion platform, a first actuator having a first execution unit arranged on opposite sides of the motion platform along an X-axis direction and a second execution unit arranged on opposite sides of the motion platform along a Y-axis direction. The first execution unit includes a first actuating element displaced along the X-axis direction. The second execution unit includes a second actuating element displaced along the Y-axis direction. A second actuator surrounds an inner periphery of the motion platform and includes a third execution unit having an assembly portion displaced along the Z-axis direction. The motion control structure of the invention has the advantages that the motion platform can be driven to realize motion in six degrees of freedom.
    Type: Grant
    Filed: August 17, 2020
    Date of Patent: February 6, 2024
    Assignee: AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD.
    Inventors: Ze Tao, Wooicheang Goh, Zhan Zhan, Kahkeen Lai, Yang Li
  • Patent number: 11895452
    Abstract: The present invention provides a bone conduction microphone including a housing and a circuit board connected with the housing. The circuit board has an acoustic channel. The microphone further includes a vibration assembly forming a first conduction cavity and a second conduction cavity. The vibration assembly includes a vibration member and a frame. The frame, the vibration member and the circuit board form a first conduction cavity. The frame, the vibration member and the circuit board form a second conduction cavity. The vibration of the vibration member is conducted to one side of the vibration diaphragm, and is also conducted to the other side of the vibration diaphragm. Compared with the related art, the bone conduction microphone of the present invention can effectively improve the sensitivity and the signal to noise ratio.
    Type: Grant
    Filed: May 30, 2022
    Date of Patent: February 6, 2024
    Assignee: AAC Acoustic Technologies (Shenzhen) Co., Ltd.
    Inventors: Zhenkui Meng, Tingting Hong, Kai Wang
  • Patent number: 11889282
    Abstract: Provided is a MEMS device. The MEMS device includes: substrate having back cavity passing therethrough; diaphragm connected to the substrate and covers the back cavity, the diaphragm comprises first and second membranes, and accommodating space is formed between the first and second membranes; supports arranged in the accommodating space, and opposite ends of the support are connected to the first and second membranes; counter electrode arranged in the accommodating space, the first and second membranes each include conductive and second regions, the second region is formed by semiconductor material without doping conductive ions. Through design of the first and second membranes as the first region and the second region, respectively, the second region is formed by semiconductor material without doping conductive ions, and the first region is formed by doping conductive ions in the semiconductor material, so that the compliance performance is improved and not at risk of delamination.
    Type: Grant
    Filed: May 27, 2022
    Date of Patent: January 30, 2024
    Assignee: AAC Acoustic Technologies (Shenzhen) Co., Ltd.
    Inventors: Euan James Boyd, Scott Lyall Cargill, Yannick Pierre Kervran
  • Patent number: 11889248
    Abstract: The present invention provides a MEMS microphone, including: a base with a back cavity; and an electric capacitance system arranged on the base. The electric capacitance system includes a back plate, a first diaphragm and a second diaphragm opposite to the back plate and arranged on an upper and lower sides of the back plate. The MEMS microphone further includes an insulation layer isolating the base, the back plate, the first diaphragm and the second diaphragm, and a sealing space formed between the first diaphragm and the second diaphragm. The pressure in the sealing space is equal to an external pressure.
    Type: Grant
    Filed: December 9, 2019
    Date of Patent: January 30, 2024
    Assignee: AAC Acoustic Technologies (Shenzhen) Co., Ltd.
    Inventors: Zhenkui Meng, Zhengyan Liu
  • Patent number: 11881829
    Abstract: Provided is a method for audio peak reduction using an all-pass filter, including: determining a delay parameter m and a gain parameter g based on a formula (1): arg ? min m , g max n ? "\[LeftBracketingBar]" y m , g ( n ) ? "\[RightBracketingBar]" , ( 1 ) absolute peak map Y ? ( m , g ) = max n ? "\[LeftBracketingBar]" y m , g ( n ) ? "\[RightBracketingBar]" , ym,g(n) represents a processed signal with a time-domain response function and is calculated based on a formula (2): ym,g(n)=(hs*x)(n)(2), where hs represents an impulse response function, x (n) represents an input signal, and hs is calculated based on formula (3): H S ( z ) = g + z - m 1 + gz - m . ( 3 ) This method is widely used in the reproduction, storage and broadcasting of sound, and the computational complexity is small, which is a supplement to the traditional nonlinear compression algorithm.
    Type: Grant
    Filed: April 28, 2022
    Date of Patent: January 23, 2024
    Assignees: AAC Microtech (Changzhou) Co., Ltd., AAC Acoustic Technologies (Shenzhen) Co., Ltd.
    Inventors: Sebastian Schlecht, Leonardo Fierro, Vesa Valimaki, Juha Backman
  • Patent number: 11879758
    Abstract: The present disclosure provides a linear motor including: a housing body with a containment space; a vibrator assembly suspended in the containment space by an elastic member for vibrating along a vibration direction; a stator assembly fixedly connected to the housing body and having a magnetic axis along the vibration direction; and two magnets located on both sides of the magnetic axis and spaced from the stator assembly, including a first magnet section and a second magnet section located on both sides of the first magnet section. A magnetic field strength of the first magnet section along the magnetic axis is greater than a magnetic field strength of the second magnet section along the magnetic axis. The configuration of the invention can effectively reduce the static attraction force of the magnetic circuit, and increase the overall rigidity of the linear motor.
    Type: Grant
    Filed: December 27, 2021
    Date of Patent: January 23, 2024
    Assignee: AAC Acoustic Technologies (Shenzhen) Co., Ltd.
    Inventors: Yang Bai, Yanxin Chen, Rui Zhang
  • Patent number: 11870417
    Abstract: The present disclosure provides a differential resonator and a MEMS sensor. The differential resonator includes a substrate, a first resonator, a second resonator and a coupling mechanism. The first resonator is connected with the second resonator through the coupling mechanism, and the first resonator and the second resonator are connected with the substrate and are able to be displaced relative to the substrate. The coupling mechanism includes a coupling arm, a support shaft, a first connecting piece and a second connecting piece. The coupling arm includes a first force arm, a second force arm and a coupling portion. The support shaft has one end connected with the substrate, and one other end connected with the coupling portion. The first force arm is connected with the first resonator through the first connecting piece, and the second force is connected with the second resonator through the second connecting piece.
    Type: Grant
    Filed: August 6, 2020
    Date of Patent: January 9, 2024
    Assignee: AAC Acoustic Technologies (Shenzhen) Co., Ltd.
    Inventors: Zhan Zhan, Yang Li, Yuwei Liu, Qiuyu Tan, Rui Zhang
  • Patent number: 11838725
    Abstract: The present disclosure discloses a MEMS microphone including a substrate with a back cavity, and an electric capacitance system arranged on the substrate. The electric capacitance system includes a back plate and a diaphragm opposite to the back plate. The back plate includes a body part, a fixing portion connected to the substrate, and a connecting portion connecting the body part and the fixing portion. The diaphragm is fixed to the substrate and located at a side of the back plate close to the substrate. The fixing portion includes a first surface away from the substrate, the first surface includes a first arc surface connected with the body part, the first arc surface protrudes toward a direction away from the substrate. Compared with the related art, MEMS microphone disclosed by the present disclosure has a better reliability.
    Type: Grant
    Filed: December 31, 2021
    Date of Patent: December 5, 2023
    Assignee: AAC Acoustic Technologies (Shenzhen) Co., Ltd.
    Inventors: Zhengyu Shi, Zhuanzhuan Zhao, Rui Zhang
  • Patent number: 11838724
    Abstract: The present disclosure discloses a MEMS microphone including a printed circuit board, a shell assembled with the printed circuit board for forming a receiving space and provided with a sound hole communicating with the receiving space, a MEMS Die with a cavity accommodated in the receiving space and mounted on the shell for covering the sound hole, and an ASIC chip accommodated in the receiving space and mounted on the shell through a substrate. The cavity of the MEMS Die communicates with the sound hole. The MEMS Die electrically connects with the ASIC chip. The ASIC chip electrically connects with the substrate. The substrate electrically connects with the printed circuit board.
    Type: Grant
    Filed: December 30, 2021
    Date of Patent: December 5, 2023
    Assignee: AAC Acoustic Technologies (Shenzhen) Co., Ltd.
    Inventors: Jinyang Li, Kai Wang, Zhiyuan Chen, Rui Zhang
  • Patent number: 11832043
    Abstract: Provided is a microphone, including a base having a back cavity, a diaphragm, a backplate electrode, and a backplate spaced from the diaphragm and defining an inner cavity jointly with the diaphragm. The diaphragm includes a vibration portion, a fixing portion, and a leak hole. The back cavity is communicated with the inner cavity through the leak hole. The backplate is provided with a first through hole. The inner cavity is communicated with outside through the first through hole. The backplate includes a backplate body and a backplate extension portion. The inner cavity includes a first inner cavity and a second inner cavity. The backplate extension portion is provided with a second through hole, and the second inner cavity is communicated with outside through the second through hole. A method for manufacturing the microphone is further provided. The technical solution has better drop performance.
    Type: Grant
    Filed: May 13, 2022
    Date of Patent: November 28, 2023
    Assignee: AAC Acoustic Technologies (Shenzhen) Co., Ltd.
    Inventors: Lanlan Tu, Wooicheang Goh, Kahkeen Lai
  • Patent number: 11805373
    Abstract: The present disclosure discloses a MEMS chip which includes a substrate, a back plate fixed on the substrate, and a membrane fixed on the substrate and located above the back plate. A sealed space is formed between the membrane and the back plate. A support pillar is received in the sealed space. Two ends of the support pillar along a vibration direction of the membrane are separately fixed on the membrane and the back plate. As a result, when decreasing the volume of the back cavity, the resonance frequency of the MEMS chip has been effectively improved and the SNR is simultaneously high. Furthermore, the support pillar can effectively improve the reliability and crack resistance of the membrane.
    Type: Grant
    Filed: December 27, 2021
    Date of Patent: October 31, 2023
    Assignee: AAC Acoustic Technologies (Shenzhen) Co., Ltd.
    Inventors: Zhuanzhuan Zhao, Linlin Wang, Rui Zhang
  • Patent number: 11805372
    Abstract: The present disclosure discloses a MEMS chip including a capacitance system and a substrate with a back cavity. The capacitance system includes a back plate and a membrane; the substrate is located on one side of the membrane away from the back plate, including a first surface opposite to the membrane, a second surface opposite to the first surface, and an inner wall connecting the first surface and the second surface and enclosing the back cavity; the inner wall includes a first opening close to the membrane, having a first width along a first direction perpendicular with a vibration direction of the membrane, and a second opening away from the membrane, having a second width smaller than the first width along the first direction. The resonance frequency of the MEMS chip has been effectively improved and the SNR is simultaneously high.
    Type: Grant
    Filed: December 27, 2021
    Date of Patent: October 31, 2023
    Assignee: AAC Acoustic Technologies (Shenzhen) Co., Ltd.
    Inventors: Zhuanzhuan Zhao, Linlin Wang, Rui Zhang
  • Patent number: 11784624
    Abstract: The present disclosure provides a differential resonator and a MEMS sensor. The differential resonator includes a substrate, a first resonator, a second resonator and a coupling mechanism. The first resonator is connected with the second resonator, and the first resonator and the second resonator are movably connected with the substrate. The coupling mechanism includes a first guide beam, a second guide beam, a first coupling beam, a second coupling beam, a first connecting piece and a second connecting piece. The first guide beam and the second guide beam are arranged on two opposite sides of a direction perpendicular to a vibration direction of the first resonator or the second resonator. The first coupling beam is connected with the first guide beam, the second guide beam and the first resonator. The second coupling beam is connected with the first guide beam, the second guide beam and the second resonator.
    Type: Grant
    Filed: August 6, 2020
    Date of Patent: October 10, 2023
    Assignee: AAC Acoustic Technologies (Shenzhen) Co., Ltd.
    Inventors: Zhan Zhan, Yang Li, Yuwei Liu, Qiuyu Tan, Rui Zhang
  • Patent number: 11765509
    Abstract: Provided is an MEMS device, including: a substrate having back cavity passing thererthrough; a diaphragm connected to the substrate and covers the back cavity, the diaphragm includes first and second membranes, and accommodating space formed therebetween; a counter electrode; and support loop members arranged concentrically. Opposite ends of the support loop member are connected to the first and second membranes. The support loop members are arranged at intervals. Each support loop member has first sections concentrically arranged as a loop member at intervals. A first notch is formed between two adjacent first sections. In at least one support loop member, the first section has second sections concentrically arranged as a loop member at intervals. A second notch is formed between two adjacent second sections. By a larger first section, distance between adjacent first sections is larger, the technical problem that large number of slots required for counter electrode is solved.
    Type: Grant
    Filed: May 27, 2022
    Date of Patent: September 19, 2023
    Assignee: AAC Acoustic Technologies (Shenzhen) Co., Ltd.
    Inventor: Euan James Boyd
  • Patent number: 11765520
    Abstract: A differential condenser microphone is provided, including: a base having a cavity passing through the base; a diaphragm connected to the base and covering the cavity; a mounting portion connected to the diaphragm through a connector, movable electrodes protruding from an outer edge of the mounting portion; first fixed electrodes connected to the base, the first fixed electrodes and the movable electrodes are spatially separated from and cross each other; second fixed electrodes connected to the base, the second fixed electrodes and the movable electrodes are separated from and cross each other, and the first fixed and second fixed electrodes are arranged opposite to and spaced from each other along vibration direction of the diaphragm.
    Type: Grant
    Filed: December 17, 2021
    Date of Patent: September 19, 2023
    Assignee: AAC Acoustic Technologies (Shenzhen) Co., Ltd.
    Inventor: Yannick Pierre Kervran