Abstract: A piezoelectric MEMS microphone is disclosed. The microphone includes a base having a cavity; a piezoelectric diaphragm; a fixation beam connecting with the piezoelectric diaphragm; and a support beam connecting with the base and the fixation beam. The piezoelectric diaphragm has a number of diaphragm sheets fixed by the fixation beam, each diaphragm sheet having a fixed end and a free end. The fixed end is connected with the fixation beam, and the free end extends from the fixed end to two sides and is suspended above the cavity. Compared with the related art, mechanical strength of the diaphragm sheet is improved, and the output intensity of the signal is improved.

Abstract: The present disclosure provides a vibration sensor and an audio device. The vibration sensor includes a housing having an inner wall and an inner chamber, an elastic sheet, a mass piece and a MEMS chip having a back cavity, the elastic sheet, the mass piece and the MEMS chip being arranged in the chamber. The elastic sheet is attached to the inner wall, the mass piece is mounted on one side of the elastic sheet away from the inner wall. The elastic sheet covers the concave cavity and defines a first through hole communicated with the concave cavity. The mass piece is provided with a second through hole communicated with the first through hole. And the first and the second through holes communicate with the back cavity and the concave cavity. The vibration sensor provided by the present disclosure has simple structure, small height and high sensitivity.

Abstract: The present disclosure provides an MEMS microphone including a base having a rear cavity and a capacitor system disposed on the base. The capacitor system includes a rear plate and a diaphragm that are spaced relatively apart to form an acoustic cavity. A piezoelectric diaphragm is attached to a side of the diaphragm, the side being away from the acoustic cavity. The piezoelectric diaphragm, under the deformation effect of the diaphragm, deforms to generate and output charges. Therefore, the MEMS microphone can output two groups of electrical signals, one group of electrical signals output by the capacitor system and one group of electrical signals output by the piezoelectric diaphragm, thereby sensitivity of the microphone is improved.

Abstract: Provided are a method for preparing a silicon wafer with a rough surface and a silicon wafer, which solves the problem in the prior art that viscous force is likely to be generated. The method includes: depositing a first film layer having a large surface roughness on a surface of a silicon wafer that has been subjected to planar planarization, and then blanket etching the first film layer to remove the first film layer. Then, the surface of the first silicon layer facing away from the substrate is further etched to form grooves and protrusions, which provide roughness, thereby forming a silicon wafer with a rough surface. When the silicon wafer approaches to another film layer, the viscous force generated therebetween is reduced, and thus the sensitivity of the MEMS device is improved and the probability of out-of-work MEMS device is reduced.

Abstract: The vibration motor provided by the present disclosure includes an elastic assembly having an elastic frame, a first elastic supporting member, and a second elastic supporting member. The first and second elastic supporting members connects to the housing by the elastic frame. By virtue of the bended structure of the elastic frame, the first and the second elastic supporting members are arranged interlaced along the vibration direction, which greatly reduces the height of the vibration motor.

Abstract: The present application discloses a vibrating motor, which includes a housing having a receiving cavity, a stator received in the receiving cavity, a vibrator received in the receiving cavity, and a flexible assembly received in the receiving cavity. The flexible assembly is configured for elastically supporting the vibrator. The housing includes a top wall, a bottom wall facing the top wall, and a side wall connecting the top wall and the bottom wall. The stator includes an iron core, a coil sleeved on the iron core, and pole shoes positioned at two ends of the iron core. Each the pole shoe has a surface close to the iron core recessed to form an avoiding portion, and the iron core is inserted in the avoiding portion.

Abstract: The invention provides a piezoelectric micro-electromechanical system (MEMS) microphone includes a base with a cavity and a piezoelectric diaphragm arranged on the base. The base has a ring base and a support column. The piezoelectric diaphragm includes a plurality of diaphragm sheets. Each diaphragm sheet has a fixing end connected with the support column and a free end suspended above the cavity. The widths of the diaphragm sheets are gradually increased from the fixing ends to the free ends. According to the piezoelectric MEMS microphone provided by the invention, under sound pressure, the free ends vibrate, wide free ends drive short fixing ends, and the diaphragm sheets close the fixing ends generate greater deformation to generate more charge. Therefore, the sensitivity can be further improved.

Abstract: The present invention provides a piezoelectric MEMS microphone having a base with a cavity, a piezoelectric diaphragm, and a restraining element. The base has a ring base circumferentially forming a cavity, a support column. The piezoelectric diaphragm includes diaphragm sheets each having a fixing end connected to a support column and a free end suspended over the cavity. The restraining element has one end fixedly connected to the free end, the other end connected to the part on the base that is not connected to the fixing end. The piezoelectric MEMS microphone of the invention can constrain the deformation of the diaphragm sheet, thereby improving the resonant frequency of the piezoelectric diaphragm, reducing the noise of the whole piezoelectric MEMS microphone.

Abstract: The invention provides a piezoelectric micro-electromechanical systems (MEMS) microphone having a base with a cavity, a piezoelectric diaphragm, and a limit element. The base has a ring base, and a support column. The piezoelectric diaphragm includes diaphragm sheets. Each diaphragm sheet have a fixing end connected with the support column and a free end suspended above the cavity. The limit element includes a limit part arranged apart from the piezoelectric diaphragm to limit the free ends in vibration directions of the diaphragm sheets, and an edge fixing plate connected with the outer edge of the limit part and arranged on the ring base. When the diaphragm sheets greatly deform upwards under impact force, deformation of the diaphragm sheets can be controlled, and the diaphragm sheets are protected to prevent the diaphragm sheets from breaking, thereby improving the stability of the piezoelectric MEMS microphone.

Abstract: Provided is a linear vibration motor, including a housing having a receiving space and including a wall surface, and a stator, a vibrator and an elastic support supporting the vibrator that are received in the housing. The vibrator includes a body having a receiving hole, and a magnetic circuit structure fixed to an inner wall of the receiving hole and forming a magnetic gap. The stator is fixed to the wall surface and located in the magnetic gap. The magnetic circuit structure includes first permanent magnets opposite to and spaced apart from each other, each of which includes a first surface facing the wall surface, and a second surface opposite to the first surface. At least one of the first and second surfaces is recessed towards the other of the first and second surfaces to form a groove. A baffle is provided in the groove and fixed to the body.

Abstract: A sound transducer includes a substrate including a first surface, a second surface, and a cavity, a support structure disposed on the first surface and including an inner peripheral edge and a third surface, a fixing structure disposed on the third surface, a moving structure including an exterior peripheral edge and a fourth surface, a first set of comb fingers fixed to the inner peripheral edge, extending toward the moving structure, and being electrically isolated from the fixing structure and the moving structure, a second set of comb fingers fixed to the exterior peripheral edge, extending toward the support structure, and interdigitated with the first set of comb fingers, and an elastic connecting structure including a first connecting part connected to the fourth surface, a second connecting part connected to the fixing structure, and an elastic body; the moving structure is disposed above the cavity.

Abstract: Provided are a method for preparing a silicon wafer with a rough surface and a silicon wafer, for solving the problem that a viscous force is likely to be generated when a smooth surface of the silicon wafer approaches another film layer. The method includes: depositing a porous oxide film layer on a surface of the first silicon planar layer that has been subjected to planar planarization, and then etching the porous oxide film layer by XeF2 vapor etching, during which XeF2 gas passes through the porous oxide film layer to etch the first silicon planar layer in an irregular way. Therefore, the first silicon planar layer has a greater surface roughness. When the silicon wafer approaches to another film layer, the viscous force generated therebetween is reduced, improving the sensitivity of the MEMS device and reducing the probability of out-of-work MEMS devices.

Abstract: The present invention provides a MEMS microphone, having a base and a capacitive system provided on the base. The capacitive system includes a diaphragm and a back plate. The MEMS microphone is further provided with a supporting frame located between the back plate and the diaphragm. One end of the supporting frame is connected with the back plate, and the other end is connected with the diaphragm. The supporting frame divides the cavity into a first cavity body and a second cavity body. The supporting frame is provided with a connection channel. During the production process of the MEMS microphone, the etchant enters the first cavity body, and then enters the second cavity body, which prevents oxides from remaining in the microphone product and affecting the use of MEMS microphone.

Abstract: Provided is a piezoelectric type and capacitive type combined MEMS microphone, comprising a base with a back cavity and a capacitor system arranged on the base; wherein, the capacitor system comprises a back plate and a diaphragm; the back plate is opposite to and apart from the diaphragm to form a first sound cavity; a piezoelectric diaphragm structure is between the capacitor system and the base; a second sound cavity is formed between the capacitor system and the piezoelectric diaphragm structure; the second sound cavity is at least in communication with the first sound cavity or the back cavity; the piezoelectric type and capacitive type combined MEMS microphone can output two groups of electric signals comprising a group of electric signals output from the capacitor system and a group of electric signals output from the piezoelectric diaphragm structure, thus improving sensitivity of the microphone.

Abstract: A MEMS gyroscope is provided. The MEMS gyroscope includes a weight provided with elastic assemblies at four corners thereof. The elastic assemblies are arranged in one of diagonal directions of the weight. An electronic device is also provided applying the gyroscope of the present invention.

Abstract: The present invention discloses a MEMS sound transducer. The sound transducer includes: a substrate having a back cavity; a stator, the stator having a central portion suspending on the back cavity and at least two fixed arms extending from the center portion to the substrate and fixed on the substrate; a movable cantilever, mounted to the substrate, at least partially facing the back cavity and disposed between two adjacent fixed arms; wherein, the movable cantilever has a fixed end mounted to the substrate and a free edge facing the fixed arms with space; the free edge has a plurality of moving comb-fingers formed thereon; the stator has a plurality of fixed comb-fingers formed on the fixed arms; the moving comb-fingers and the fixed comb-fingers fit to each other to form a capacitor with an overlap area.

Abstract: The present disclosure provides a sound absorbing material. The sound absorbing material comprising MFI-structural-type molecular sieves, the MFI-structural-type molecular sieves comprises frameworks and extra-framework cations, the framework comprising SiO2 and a metal oxide MxOy containing a metal element M, wherein a molar ratio of Si/M is between 220 and 600 in the framework, the metal element M comprises aluminum, and the extra-framework cations are at least one of hydrogen ions, alkali metal ions and alkaline earth metals. The present also provides a method for preparing a sound absorbing material and a speaker box using the sound absorbing material.

Abstract: The present disclosure provides a method for processing a conductive structure. The method includes the following steps of: forming on a first surface a groove concave from the first surface towards a second surface by means of dry etching; extending the groove from the second surface to form a via through a silicon base; and processing a conductive structure within the via. The method can be applied to a silicon base having a thickness larger than 300 ?m. It breaks the limit on thickness that can be processed in the related art and is capable of providing electrical connectivity on both sides of a silicon base. The method is simple and highly reliable, has high processing efficiency and is applicable to mechanized production.

Abstract: The present disclosure provides a sound absorbing material. The sound absorbing material comprises MFI-structural-type zeolite. The MFI-structural-type zeolite comprises a framework, and the framework comprises SiO2 and AlO3, and the mass ratio of Si to Al in the framework is less than 200 and not less than 50. The present disclosure also provides a speaker box applying the sound absorbing material. The sound absorbing material provided by the present disclosure and the speaker box using the sound absorbing material can further improve the performance of the speaker box, reduce the failure of zeolite and improve the performance stability of the speaker box.

Abstract: Provided is a linear vibration motor, including: a housing having a receiving space; a vibration unit received in the receiving space; an elastic assembly configured to suspend the vibration unit in the receiving space, and a driving unit fixed to the housing and configured to drive the vibration unit to vibrate. The linear vibration motor includes a coil assembly and two first permanent magnets respectively provided at two sides of the coil assembly. The vibration unit includes one of the coil assembly and the first permanent magnets, and the driving unit includes the other one. When the vibration unit is static, a central axis of the first permanent magnet perpendicular to a vibrating direction of the vibration unit and a central axis of the coil assembly perpendicular to the vibrating direction of the vibration unit are spaced apart from each other in the vibrating direction of the vibration unit.