Patents Assigned to Altera Corporation
  • Publication number: 20240137026
    Abstract: An integrated circuit includes a logic circuit block that includes a first adaptive logic module configurable to store a first state of a first signal received from a device-under-test in a first register, a second adaptive logic module configurable to store a second state of a second signal in a second register during a user mode of the integrated circuit simultaneously with the first state of the first signal being stored in the first register, and a third adaptive logic module configurable to store a third state of the first signal in a third register. The first and the third states of the first signal are stored for consecutive clock cycles in the first register and the third register. The logic circuit block is configurable to scan out the second state in the second register and the third state in the third register.
    Type: Application
    Filed: December 27, 2023
    Publication date: April 25, 2024
    Applicant: Altera Corporation
    Inventors: Bee Yee Ng, Ilya Ganusov, Jun Pin Tan
  • Publication number: 20240126969
    Abstract: An integrated circuit includes logic circuits that are configurable by a bitstream of configuration data to perform a computing service requested in a computing system. The integrated circuit communicates with a central processing unit in the computing system according to interface features indicated by meta-data provided to the central processing unit to perform the computing service.
    Type: Application
    Filed: December 20, 2023
    Publication date: April 18, 2024
    Applicant: Altera Corporation
    Inventor: Steven Jahnke
  • Patent number: 11960921
    Abstract: A virtualization platform for Network Functions Virtualization (NFV) is provided. The virtualization platform may include a host processor coupled to an acceleration coprocessor. The acceleration coprocessor may be a reconfigurable integrated circuit to help provide improved flexibility and agility for the NFV. The coprocessor may include multiple virtual function hardware acceleration modules each of which is configured to perform a respective accelerator function. A virtual machine running on the host processor may wish to perform multiple accelerator functions in succession at the coprocessor on a given data. In one suitable arrangement, intermediate data output by each of the accelerator functions may be fed back to the host processor. In another suitable arrangement, the successive function calls may be chained together so that only the final resulting data is fed back to the host processor.
    Type: Grant
    Filed: May 11, 2023
    Date of Patent: April 16, 2024
    Assignee: Altera Corporation
    Inventors: Abdel Hafiz Rabi, Allen Chen, Mark Jonathan Lewis, Jiefan Zhang
  • Publication number: 20240113014
    Abstract: An integrated circuit includes first external conductive pads, second external conductive pads, and third external conductive pads. The second external conductive pads are between the first external conductive pads and the third external conductive pads. Repair group circuitry is configurable to shift signal transmission away from one of the first external conductive pads to one of the third external conductive pads if the one of the first external conductive pads has a defect.
    Type: Application
    Filed: December 13, 2023
    Publication date: April 4, 2024
    Applicant: Altera Corporation
    Inventors: Krishna Bharath Kolluru, Atul Maheshwari, Mahesh Kumashikar, Md Altaf Hossain, Ankireddy Nalamalpu, Jeffrey Chromczak
  • Publication number: 20240111703
    Abstract: An active interconnection device has a repeater circuit that includes a storage circuit. The storage circuit is coupled to store a configuration bit for configuring the repeater circuit to transmit a signal between a first integrated circuit die and a second integrated circuit die. The storage circuit is coupled to receive the configuration bit through a conductor during a configuration mode. A buffer circuit in the repeater circuit is configurable to transmit the signal through the conductor during a transmission mode in response to the configuration bit.
    Type: Application
    Filed: December 12, 2023
    Publication date: April 4, 2024
    Applicant: Altera Corporation
    Inventors: Mahesh Kumashikar, Atul Maheshwari, Md Altaf Hossain, Ankireddy Nalamalpu, Krishna Bharath Kolluru
  • Publication number: 20240113730
    Abstract: An integrated circuit includes conversion circuitry for converting first data in a first data format optimized for efficient data storage into second data in a second data format optimized for processing by a processing circuit. The integrated circuit also includes filter circuitry for filtering the second data to generate filtered data in the second data format. The integrated circuit outputs the filtered data for processing by the processing circuit.
    Type: Application
    Filed: December 1, 2023
    Publication date: April 4, 2024
    Applicant: Altera Corporation
    Inventors: Maghawan Punde, Mark Lewis
  • Publication number: 20240113985
    Abstract: An integrated circuit includes queue circuits for storing packets, a scheduler circuit that schedules the packets received from the queue circuits to be provided in an output, and a traffic manager circuit that disables one of the queue circuits from transmitting any of the packets to the scheduler circuit based at least in part on a bandwidth in the output scheduled for a subset of the packets received from the one of the queue circuits.
    Type: Application
    Filed: December 13, 2023
    Publication date: April 4, 2024
    Applicant: Altera Corporation
    Inventors: Kenneth Taylor, Robert Critchlow
  • Patent number: 11797473
    Abstract: An accelerated processor structure on a programmable integrated circuit device includes a processor and a plurality of configurable digital signal processors (DSPs). Each configurable DSP includes a circuit block, which in turn includes a plurality of multipliers. The accelerated processor structure further includes a first bus to transfer data from the processor to the configurable DSPs, and a second bus to transfer data from the configurable DSPs to the processor.
    Type: Grant
    Filed: October 8, 2018
    Date of Patent: October 24, 2023
    Assignee: Altera Corporation
    Inventors: David Shippy, Martin Langhammer, Jeffrey Eastlack
  • Patent number: 11755810
    Abstract: A method for designing a system to be implemented on a target device includes generating bounding boxes on the target device for nets in the system where a bounding box identifies routing resources available for routing its corresponding net. The nets in the system are assigned to a plurality of threads to be routed. The threads are executed so that a plurality of the nets are routed in parallel within their corresponding bounding box.
    Type: Grant
    Filed: September 21, 2020
    Date of Patent: September 12, 2023
    Assignee: Altera Corporation
    Inventors: Vaughn Betz, Jordan Swartz, Vadim Gouterman
  • Patent number: 11741042
    Abstract: A multichip package having a main die coupled to one or more daughter dies is provided. The main die may include embedded universal interface blocks (UIB) each of which can be used to interface with a corresponding daughter die to support high bandwidth parallel or serial communications. Each UIB may include an integrated processor subsystem and associated pattern sequencing logic to perform interface initialization and margining operations. Each UIB may perform simultaneous accesses to a daughter die across one or more channels. Each UIB may also include multiple phase-locked loop circuits for providing different clock signals to different portions of the UIB and a 2× clock phase generation logic. Each UIB may include multiple IO modules, each of which may optionally include its own duty cycle correction circuit. Each IO module may include buffer circuits, each of which may have a de-emphasis control logic for adjusting buffer drive strength.
    Type: Grant
    Filed: December 24, 2021
    Date of Patent: August 29, 2023
    Assignee: Altera Corporation
    Inventors: Chee Hak Teh, Arifur Rahman
  • Patent number: 11687358
    Abstract: A virtualization platform for Network Functions Virtualization (NFV) is provided. The virtualization platform may include a host processor coupled to an acceleration coprocessor. The acceleration coprocessor may be a reconfigurable integrated circuit to help provide improved flexibility and agility for the NFV. The coprocessor may include multiple virtual function hardware acceleration modules each of which is configured to perform a respective accelerator function. A virtual machine running on the host processor may wish to perform multiple accelerator functions in succession at the coprocessor on a given data. In one suitable arrangement, intermediate data output by each of the accelerator functions may be fed back to the host processor. In another suitable arrangement, the successive function calls may be chained together so that only the final resulting data is fed back to the host processor.
    Type: Grant
    Filed: March 26, 2021
    Date of Patent: June 27, 2023
    Assignee: Altera Corporation
    Inventors: Abdel Hafiz Rabi, Allen Chen, Mark Jonathan Lewis, Jiefan Zhang
  • Patent number: 11675613
    Abstract: Techniques and mechanisms provide a flexible mapping for physical functions and virtual functions in an environment including virtual machines.
    Type: Grant
    Filed: September 17, 2020
    Date of Patent: June 13, 2023
    Assignee: Altera Corporation
    Inventors: Jiefan Zhang, Abdel Hafiz Rabi, Allen Chen, Mark Jonathan Lewis
  • Patent number: 11669479
    Abstract: Integrated circuit packages with multiple integrated circuit dies are provided. A multichip package may include a substrate, a main die that is mounted on the substrate, and multiple transceiver daughter dies that are mounted on the substrate and that are coupled to the main die via corresponding Embedded Multi-die Interconnect Bridge (EMIB) interconnects formed in the substrate. Each of the main die and the daughter dies may include configurable adapter circuitry for interfacing with the EMIB interconnects. The adapter circuitry may include FIFO buffer circuits operable in a 1× mode or 2× mode and configurable in a phase-compensation mode, a clock-compensation mode, an elastic mode, and a register bypass mode to help support a variety of communications protocols with different data width and clocking requirements. The adapter circuitry may also include boundary alignment circuitry for reconstructing (de)compressed data streams.
    Type: Grant
    Filed: April 1, 2022
    Date of Patent: June 6, 2023
    Assignee: Altera Corporation
    Inventors: Huy Ngo, Keith Duwel, David W. Mendel
  • Patent number: 11657016
    Abstract: Systems and methods are provided for supporting wide-protocol interface across a multi-die interconnect interface. Data signals of a wide-protocol interface are split into a plurality of data streams. A handshake signal is established between a first circuit and a second circuit, whereby the first circuit and second circuit are dies of a multi-die device. The first circuit transmits the plurality of data streams to the second circuit via a plurality of multi-die interconnect channels. Each data stream of the plurality of data streams are compressed based on the handshake signal in order to provide wide-protocol interface with reduced number of required pins.
    Type: Grant
    Filed: November 9, 2021
    Date of Patent: May 23, 2023
    Assignee: Altera Corporation
    Inventors: Gary Brian Wallichs, Keith Duwel, Cora Lynn Mau
  • Patent number: 11620250
    Abstract: A method for compressing is provided. The method includes compressing, via a processor, a portion of a first data packet to generate a second data packet having a compressed portion. The method includes transmitting the second data packet having the compressed portion via an interface to a co-processor. The processor and the co-processor are communicatively coupled via the interface. The method also includes unpacking, via the co-processor, the compressed portion of the second data packet to restore the first data packet.
    Type: Grant
    Filed: May 23, 2019
    Date of Patent: April 4, 2023
    Assignee: Altera Corporation
    Inventors: Alexander Kugel, Dekel Shirizly
  • Patent number: 11520394
    Abstract: Systems and methods are provided for reducing power consumption of a multi-die device, such as a network processor FPGA (npFPGA). The multi-die device may include hardware resources such as FPGA dies, which may be coupled to NIC dies and/or memory dies. Power consumption of the multi-die device may be reduced by monitoring usage of hardware resources in the multi-die device, identifying hardware resources that are not in use, and gating power to the identified hardware resources. The status of processing elements (PEs) in the multi-die device may be tracked in a PE state table. Based on the PE state table, tasks from a task queue may be assigned to one or more processing elements.
    Type: Grant
    Filed: February 6, 2018
    Date of Patent: December 6, 2022
    Assignee: Altera Corporation
    Inventor: Krishnan Venkataraman
  • Patent number: 11507722
    Abstract: A method for designing a system on a target device includes identifying portions in the system to preserve based on comparing structural characteristics of the system with another system. Design results from the another system are reused for portions in the system that are preserved.
    Type: Grant
    Filed: April 4, 2019
    Date of Patent: November 22, 2022
    Assignee: Altera Corporation
    Inventors: Kevin Chan, Mark Bourgeault
  • Patent number: 11507723
    Abstract: A method for designing a system on a target device includes identifying portions in the system to preserve based on comparing structural characteristics of the system with another system. Design results from the another system are reused for portions in the system that are preserved.
    Type: Grant
    Filed: December 20, 2019
    Date of Patent: November 22, 2022
    Assignee: Altera Corporation
    Inventors: Kevin Chan, Mark Bourgeault
  • Patent number: 11480993
    Abstract: An integrated circuits with sequential logic circuitry is provided. The sequential logic circuitry may including latching circuits that receive clock signals from on-chip or off-chip clock sources. The clock signals may exhibit clock skew that is native to the integrated circuit. The natively existing clock skew can be leverage to perform time borrowing to help optimize circuit performance. The desired clock skew can be achieved by intelligent placement of the clock sources and deliberate routing of the clock signals from the clock sources to respective types of clock distribution networks on the integrated circuit.
    Type: Grant
    Filed: March 26, 2021
    Date of Patent: October 25, 2022
    Assignee: Altera Corporation
    Inventor: Mark Bourgeault
  • Patent number: 11436382
    Abstract: Systems and methods are disclosed for preventing tampering of a programmable integrated circuit device. Generally, programmable devices, such as FPGAs, have two stages of operation; a configuration stage and a user mode stage. To prevent tampering and/or reverse engineering of a programmable device, various anti-tampering techniques may be employed during either stage of operation to disable the device and/or erase sensitive information stored on the device once tampering is suspected. One type of tampering involves bombarding the device with a number of false configuration attempts in order to decipher encrypted data. By utilizing a dirty bit and a sticky error counter, the device can keep track of the number of failed configuration attempts that have occurred and initiate anti-tampering operations when tampering is suspected while the device is still in the configuration stage of operation.
    Type: Grant
    Filed: February 18, 2020
    Date of Patent: September 6, 2022
    Assignee: Altera Corporation
    Inventor: Bruce B. Pedersen