Abstract: A solderable flexible adhesive interposer having solderable contacts includes low-modulus-of-elasticity (i.e. molecularly flexible) conductive adhesive vias to which contacts of an electronic device, such as a semiconductor chip or die or other component, are connected. The flexible adhesive interposer substrate includes a sheet or layer of a molecularly flexible dielectric adhesive having via holes therein through which the flexible conductive adhesive vias reside. A thin layer of solderable metal, preferably a plating of gold or nickel-gold, on at least one exposed surface of the flexible conductive adhesive vias provides the solderable contacts connecting electrically to the conductive vias. The electronic device may be covered by a lid or by an encapsulant attached to the flexible adhesive interposer substrate and/or the electronic device.

Abstract: An antenna arrangement comprises at least two antenna loops disposed in two intersecting planes disposed at an angle to define a detection region in which the antenna loops transmit and/or receive electromagnetic signals and through which an object may pass. Each antenna loop includes a portion disposed in each of the two planes, and the antenna loops overlap at least in part in each of the two planes. The antenna arrangement may be coupled to a processor and/or utilization system for cooperating therewith for performing a desired function.

Abstract: An antenna array comprises a plurality of antenna loops disposed to define a portal or passageway or other detection region in which the plural antenna loops transmit and/or receive electromagnetic signals. A processor coupled to the plural antenna loops processes at least the received signals and/or transmitted signals. The plural antennas may be arrayed in a rectangular array, on hanging flexible substrates or other suitable arrangement, and may be coupled to the processor by a filter or selective switch. The processor may be coupled to a utilization system for cooperating therewith for performing a desired function.

Abstract: Digitized signatures are recorded in respective digitized signature records. Each digitized signature record includes at least the position of each point of a signature in coordinates relative to a coordinate of a previous point thereof and time. Digitized signatures are identified, verified or authenticated by comparing characteristics thereof, may be indexed for facilitating comparison, may be utilized for network and Internet transactions, and may be converted to image format.

Abstract: An electronic circuit arrangement comprises a substrate having an electrical conductor thereon, wherein the electrical conductor includes two contacts spaced apart substantially a predetermined distance; an electronic jumper having two contacts spaced apart substantially the predetermined distance and respectively connected to the two contacts of the substrate; and an electronic device on the electronic circuit jumper and having two contacts respectively connected to the two contacts of the electronic circuit jumper.

Abstract: A system and method are useful for conducting an exhibition at which visitors visit a plurality of booths or stations. A smart tag issued each visitor includes at least an electronic memory from which information from the memory may be provided and/or information may be received and stored in the memory. Stored information may include visitor information, exhibitor information, visit information, product/service information and data items. Smart tag control units and antenna arrays at the stations communicate with the smart tags and communicate directly or indirectly with one or more processors that process the information.

Abstract: A fine-pitch flexible electrical connector includes a plurality of generally parallel metal conductors in a matrix of a molecularly flexible dielectric adhesive, and may be made in various sizes and thicknesses so as to be utilized as a connector, jumper, test membrane, interposer or other electrical connection structure providing connection between two or more electronic devices and/or substrates. The connector is made by providing a number of metal conductors disposed in relation to the dielectric adhesive, such as by lamination or aggregation, and then separating individual connectors therefrom by cutting, slicing and/or otherwise separating transversely to the longitudinal direction of the conductors.

Abstract: A low-modulus-of-elasticity flexible adhesive interposer substrate has high aspect ratio via conductors to which an electronic device, such as a semiconductor chip or die or other component, is attached, e.g., for a high density electronic package. A method for making the flexible adhesive interposer substrate includes etching a sheet of metal to form the high aspect ratio via conductors which are held in position by a sheet or layer of a molecularly flexible adhesive. The via conductors may be built up to even greater aspect ratio. Such flexible interposer may include high aspect ratio via conductors for a plurality of similar or different electronic devices.

Abstract: An electronic device includes electronic components, such as “flip chip” semiconductor devices, chip resistors, capacitors and other electronic components, mounted to and interconnected to a substrate by a flexible adhesive membrane having contact pads that have substantially the same pattern as those of the corresponding electronic components. The flexible adhesive membrane includes an insulating matrix and conductive pads therein that employ thermoplastic and thermosetting adhesives, and combinations thereof, each having a low modulus of elasticity. The flexible conductive adhesive employed for the conductive pads or features preferably has a lower flow index than does the flexible adhesive employed for the insulating matrix, whereby the conductive features penetrate the insulating adhesive during bonding to assure reliable interconnection.

Abstract: A compressible and melt-flowable thermally conductive interface may be either tacky and pressure sensitive or be non-tacky and dry, and may include one of more thermally conductive fillers in one or more forms. The interface either melt flows or cures at low temperature, such as about 40-50° C. Certain embodiments provide a bond strength between a heat generating component, such as an integrated circuit, power transistor and the like, and a heat dissipating element, such as a heat sink or cold plate, sufficient to permit elimination of the need for mechanical fasteners.

Abstract: An electronic device, such as an integrated circuit, hybrid circuit or a transistor, is enclosed within an electronic package or module so as to be protected from contaminants and the external environment. An electronic device is enclosed within a package or module having a lid or cover that is sealed with an adhesive preform that has been pre-applied onto the bonding areas of the lid. The adhesive preforms are formed of a wet adhesive with gaps and are B-staged or dried to form dry solid adhesive preforms through chemical cross-linking or solvent removal. Both the lids and the adhesive preforms are formed of electrically insulating or of electrically conductive materials. The lids and adhesive preforms are attached to the electronic package or module by bonding the adhesive preforms at temperatures that are substantially lower than those at which the soldering of conventional lids is typically performed, and the adhesive flows to close the gaps.

Abstract: An optical device is enclosed within a package or module having an optically transmissive or transparent cover that is sealed with an adhesive preform that has been pre-applied onto the bonding areas of the cover. The adhesive preforms are formed of a wet adhesive deposited on a sheet of optically transmissive or transparent material as a preform in predetermined locations and are B-staged or dried to form dry solid adhesive preforms. The preforms may be continuous or have one or more small gaps therein. The sheet of optical material is diced or singulated to produce individual optical covers having an adhesive preform thereon.

Abstract: A wireless article, such as an identification tag or badge, includes an electronic device mounted on a substrate and connected a loop antenna for receiving and/or transmitting radio frequency signals. Electrically conductive material disposed on the substrate or in holes through the substrate of the wireless article connect the antenna terminals to the electronic device contacts. The structure and materials of the wireless article may be rugged and strong to provide a tamper-resistant article, and/or may include one or more weakened or frangible portions that easily break to provide a tamper-destruct article. The wireless article may be arranged to resist heat, moisture and/or solvents, to function in severe environments such as laundering and industrial processes.

Abstract: An electronic package or module is protected by a lid sealed with a thermoplastic or thermosetting adhesive laminate that has been pre-applied onto the lid, including the bonding area of the lid. The adhesive is deposited as wet adhesive or is laminated in sheet format onto a sheet of the material of which the lids are to be formed. The adhesive is dried or B-staged to become a solid sheet preform, as by solvent removal or chemical cross-linking, respectively. The lids are then formed from the laminate of lid material and adhesive, as by thermo-forming or by stamping. The lid and adhesive materials may be electrically insulating, or may be electrically conductive so as to replace soldered lids in providing electromagnetic interference protection. In some cases, the adhesive may be thermally conductive and be utilized in combination with thermally conductive interface material that is in direct contact with heat generating devices covered by the lid.

Abstract: In the construction of electronic devices with one or more flip chips and, in some cases, one or more leadless components, mounted on a substrate, the interconnections are made with conductive adhesive deposited using specialized masks. A magnetic metal mask fabricated of a membrane of magnetic material is placed temporarily onto the face of a semiconductor wafer or of a circuit or other substrate. When properly positioned with respect to the wafer or substrate, such as by relational guide holes, the mask is held in place by the magnetic forces produced by a controllable electromagnet. Contact pad openings in the magnetic metal mask are formed by suitable means such as laser cutting or photo-etching. The magnetic metal mask may include a flexible interface layer on the side facing the wafer or substrate to assure tight sealing thereto, so as to reduce smearing and bridging of the conductive adhesive paste and avoid bridging between contact pads that might otherwise occur during deposition of the paste.

Abstract: A card has an electronic device, such as an integrated circuit, a conductive, resistive or capacitive network, or other electronic device, embedded therein. The card, sometimes referred to as a “smart card,” has the electronic device mounted to a substrate, generally by electrical connections formed of solder, electrically-conductive adhesive or flexible electrically-conductive adhesive. The substrate is covered by a layer of melt-flowable adhesive of thickness sufficient to cover the electronic device mounted thereon. The substrate is attached to a card blank to which it is bonded by melt flowing the melt-flowable adhesive. In one embodiment, the card blank has a cavity into which the electronic device and substrate are placed. In another embodiment, the substrate is of the same size and shape as is the card blank and the space therebetween is filled with melt flowable adhesive to bond them together and embed the electronic device therebetween.

Abstract: An electronic device comprises one or more electronic components, including flip-chip semiconductor devices, chip resistors, capacitors and inductors and other components, electrically interconnected to an electronic substrate by solder bump interconnections and having a rigid adhesive underfill bonding between the electronic component and the substrate. The rigid adhesive underfill is a preform of an insulating thermoplastic and/or thermosetting resin, or a combination thereof, having a high modulus of elasticity and high glass transition temperature. Preferably, insulating adhesives having a higher melt-flow index are employed to facilitate formation of a void-free bond between the component and the substrate and of a fillet around the edges of the flip-chip or other component, thereby to provide a moisture barrier and additional mechanical strength.

Abstract: A high density electronic package includes a low-modulus-of-elasticity flexible adhesive interposer substrate to which an electronic device, such as a semiconductor chip or die or other component, is attached. The flexible adhesive interposer substrate includes a sheet or layer of a molecularly flexible adhesive having via holes therein in which are built up conductive vias to which contacts of the electronic device connect. A thin layer of metal foil on one surface of the flexible adhesive sheet is patterned to provide contacts and to connect electrically to the conductive vias. The electronic device may be covered by a lid or by an encapsulant attached to the flexible adhesive interposer substrate and/or the electronic device. An electronic package may include a plurality of electronic devices and respective flexible adhesive interposers that are electrically interconnected.

Abstract: A wireless article, such as an identification tag of badge, containing an electronic device includes on a substrate thereof a plural-turn loop antenna for receiving and/or transmitting radio frequency signals. Because the spacing of the loop antenna terminals is greater than the spacing of the contacts to which they are to connect on the electronic device, the electronic device cannot be attached to the same side of the wireless article as is the loop antenna. Electrically conductive material disposed in holes through the substrate of the wireless article connect the antenna terminals to the electronic device contacts.

Abstract: In the construction of electronic devices with one or more flip chips and, in some cases, one or more leadless components, mounted on a substrate, the interconnections are made with conductive adhesive or solder paste deposited using specialized stencils or masks, including suitable snap-back stencils and direct-contact masks without snap back. A metal stencil (or mask) is placed temporarily onto the face of a substrate, such as a semiconductor wafer, circuit board or other substrate, and is spaced apart therefrom by standoff features. When the stencil is properly positioned with respect to the wafer or substrate, as by relational alignment holes or optical alignment methods, conductive adhesive material is deposited onto the substrate through holes or openings in the stencil. The metal stencil includes on the side thereof facing the substrate a flexible standoff layer having standoff features to space the stencil apart from the substrate.