Abstract: Electronic devices formed by bonding and interconnecting one or more electronic components to an electronic circuit substrate employ specialized adhesives comprising gold-plated, platinum-plated and/or palladium-plated particles in a polymeric adhesive system which may include thermoplastic or thermosetting resins. These plated particles beneficially provide electrical conductivity through the polymeric adhesive for electrically interconnecting contact pads on the electronic components with contact pads on the electronic circuit substrate and provide resistance to migration of metal, thereby enabling interconnection and bonding at very fine pitch and spacing. Polymers with substantial flexibility and a low glass transition temperature are preferred over more rigid resins. Particles having a morphology and shapes that include higher aspect ratios are preferred because lesser volume fraction loading is needed to establish good electrical conductivity through the polymeric adhesive.

Abstract: A module, such as a contact module for embedding an electronic device into a credit card, smart card, identification tag or other article, comprise a pattern of metal contacts having a first and a second surface and electrically-conductive vias built up on the first surface of the metal contacts. A layer of dielectric adhesive on the first surface of the pattern of metal contacts surrounds the electrically-conductive vias except the ends thereof distal from the metal contacts. An electronic device has electrical contacts connected to the exposed ends of the conductive vias, as by wire bonds or by flip-chip type connections.

Abstract: An electronic device, such as an integrated circuit, hybrid circuit or a transistor, is enclosed within an electronic package or module so as to be protected from contaminants and the external environment. An electronic device according to the present invention is enclosed within a package or module having a lid that is sealed with an adhesive preform that has been pre-applied onto the bonding areas of the lid. The adhesive preforms are formed of a wet adhesive deposited on a release substrate as a preform in predetermined locations with respect to a set of reference guide holes so as to facilitate subsequent attachment to lids with pick-and-place equipment or a guide plate. The wet-adhesive preforms are B-staged or dried to form dry solid adhesive preforms through chemical cross-linking or solvent removal, respectively. In most applications, both the lids and the adhesive preforms are formed of electrically insulating materials.

Abstract: An electronic device includes one or more semiconductor chips interconnected to a next level substrate in a flip chip mode using flexible conductive adhesive having a low modulus of elasticity. The flexible conductive adhesive is applied as conductive bumps on the contact pads of the substrate or on the contact pads of the semiconductor chips and is a flexible thermoplastic or thermosetting resin filled with electrically-conductive particles. Other electronic devices, such as packaged components including resistors, capacitors and the like, are bonded with the same flexible conductive adhesive bump approach as is employed for the semiconductor chips. The contact pads of both the chip and the next level substrate are preferably passivated with a metallic coating, preferably a precious metal, prior to interconnection to inhibit oxidation of the pads.

Abstract: This invention is directed to a polymeric composition comprising a polymeric binder and silver particles and having a volume electrical resistivity of 0.0001 ohm-cm or less.