Patents Assigned to Amphenol Corporation
  • Patent number: 11955748
    Abstract: Embodiments herein include a connector coupling arranged to mate and/or unmate first and second connectors. The connector coupling includes a first collar having one or more locking members, a second collar arranged to receive the first collar, the second collar being rotatable relative to the first collar, and a locking mechanism. The connector coupling is moveable in a mating direction to mate the first and second connectors and an unmating direction to unmate the connectors. The locking mechanism is disengaged when the connector coupling is moved in a mating direction. For example, the locking mechanism may be moveable from a first engaged position to a first disengaged position when the connector coupling is moved in the mating direction. As another example, the locking mechanism may remain disengaged until the connectors are fully mated.
    Type: Grant
    Filed: February 1, 2021
    Date of Patent: April 9, 2024
    Assignee: Amphenol Corporation
    Inventors: Braden Ishaug, Song Wai Trang, Brendon Aaron Baldwin
  • Publication number: 20240113463
    Abstract: A cable connector with improved performance and ease of use. The connector has staggered ports to reduce crosstalk and to prevent incorrect insertion of a plug into a receptacle. The plug may be constructed with subassemblies, each of which has a lossy central portion. Conductive members embedded within an insulative housing of the subassemblies may be used to electrically connect ground conductors within the subassemblies. Further, the connector may have a quick connect locking screw that can be engaged by pressing on the screw, but requires rotation of the screw to remove. Additionally, a ferrule may be used in making a mechanical connection between a cable bundle and a plug and making an electrical connection between a braid of the cable bundle and a conductive shell of the plug. The ferrule may be in multiple pieces for easy attachment while precluding deformation of the cable, which disrupts electrical performance.
    Type: Application
    Filed: August 14, 2023
    Publication date: April 4, 2024
    Applicant: Amphenol Corporation
    Inventors: Donald W. Milbrand, JR., Prescott B. Atkinson, Brian Kirk
  • Patent number: 11950356
    Abstract: A printed circuit board includes a plurality of layers including attachment layers and routing layers; and via patterns formed in the plurality of layers, each of the via patterns including first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; ground vias extending through at least the attachment layers, the ground vias including ground conductors; and shadow vias located adjacent to each of the first and second signal vias, wherein the shadow vias are free of conductive material in the attachment layers. The printed circuit board may further include slot vias extending through the attachment layers and located between via patterns.
    Type: Grant
    Filed: December 13, 2022
    Date of Patent: April 2, 2024
    Assignee: Amphenol Corporation
    Inventors: Mark W. Gailus, Marc B. Cartier, Jr., Vysakh Sivarajan, David Levine
  • Publication number: 20240106153
    Abstract: A low-profile mezzanine connector. The connector is simple to manufacture and can be reliably formed even with a stack height of 4 mm or less yet has high signal integrity. The connector has a field of identically shaped contacts that are functionally differentiated through features of the housing, including lossy material in patches with narrower projections electrically coupled to contacts designated as ground contacts. The mating portions of the contacts are adjacent a wall of the housing, which is tapered to increase the effective dielectric constant in the vicinity of the signal contacts. Each contact may have a hole in it to engage an insertion tool to enable repeatable and stable insertion of the contacts into a housing. The footprint for mounting the connector to a PCB may include signal vias offset from the mounting pads for signal contacts.
    Type: Application
    Filed: September 21, 2023
    Publication date: March 28, 2024
    Applicant: Amphenol Corporation
    Inventors: Mark R. Gray, Benjamin Reed Staudt
  • Publication number: 20240097360
    Abstract: A modular high speed, high density electrical connector configurable for use in multiple configurations, including a direct attach orthogonal configuration. The connector is assembled with modules that include shielded pairs of signal conductors with mating ends that are rotated approximately 45 degrees with respect to intermediate portions of the signal conductors. The connector may have a mating interface with receptacles in one connector and pins in the mating connector. The pins may be small diameter and may be implemented with superelastic wires so as to resist damage despite having very small effective diameter. A compact mating interface resulting from small diameter mating contact portions may enable other portions of the connector, including the shielding surrounding the signal conductors to be smaller, which may raise the resonant frequency of the connector and extend its bandwidth.
    Type: Application
    Filed: June 22, 2023
    Publication date: March 21, 2024
    Applicant: Amphenol Corporation
    Inventors: Marc B. Cartier, JR., John Robert Dunham, Mark W. Gailus, John Pitten
  • Patent number: 11933436
    Abstract: A method and apparatus for securing a bundle of wires to a surface via a clamp assembly is disclosed. The assembly includes a clamp, such as a P-clamp, that may be mounted to a support before installing a bundle of wires. The clamp includes first and second clamp members that cooperate to form an opening through which the wire bundle extends. The first and second clamp members may be engaged with and disengaged from one another without a tool. In some embodiments, the P-clamp includes a snap-in mechanism with a clip and a corresponding housing. In some embodiments, the clamp includes an inner cushion that allows the clamp to accommodate a range of wire bundle diameters.
    Type: Grant
    Filed: June 26, 2020
    Date of Patent: March 19, 2024
    Assignee: Amphenol Corporation
    Inventors: Jeremi Proulx, Mathieu Desjardins, Dimitri Laflamme, Rachid Ouallou
  • Patent number: 11936131
    Abstract: A sealed electrical connector that includes an interface component that has housing with a front end and an opposite rear end, the front end has an open end face for receiving a mating connector, and the rear end for receiving cable. The housing has contacts. A terminal-position-assurance feature is coupled to the contacts and to the housing. The terminal-position-assurance feature may be located at a first axial position along the longitudinal axis of the housing which is a first distance from the open end face of the housing. An interface seal surrounds an outer portion of the housing. The interface seal is located on the housing at a second axial position along the longitudinal axis of the housing which is a second distance from the open end face of the housing. The second distance is greater than the first distance.
    Type: Grant
    Filed: September 17, 2021
    Date of Patent: March 19, 2024
    Assignee: Amphenol Corporation
    Inventors: Joachim Grek, Kyle Christopher Elmes
  • Patent number: 11929571
    Abstract: An electrical socket and method of making an electrical socket. The socket includes a body that has spaced contact beams extending between the first and second ends and an inner receiving area for accepting a mating pin. The contact beams are configured for aligning into a hyperbolic geometry. Each of the contact beams has a middle section between first and second end sections. Each middle section has a pre-formed contour that defines a cross-section of each contact beam that defines a fully radiused, inner contact area without sharp edges such that each middle section extends further into the inner receiving area than the first and second end sections when the contact beams are aligned into the hyperbolic geometry and such that the fully radiused, inner contact areas of the contact beams are positioned for contact with the mating pin when inserted into the inner receiving area of the socket body.
    Type: Grant
    Filed: September 1, 2022
    Date of Patent: March 12, 2024
    Assignee: Amphenol Corporation
    Inventor: Michael E. Uppleger
  • Publication number: 20240055785
    Abstract: A cable assembly comprising a connector with a termination that enables high density and high signal integrity. Shields of cables are terminated to a paddle card via a conductive structure attached to a surface of the paddle card. The signal conductors of the cables are terminated to pads on the paddle card that are exposed within openings of the conductive structure. Such a structure creates a ground structure per cable that provides low insertion loss and low crosstalk, even when multiple cables are aligned side by side and terminated in one or more rows. The cables may be drainless, enabling a large number of cables, such as eight cables, to be packed within the width of a paddle card specified in high density standards such as QSFP-DD or OSFP. The cables may nonetheless have large diameter signal conductors, enabling 2.5 or 3 meter assemblies with less than 17 dB insertion loss.
    Type: Application
    Filed: July 17, 2023
    Publication date: February 15, 2024
    Applicant: Amphenol Corporation
    Inventors: Mark M. Ayzenberg, Khwajahussain Gadwal Mohammed, Erdem Matoglu, Catalin Muntean
  • Patent number: 11901678
    Abstract: A contact member includes, an outer conductor including a mating interface section that includes a front end of the outer conductor, a termination section including a rear end of the outer conductor, and a middle section therebetween joining the mating interface and termination sections; an inner conductor received in the mating interface section; and a protective insulator including a main portion received in the mating interface section of the outer conductor and supporting the inner conductor and including an end portion configured for closed entry mating. The end portion has an end face extending outside of the front end of the outer conductor.
    Type: Grant
    Filed: January 23, 2023
    Date of Patent: February 13, 2024
    Assignee: Amphenol Corporation
    Inventors: Michael A Hoyack, Owen R. Barthelmes, Kenneth Capozzi
  • Patent number: 11901660
    Abstract: A broadside coupled connector assembly has two sets of conductors, each separate planes. By providing the same path lengths, there is no skew between the conductors of the differential pair and the impedance of those conductors is identical. The conductor sets are formed by embedding the first set of conductors in an insulated housing having a top surface with channels. The second set of conductors is placed within the channels so that no air gaps form between the two sets of conductors. A second insulated housing is filled over the second set of conductors and into the channels to form a completed wafer. The ends of the conductors are received in a blade housing. Differential and ground pairs of blades have one end that extends through the bottom of the housing having a small footprint. An opposite end of the pairs of blades diverge to connect with the wafers.
    Type: Grant
    Filed: February 17, 2021
    Date of Patent: February 13, 2024
    Assignee: Amphenol Corporation
    Inventors: Thomas S. Cohen, Huilin Ren, Marc B. Cartier, Jr., Trent K. Do, Mark W. Gailus
  • Patent number: 11901654
    Abstract: A method of interconnecting first and second printed circuit boards using a float connector with a contact assembly that includes installing a first guide member onto the first printed circuit board with the float connector in an open non-compressed position, after installing the first guide member onto the first printed circuit board, installing a second guide member onto the second printed circuit board with the float connector in the open non-compressed position, and compressing the first and second printed circuit boards toward one another to move the float connector from the open non-compressed position to a compressed position until contact ends of the contact assembly of the float connector are exposed outside of the first and second guide members, respectively, thereby electrically connecting the contact ends to the first and second printed circuit boards, respectively, for electrical connection between the first and second printed circuit boards through the float connector.
    Type: Grant
    Filed: September 10, 2020
    Date of Patent: February 13, 2024
    Assignee: AMPHENOL CORPORATION
    Inventors: Michael A. Hoyack, Joachim I. Grek, Owen R. Barthelmes
  • Patent number: 11901663
    Abstract: An electrical connector with improved high frequency performance. The connector has conductive elements, forming both signal and ground conductors, that have multiple points of contact distributed along an elongated dimension. The ground conductors may be formed with multiple beams of different length. The signal conductors may be formed with multiple contact regions on a single beam, with different characteristics. Signal conductors may have beams that are jogged to provide both a desired impedance and mating contact pitch. Additionally, electromagnetic radiation, inside and/or outside the connector, may be shaped with an insert electrically connecting multiple ground structures and/or a contact feature coupling ground conductors to a stiffener. The conductive elements in different columns may be shaped differently to reduce crosstalk.
    Type: Grant
    Filed: December 5, 2022
    Date of Patent: February 13, 2024
    Assignee: Amphenol Corporation
    Inventor: Thomas S. Cohen
  • Patent number: 11894649
    Abstract: Electrical connectors and methods of making the connectors. The method steps include inserting one or more contacts into a temporary contact holder; removably coupling the contact holder with a connector housing, thereby creating a pour receiving cavity inside of the housing; adding a flowable curable material into the cavity to at least partially fill the cavity and surround at least part of the contacts residing in the connector housing; and removing the contact holder from the connector housing, thereby leaving mating contact ends of the one or more contacts exposed and leaving the mating contact ends set in the ready position for mating with a complementary connector.
    Type: Grant
    Filed: October 30, 2020
    Date of Patent: February 6, 2024
    Assignee: Amphenol Corporation
    Inventor: Matthew Robert Simonds
  • Publication number: 20240030660
    Abstract: A modular electrical connector with separately shielded signal conductor pairs. The connector may be assembled from modules, each containing a pair of signal conductors with surrounding partially or fully conductive material. Modules of different sizes may be assembled into wafers, which are then assembled into a connector. Wafers may include lossy material. In some embodiments, shielding members of two mating connectors may each have compliant members along their distal portions, such that, the shielding members engage at points of contact at multiple locations, some of which are adjacent the mating edge of each of the mating shielding members.
    Type: Application
    Filed: June 15, 2023
    Publication date: January 25, 2024
    Applicant: Amphenol Corporation
    Inventors: Marc B. Cartier, JR., John Robert Dunham, Mark W. Gailus, Donald A. Girard, JR., David Manter, Tom Pitten, Vysakh Sivarajan, Michael Joseph Snyder
  • Publication number: 20240023232
    Abstract: A printed circuit board includes a plurality of layers including attachment layers and routing layers; and columns of via patterns formed in the plurality of layers, wherein via patterns in adjacent columns are offset in a direction of the columns, each of the via patterns comprising: first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; and at least one conductive shadow via located between the first and second signal vias of the differential pair. In some embodiments, at least one conductive shadow via is electrically connected to a conductive surface film.
    Type: Application
    Filed: September 27, 2023
    Publication date: January 18, 2024
    Applicant: Amphenol Corporation
    Inventors: Marc Robert Charbonneau, Jose Ricardo Paniagua
  • Publication number: 20240022011
    Abstract: Compliant lids for processor socket assemblies are described. The compliant lids described herein ensure uniform compression across the contact field notwithstanding the recent trend to continue to increase the physical dimension of the socket and the density of contacts. Compression uniformity can be enhanced by relocating the pressure exerted on the package away from the corners of the package. This can be accomplished by designing the compliant lids to have openings shaped to interrupt the continuous material that would otherwise extend from the corner of the lid to the region where the lid engages the processor. This void of material is shaped so that continual presence of material exists primarily in the region where the force delivery is preferred. Use of such compliant lids can enhance compression uniformity without having to rely on complex curved plates and stepped insulators.
    Type: Application
    Filed: June 26, 2023
    Publication date: January 18, 2024
    Applicant: Amphenol Corporation
    Inventors: Paul R. Taylor, Rodney Grove
  • Publication number: 20240014584
    Abstract: A low profile interposer with multiple electrical contacts held in a housing. Each electrical contact is disposed within a respective opening of the housing. The electrical contact includes a base, a first beam extending from the base to a distal end of the first beam, a second beam extending from the base to a distal end of the second beam. When the electrical contact is in an uncompressed state, a first portion of the distal end of the first beam and a first portion of the distal end of the second beam are positioned between the top surface and the bottom surface; and a second portion of the distal end of the first beam extends above the top surface and a second portion of the distal end of the second beam extends below the bottom surface.
    Type: Application
    Filed: July 7, 2023
    Publication date: January 11, 2024
    Applicant: Amphenol Corporation
    Inventor: Paul R. Taylor
  • Patent number: 11870198
    Abstract: An electrical connector that has a conductive shell supporting at least one signal contact therein and that has a front end for mating with a mating connector and a back end opposite the front end for electrically connecting to a coaxial cable. A ground connection is located inside of the conductive shell. A coupling member is rotatably coupled to the conductive shell and has an engagement feature for mechanically engaging a support panel associated with the mating connector. A sealing member is disposed on the conductive shell that is configured to provide an environmental seal between the conductive shell and the support panel when the conductive shell is mated with the mating connector.
    Type: Grant
    Filed: January 26, 2022
    Date of Patent: January 9, 2024
    Assignee: Amphenol Corporation
    Inventors: James Todd Smith, Michael A. Hoyack, Owen R. Barthelmes
  • Publication number: 20240006784
    Abstract: A low profile interposer with multiple electrical contacts held in a housing via a process, such as heat staking, that deforms portions of the housing into protuberances that lock the electrical contacts within openings of the housing. The contacts may be arranged in multiple parallel columns and may have an elongated dimension that is aligned at an acute angle with respect to the column direction. Distal tips of the contact portions of the electrical contacts may be bent to extend into an opening in the housing, even when the electrical contact is in an uncompressed state.
    Type: Application
    Filed: June 29, 2023
    Publication date: January 4, 2024
    Applicant: Amphenol Corporation
    Inventor: Paul R. Taylor