Patents Assigned to Amphenol Corporation
  • Patent number: 11637401
    Abstract: A cable termination that provides low signal distortion even at high frequencies. Conductive elements of the cable are fused to edges of signal conductors in a cable connector or other component terminating the cable. For terminating a differential pair, the conductive elements of the cable may be terminated to opposing edges of a pair of signal conductors in the cable termination. The conductive elements may be shaped such that the spacing between signal paths passing through the conductive elements of the cable and into the signal conductors of the cable termination is uniform.
    Type: Grant
    Filed: March 8, 2021
    Date of Patent: April 25, 2023
    Assignee: Amphenol Corporation
    Inventors: Mark W. Gailus, Allan Astbury, David Manter, Marc B. Cartier, Jr., Vysakh Sivarajan, John Robert Dunham
  • Patent number: 11637398
    Abstract: An electrical connector includes a connector shell, a coupling nut, and an indicator surrounding the connector shell. The indicator includes a clamp member and a check member. The clamp member includes a ring and a coupling structure extending from the ring to the check member and coupling the ring to the check member. The indicator may assist a user in determining if the electrical connector is in a fully-mated state.
    Type: Grant
    Filed: July 19, 2021
    Date of Patent: April 25, 2023
    Assignee: Amphenol Corporation
    Inventor: Erik Strahl
  • Patent number: 11637389
    Abstract: An electrical interconnect for passing high speed signals through an electronic system with a high density of signals and high signal integrity. The interconnect includes an electrical connector and a transition portion of a printed circuit board to which the connector is mounted. Signal conductors are connected to pads on the surface of the PCB using edge-to-pad mounting. The pads align with intermediate portions of the signal conductors such that transitions within the connector that could degrade signal integrity are avoided. The signal conductors may be positioned as individually shielded broadside coupled pairs extending in rows within the connector. Surface traces on the PCB connect the pads to signal vias aligned for vertical routing out of the connector footprint. Ground planes underlying the surface traces facilitate a transition from the signal paths in the connector to those in the PCB with low mode conversion avoiding resonances in the connector shields.
    Type: Grant
    Filed: January 27, 2021
    Date of Patent: April 25, 2023
    Assignee: Amphenol Corporation
    Inventors: John Robert Dunham, Marc B. Cartier, Jr., Mark W. Gailus, David Levine, Allan Astbury, Vysakh Sivarajan, Daniel B. Provencher, Eric Leo
  • Patent number: 11637403
    Abstract: An electrical interconnect for passing high speed signals through an electronic system with a high density of signals and high signal integrity. The interconnect includes an electrical connector and a transition portion of a printed circuit board to which the connector is mounted. Signal conductors are connected to pads on the surface of the PCB using edge-to-pad mounting. The pads align with intermediate portions of the signal conductors such that transitions within the connector that could degrade signal integrity are avoided. The signal conductors may be positioned as individually shielded broadside coupled pairs extending in rows within the connector. Surface traces on the PCB connect the pads to signal vias aligned for vertical routing out of the connector footprint. Ground planes underlying the surface traces facilitate a transition from the signal paths in the connector to those in the PCB with low mode conversion avoiding resonances in the connector shields.
    Type: Grant
    Filed: January 27, 2021
    Date of Patent: April 25, 2023
    Assignee: Amphenol Corporation
    Inventors: Marc B. Cartier, Jr., John Robert Dunham, Mark W. Gailus, David Levine, Allan Astbury, Vysakh Sivarajan, Daniel B. Provencher, Eric Leo
  • Publication number: 20230113153
    Abstract: A printed circuit board includes a plurality of layers including attachment layers and routing layers; and via patterns formed in the plurality of layers, each of the via patterns including first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; ground vias extending through at least the attachment layers, the ground vias including ground conductors; and shadow vias located adjacent to each of the first and second signal vias, wherein the shadow vias are free of conductive material in the attachment layers. The printed circuit board may further include slot vias extending through the attachment layers and located between via patterns.
    Type: Application
    Filed: December 13, 2022
    Publication date: April 13, 2023
    Applicant: Amphenol Corporation
    Inventors: Mark W. Gailus, Marc B. Cartier, JR., Vysakh Sivarajan, David Levine
  • Publication number: 20230099389
    Abstract: An electrical connector with improved high frequency performance. The connector has conductive elements, forming both signal and ground conductors, that have multiple points of contact distributed along an elongated dimension. The ground conductors may be formed with multiple beams of different length. The signal conductors may be formed with multiple contact regions on a single beam, with different characteristics. Signal conductors may have beams that are jogged to provide both a desired impedance and mating contact pitch. Additionally, electromagnetic radiation, inside and/or outside the connector, may be shaped with an insert electrically connecting multiple ground structures and/or a contact feature coupling ground conductors to a stiffener. The conductive elements in different columns may be shaped differently to reduce crosstalk.
    Type: Application
    Filed: December 5, 2022
    Publication date: March 30, 2023
    Applicant: Amphenol Corporation
    Inventor: Thomas S. Cohen
  • Patent number: 11563292
    Abstract: An electrical connector comprises an insulative shell having a floor; a first plurality of contacts extending through the floor, wherein the first plurality of contacts are disposed in a plurality of columns; a second plurality of contacts extending through the floor, wherein the second plurality of contacts are interspersed with the first plurality of contacts within the plurality of columns; and a conductive member adjacent the floor. The conductive member comprises a first plurality of openings, wherein the first plurality of contacts extend through the openings of the first plurality of openings; a second plurality of openings, wherein the second plurality of contacts extend through the openings of the second plurality of openings; and a first plurality of tabs, extending into openings in the insulative shell.
    Type: Grant
    Filed: February 22, 2021
    Date of Patent: January 24, 2023
    Assignee: Amphenol Corporation
    Inventors: Thomas S. Cohen, Robert Richard, Eric Leo
  • Patent number: 11563295
    Abstract: A contact member includes, an outer conductor including a mating interface section that includes a front end of the outer conductor, a termination section including a rear end of the outer conductor, and a middle section therebetween joining the mating interface and termination sections; an inner conductor received in the mating interface section; and a protective insulator including a main portion received in the mating interface section of the outer conductor and supporting the inner conductor and including an end portion configured for closed entry mating. The end portion has an end face extending outside of the front end of the outer conductor.
    Type: Grant
    Filed: February 8, 2021
    Date of Patent: January 24, 2023
    Assignee: AMPHENOL CORPORATION
    Inventors: Michael A. Hoyack, Owen R. Barthelmes, Kenneth Capozzi
  • Publication number: 20230017428
    Abstract: A subassembly for efficiently and reliably assembling a high performance electronic device. The electronic device may include numerous cabled interconnects in a subassembly that is subsequently mechanically and electrically connected to a PCB populated with high performance electronic components. First ends of cables in the cabled interconnects may be terminated by a first type of connector configured for connection to the PCB via a downward force. The second ends of the cables may be terminated with a second type of connectors that may make connections to other portions of an electronic system incorporating the electronic device. The connectors at the first ends of the cables may be releasably held within an organizer. The connectors may be simply mounted to the PCB by positioning the organizer with respect to the PCB, releasing the connectors from the organizer, and pushing the connectors into engagement with mounting locations on the PCB.
    Type: Application
    Filed: July 8, 2022
    Publication date: January 19, 2023
    Applicant: Amphenol Corporation
    Inventor: Michael D. Long
  • Publication number: 20230010530
    Abstract: A high frequency cable connector with a plug connector terminating shielded cables via a plurality of cable connection modules attached to a paddle card. The terminations do not significantly disrupt the high integrity signal paths within the cables, even at high frequencies. Various techniques may be used, alone or in combination, to form the termination, including that the wire insulators and shields of the cables extend almost to the point of termination, with a relatively small length of wire extending beyond the insulator and shield; welding of cable wires to signal terminals in the modules; signal terminals and ground terminals held within the modules with a controlled relative spacing; signal terminals of the modules surface mount soldered to pads on the paddle card; narrow pads approximating the width of traces in the paddle card; and short pads, approximating the length of mounting ends of the signal terminals.
    Type: Application
    Filed: July 7, 2022
    Publication date: January 12, 2023
    Applicant: Amphenol Corporation
    Inventor: Mark M. Ayzenberg
  • Publication number: 20230012133
    Abstract: A subassembly for efficiently and reliably assembling a high performance electronic device. The electronic device may include numerous cabled interconnects in a subassembly that is subsequently mechanically and electrically connected to a PCB populated with high performance electronic components. First ends of cables in the cabled interconnects may be terminated by a first type of connector configured for connection to the PCB via a downward force. The second ends of the cables may be terminated with a second type of connectors that may make connections to other portions of an electronic system incorporating the electronic device. The connectors at the first ends of the cables may be releasably held within an organizer. The connectors may be simply mounted to the PCB by positioning the organizer with respect to the PCB, releasing the connectors from the organizer, and pushing the connectors into engagement with mounting locations on the PCB.
    Type: Application
    Filed: July 8, 2022
    Publication date: January 12, 2023
    Applicant: Amphenol Corporation
    Inventor: Michael D. Long
  • Patent number: 11553589
    Abstract: A printed circuit board includes a plurality of layers including attachment layers and routing layers; and columns of via patterns formed in the plurality of layers, wherein via patterns in adjacent columns are offset in a direction of the columns, each of the via patterns comprising: first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; and at least one conductive shadow via located between the first and second signal vias of the differential pair. In some embodiments, at least one conductive shadow via is electrically connected to a conductive surface film.
    Type: Grant
    Filed: March 31, 2021
    Date of Patent: January 10, 2023
    Assignee: Amphenol Corporation
    Inventors: Marc Robert Charbonneau, Jose Ricardo Paniagua
  • Patent number: 11546983
    Abstract: A printed circuit board includes a plurality of layers including attachment layers and routing layers; and via patterns formed in the plurality of layers, each of the via patterns including first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; ground vias extending through at least the attachment layers, the ground vias including ground conductors; and shadow vias located adjacent to each of the first and second signal vias, wherein the shadow vias are free of conductive material in the attachment layers. The printed circuit board may further include slot vias extending through the attachment layers and located between via patterns.
    Type: Grant
    Filed: October 28, 2020
    Date of Patent: January 3, 2023
    Assignee: Amphenol Corporation
    Inventors: Mark W. Gailus, Marc B. Cartier, Jr., Vysakh Sivarajan, David Levine
  • Patent number: 11539171
    Abstract: An electrical connector for high speed signals. The connector has multiple conductive elements that may serve as signal or ground conductors. A member formed with lossy material and conductive compliant members may be inserted in the connector. The conductive compliant members may be aligned with conductive elements of the connector configured as ground conductors. For a connector configured to carry differential signals, the ground conductors may separate pairs of signal conductors. The member may further include a conductive web, embedded within the lossy material, that interconnects the conductive compliant members. For a receptacle connector, the conductive elements may have mating contact portions aligned along opposing surfaces of a cavity. The conductive elements may have contact tails for attachment to a printed circuit board and intermediate portions connecting the mating contact portions and the contact tails. The conductive compliant members may press against the intermediate portions.
    Type: Grant
    Filed: February 1, 2021
    Date of Patent: December 27, 2022
    Assignee: Amphenol Corporation
    Inventors: Brian Kirk, Jason Si, Ba Pham, Sam Kocsis, David Chan, Wonder Wang, Bob Tang, Martin Li, Smith Wu
  • Patent number: 11539148
    Abstract: An electrical connector that includes an outer conductive shell that encloses at least one signal contact therein and includes a front end for mating with a mating connector and a back end opposite the front end for electrically connecting to a printed circuit board. A primary ground connection is located inside or outside of the outer conductive shell, the primary ground connection being configured to electrically engage the mating connector with the printed circuit board or coaxial cable. A secondary ground connection is located inside or outside of the outer conductive shell and is configured to electrically engage the mating connector with the printed circuit board or the coaxial cable.
    Type: Grant
    Filed: December 15, 2020
    Date of Patent: December 27, 2022
    Assignee: AMPHENOL CORPORATION
    Inventors: Owen R. Barthelmes, Michael A. Hoyack
  • Patent number: 11527840
    Abstract: A cable connector that includes an inner subassembly that includes a coupling nut for coupling to a mating connector or port and a post end for electrically connecting to a cable. An outer body includes separable sections that form an inner bore when assembled. The inner bore is configured to receive at least the post end of the inner subassembly. Each section of the outer body has a proximal end and a distal end and the distal ends are configured to accept the cable. The sections are releasably engaged for assembly of the outer body around at least a portion of the inner subassembly.
    Type: Grant
    Filed: November 20, 2020
    Date of Patent: December 13, 2022
    Assignee: Amphenol Corporation
    Inventors: Rakesh Thakare, Iuliu Cosmin Gordea, Caichun Song, Stefan Nicholas Hoogendoorn, Nicholas Padfield, Keith Mothersdale
  • Publication number: 20220393404
    Abstract: A spring seal for a cage of a high speed I/O connector, such as those compliant with an OSFP standard. The spring seal suppresses resonances in the operating frequency range of the connector in a space between the cage and a transceiver inserted in a channel of the cage to mate with the I/O connector. The spring seal has multiple peaks, separated by valleys, with short conducting paths between the peaks and valleys. The spring seal may connect a conductive exterior of the transceiver to a wall of the cage, with the peaks contacting a conductive exterior of the transceiver and the valleys contacting walls of the cage. The spring seal may have a plurality of slits that reduce the spring force while providing conducting paths between peaks and valleys.
    Type: Application
    Filed: June 7, 2022
    Publication date: December 8, 2022
    Applicant: Amphenol Corporation
    Inventors: Jason Si, R. Brad Brubaker, Brian Kirk
  • Patent number: 11522310
    Abstract: An electrical connector with improved high frequency performance. The connector has conductive elements, forming both signal and ground conductors, that have multiple points of contact distributed along an elongated dimension. The ground conductors may be formed with multiple beams of different length. The signal conductors may be formed with multiple contact regions on a single beam, with different characteristics. Signal conductors may have beams that are jogged to provide both a desired impedance and mating contact pitch. Additionally, electromagnetic radiation, inside and/or outside the connector, may be shaped with an insert electrically connecting multiple ground structures and/or a contact feature coupling ground conductors to a stiffener. The conductive elements in different columns may be shaped differently to reduce crosstalk.
    Type: Grant
    Filed: February 22, 2021
    Date of Patent: December 6, 2022
    Assignee: Amphenol Corporation
    Inventor: Thomas S. Cohen
  • Patent number: 11509075
    Abstract: An electrical connector that has a conductive shell supporting at least one signal contact therein and that has a front end for mating with a mating connector and a back end opposite the front end for electrically connecting to a coaxial cable. A ground connection is located inside of the conductive shell. A coupling member is rotatably coupled to the conductive shell and has an engagement feature for mechanically engaging a support panel associated with the mating connector. A sealing member is disposed on the conductive shell that is configured to provide an environmental seal between the conductive shell and the support panel when the conductive shell is mated with the mating connector.
    Type: Grant
    Filed: May 11, 2020
    Date of Patent: November 22, 2022
    Assignee: AMPHENOL CORPORATION
    Inventors: James Todd Smith, Michael A. Hoyack, Owen R. Barthelmes
  • Patent number: D980168
    Type: Grant
    Filed: October 1, 2020
    Date of Patent: March 7, 2023
    Assignee: Amphenol Corporation
    Inventors: David Chan, Wonder Wang, Bob Tang, Martin Li, Smith Wu, Jason Si, Sam Kocsis, Ba Pham, Brian Kirk