Abstract: A system for automatic loading of wafer boats onto a cantilever paddle for insertion of the wafer boats into a furnace tube includes an end effector carriage moving on a track and supporting an end effector having spaced, parallel pads to engage opposed outer side portions of a wafer boat. The end effector receives a wafer boat from a robotic arm of an elevator. The robotic arm moves transversely relative to the track to position the wafer boat over the track on which the paddle carriage moves. The end effector carriage moves the end effector pads under the wafer boat, lifts it from a pair of elevator tines, moves the wafer boat over a desired part of the paddle, and lowers the wafer boat onto the paddle. The end effector carriage then returns the end effector to an initial location.

Abstract: A system for automatic loading of wafer boats onto a cantilever paddle for insertion of the wafer boats into a furnace tube includes an end effector carriage moving on a track and supporting an end effector having spaced, parallel pads to engage opposed outer side portions of a wafer boat. The end effector receives a wafer boat from a robotic arm of an elevator. The robotic arm moves transversely relative to the track to position the wafer boat over the track on which the paddle carriage moves. The end effector carriage moves the end effector pads under the wafer boat, lifts it from a pair of elevator tines, moves the wafer boat over a desired part of the paddle, and lowers the wafer boat onto the paddle. The end effector carriage then returns the end effector to an initial location.

Abstract: In a photo-CVD system, ultraviolet light is introduced into a reaction chamber from light emitting elements of ultraviolet light sources, through transparent bulb surfaces thereof, and through elongated light pipes in a sealed wall bounding the reaction chamber. This prevents molecules of reactant gas in the reaction chamber from reaching and being deposited on the transparent bulb surfaces, and thereby prevents buildup of such reactant molecules from occurring and impeding flow of ultraviolet light into the reaction chamber.

Abstract: A photo-assisted chemical vapor deposition system includes a reaction chamber, a susceptor in the reaction chamber supporting a wafer, a source for introducing reactant gas into the reaction chamber through an inlet port, and a cover positioned in sealed relationship to the housing and partially bounding the reaction chamber, the cover including a plurality of elongated light pipe openings each having a length comparable to the thickness of a boundary layer of the reactant gas and a diameter-to-length ratio small enough to maintain one-dimensional purge gas flow through the light pipe openings. A plurality of transparent windows are disposed in sealed relationship with the cover and bound an outer end of each of the light pipe openings. Ultraviolet light is introduced through the light pipe openings, which also provide a thick gas layer through which reactant species of the reactant gas must diffuse to reach the window surface.

Abstract: Mixing of spent reactant gases with ambient air inside a semiconductor wafer fabrication facility is avoided and consequently corrosion of a scavenger box in a wafer fabrication facility is avoided. Repeatability of reaction gas results on wafers in a process tube is improved by maintaining precisely constant pressure in the wafer processing tube, which is operated close to ambient atmospheric pressure. This is accomplished by positioning an exhaust tube downstream from the wafers in the processing tube at a location that results in a uniform, repeatable reaction gas flow pattern between the wafers. Pressures at or near that point are measured by a differential manometer referenced to ambient atmospheric pressure to produce a pressure-indicating signal. The pressure indicating signal is electronically compared with a preset constant signal representative of the desired constant pressure at the pressure measurement point to produce an error signal.

Abstract: An apparatus for loading semiconductor wafers into a cantilever diffusion tube includes a cantilever paddle supporting a boatload of wafers. The paddle is moved into alignment with the open end of the cantilever diffusion tube. The open end portion of cantilever diffusion tube is moved to surround the paddle and boat load of wafers. The paddle is lowered slightly, causing the boat load of wafers to be supported on an inside surface of the cantilever diffusion tube and providing clearance around the paddle. The cantilever tube is withdrawn from the paddle, which then is withdrawn from the path of the cantilever diffusion tube. The cantilever tube and the boatload of wafers is moved into the hot zone of the furnace. After a heat treating operation, the cantilever diffusion tube is withdrawn from the furnace, and the reverse operation is performed to unload the boatload of wafers.