Abstract: The present invention involves a LED flip chip, its fabrication method and a display panel containing the LED flip chip. The LED flip chip comprises a first semiconductor layer, a second semiconductor layer, an active layer configured between the first and second semiconductor layers, a first electrode and a second electrode. At least one of the first and second electrodes includes at least two sub-electrodes.
Type:
Application
Filed:
March 25, 2022
Publication date:
July 7, 2022
Applicant:
CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD.
Abstract: A pixel compensation circuit is provided. The pixel compensation circuit includes a detecting circuit, a repairing circuit, a compensating circuit, and a light-emitting device. The detecting circuit is electrically coupled with the repairing circuit, the compensating circuit, and the light-emitting device. The compensating circuit is configured to provide a fixed current to the light-emitting device. The detecting circuit is configured to detect a current flowing through the light-emitting device. The repairing circuit is configured to determine a compensation current according to the current detected by the detecting circuit and input the compensation current into the light-emitting device. A display substrate and a display device are further provided.
Type:
Grant
Filed:
February 10, 2021
Date of Patent:
February 8, 2022
Assignee:
CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD.