Patents Assigned to Corporation for National Research Initiatives
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Patent number: 8895338Abstract: An improved method for the fabrication of Micro-Electro-Mechanical Systems (MEMS), Nano-Electro-Mechanical Systems (NEMS), Photonics, Nanotechnology, 3-Dimensional Integration, Micro- and Nano-Fabricated Devices and Systems for both rapid prototyping development and manufacturing is disclosed. The method includes providing a plurality of different standardized and repeatable process modules usable in fabricating the devices and systems, defining a process sequence for fabricating a predefined one of the devices or systems, and identifying a series of the process modules that are usable in performing the defined process sequence and thus in fabricating the predefined device or system.Type: GrantFiled: March 29, 2011Date of Patent: November 25, 2014Assignee: Corporation for National Research InitiativesInventor: Michael A. Huff
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Patent number: 8852378Abstract: The present invention relates generally to a metallic alloy composed of Titanium and Tungsten that together form an alloy having a Coefficient of Thermal Expansion (CTE), wherein the content of the respective constituents can be adjusted so that the alloy material can be nearly perfectly matched to that of a commonly used semiconductor and ceramic materials. Moreover, alloys of Titanium-Tungsten have excellent electrical and thermal conductivities making them ideal material choices for many electrical, photonic, thermoelectric, MMIC, NEMS, nanotechnology, power electronics, MEMS, and packaging applications. The present invention describes a method for designing the TiW alloy so as to nearly perfectly match the coefficient of thermal expansion of a large number of different types of commonly used semiconductor and ceramic materials.Type: GrantFiled: June 30, 2009Date of Patent: October 7, 2014Assignee: Corporation for National Research InitiativesInventors: Michael A. Huff, Paul Sunal
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Publication number: 20140268076Abstract: A dynamic pattern generator (DPG) device and method of making a DPG device are disclosed. The DPG device is used in semiconductor processing tools that require multiple electron-beams, such as direct-write lithography. The device is a self-aligned DPG device that enormously reduces the required tolerances for aligning the various electrode layers, as compared to other design configurations including the non-self-aligned approach and also greatly simplifies the process complexity and cost. A process sequence for both integrated and non-integrated versions of the self-aligned DPG device is described. Additionally, an advanced self-aligned DPG device that eliminates the need for a charge dissipating coating or layer to be used on the device is described. Finally, a fabrication process for the implementation of both integrated and non-integrated versions of the advanced self-aligned DPG device is described.Type: ApplicationFiled: March 15, 2013Publication date: September 18, 2014Applicant: CORPORATION FOR NATIONAL RESEARCH INITIATIVESInventor: CORPORATION FOR NATIONAL RESEARCH INITIATIVES
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Patent number: 8790534Abstract: A system and method are disclosed for the precision fabrication of Micro-Electro-Mechanical Systems (MEMS), Nano-Electro-Mechanical Systems (NEMS), Microsytems, Nanosystems, Photonics, 3-D integration, heterogeneous integration, and Nanotechology devices and structures. The disclosed system and method can also be used in any fabrication technology to increase the precision and accuracy of the devices and structures being made compared to conventional means of implementation. A platform holds and moves a substrate to be machined during machining and a plurality of lasers and/or ion beams are provided that are capable of achieving predetermined levels of machining resolution and precision and machining rates for a predetermined application. The plurality of lasers and/or ion beams comprises a plurality of the same type of laser and/or ion beam.Type: GrantFiled: May 2, 2011Date of Patent: July 29, 2014Assignee: Corporation for National Research InitiativesInventor: Michael A. Huff
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Patent number: 8660157Abstract: A laser diode system is disclosed in which a substrate made of a semiconductor material containing laser diodes is bonded to a substrate made from a metallic material without the use of any intermediate joining or soldering layers between the two substrates. The metal substrate acts as an electrode and/or heat sink for the laser diode semiconductor substrate. Microchannels may be included in the metal substrate to allow coolant fluid to pass through, thereby facilitating the removal of heat from the laser diode substrate. A second metal substrate including cooling fluid microchannels may also be bonded to the laser diode substrate to provide greater heat transfer from the laser diode substrate. The bonding of the substrates at low temperatures, combined with modifications to the substrate surfaces, enables the realization of a low electrical resistance interface and a low thermal resistance interface between the bonded substrates.Type: GrantFiled: July 16, 2012Date of Patent: February 25, 2014Assignee: Corporation for National Research InitiativesInventors: Michael A. Huff, Jonah Jacob
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Patent number: 8423670Abstract: A set of multiple servers in which each server (a) provides a service having a name or other identifier, and for which each server (b) has a network address that differs from the network addresses of the other servers in the set, and (c) is co-located with a resolution mechanism that maps a name or other identifier of the service that is received from a client to a network address that is local to the resolution mechanism. The resolution mechanisms are operated to enable a client to choose one of the servers as being currently operational and/or accessible to provide the service to the client, and to so choose the server without the client needing to first access the chosen server.Type: GrantFiled: January 25, 2006Date of Patent: April 16, 2013Assignee: Corporation for National Research InitiativesInventor: Sean David Reilly
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Publication number: 20130008875Abstract: A variable capacitor device is disclosed in which the capacitive tuning ratio and quality factor are increased to very high levels, and in which the capacitance value of the device is tuned and held to a desired value with a high level of accuracy and precision using a laser micromachining tuning process on suitably designed and fabricated capacitor devices. The tuning of the variable capacitor devices can be performed open-loop or closed-loop, depending on the precision of the eventual capacitor value needed or desired. Furthermore, the tuning to a pre-determined value can be performed before the variable capacitor device is connected to a circuit, or alternatively, the tuning to a desired value can be performed after the variable capacitor device has been connected into a circuit.Type: ApplicationFiled: September 12, 2012Publication date: January 10, 2013Applicant: Corporation for National Research InitiativesInventors: Michael A. HUFF, Mehmet Ozgur
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Patent number: 8304324Abstract: A method of wafer or substrate bonding a substrate made of a semiconductor material with a substrate made from a metallic material is disclosed. The method allows the bonding of the two substrates together without the use of any intermediate joining gluing, or solder layer(s) between the two substrates. The method allows the moderate or low temperature bonding of the metal and semiconductor substrates, combined with methods to modify the materials so as to enable low electrical resistance interfaces to be realized between the bonded substrates, and also combined with methods to obtain a low thermal resistance interface between the bonded substrates, thereby enabling various useful improvements for fabrication, packaging and manufacturing of semiconductor devices and systems.Type: GrantFiled: September 22, 2008Date of Patent: November 6, 2012Assignee: Corporation for National Research InitiativesInventor: Michael Huff
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Patent number: 8270081Abstract: A method of reflecting impinging electromagnetic radiation by using engineered surfaces of alternating layers of materials having different indices of refraction is described. These layers can be fabrication or applied onto the surfaces of macro-scale objects. Also, a method of limiting the heating within the interior of an object being impinged upon by electromagnetic radiation is described.Type: GrantFiled: November 10, 2008Date of Patent: September 18, 2012Assignee: Corporation For National Research InitiativesInventor: Michael A Huff
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Publication number: 20110309553Abstract: A system and method are disclosed for the precision fabrication of Micro-Electro-Mechanical Systems (MEMS), Nano-Electro-Mechanical Systems (NEMS), Microsytems, Nanosystems, Photonics, 3-D integration, heterogeneous integration, and Nanotechology devices and structures. The disclosed system and method can also be used in any fabrication technology to increase the precision and accuracy of the devices and structures being made compared to conventional means of implementation. A platform holds and moves a substrate to be machined during machining and a plurality of lasers and/or ion beams are provided that are capable of achieving predetermined levels of machining resolution and precision and machining rates for a predetermined application. The plurality of lasers and/or ion beams comprises a plurality of the same type of laser and/or ion beam.Type: ApplicationFiled: May 2, 2011Publication date: December 22, 2011Applicant: Corporation for National Research InitiativesInventor: Michael A. HUFF
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Patent number: 8007695Abstract: A method is disclosed of implementing lens elements or lens arrays having dimensions ranging from a few centimeters down to the micro-scale or nano-scale using the surface tension of the lens material in a molten state to allow the curved shape of the lens to be precisely defined. The method has useful application in the fabrication of lens elements and lens arrays out of a large variety of material types, including elemental materials, as well as compound materials and alloys. The method also allows the implementation of lenses having far superior surface smoothness compared to other approaches, as well as very accurate lens shapes. The method allows the making of high quality lenses and lens arrays, wherein the diameter of the lenses are on the order of a few microns or less. Convex, concave, plano-convex, plano-concave, compound lenses, and many other types of lens shapes can be implemented using the method of the present invention.Type: GrantFiled: March 12, 2009Date of Patent: August 30, 2011Assignee: Corporation for National Research InitiativesInventor: Michael A. Huff
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Patent number: 7994463Abstract: Methods for fabricating structures such as transducer pedestal structures and transducers fabricated by the methods.Type: GrantFiled: February 11, 2010Date of Patent: August 9, 2011Assignees: Corporation for National Research Initiatives, Science Research LaboratoryInventors: Allen M. Flusberg, Michael A. Huff
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Publication number: 20100118407Abstract: A method of reflecting impinging electromagnetic radiation by using engineered surfaces of alternating layers of materials having different indices of refraction is described. These layers can be fabrication or applied onto the surfaces of macro-scale objects. Also, a method of limiting the heating within the interior of an object being impinged upon by electromagnetic radiation is described.Type: ApplicationFiled: November 10, 2008Publication date: May 13, 2010Applicant: Corporation for National Research InitiativesInventor: Michael A. Huff
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Publication number: 20100108254Abstract: The present invention relates generally to a metallic alloy composed of Titanium and Tungsten that together form an alloy having a Coefficient of Thermal Expansion (CTE), wherein the content of the respective constituents can be adjusted so that the alloy material can be nearly perfectly matched to that of a commonly used semiconductor and ceramic materials. Moreover, alloys of Titanium-Tungsten have excellent electrical and thermal conductivities making them ideal material choices for many electrical, photonic, thermoelectric, MMIC, NEMS, nanotechnology, power electronics, MEMS, and packaging applications. The present invention describes a method for designing the TiW alloy so as to nearly perfectly match the coefficient of thermal expansion of a large number of different types of commonly used semiconductor and ceramic materials.Type: ApplicationFiled: June 30, 2009Publication date: May 6, 2010Applicant: Corporation for National Research InitiativesInventors: Michael A. Huff, Paul Sunal
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Publication number: 20090283927Abstract: A method is disclosed of implementing lens elements or lens arrays having dimensions ranging from a few centimeters down to the micro-scale or nano-scale using the surface tension of the lens material in a molten state to allow the curved shape of the lens to be precisely defined. The method has useful application in the fabrication of lens elements and lens arrays out of a large variety of material types, including elemental materials, as well as compound materials and alloys. The method also allows the implementation of lenses having far superior surface smoothness compared to other approaches, as well as very accurate lens shapes. The method allows the making of high quality lenses and lens arrays, wherein the diameter of the lenses are on the order of a few microns or less. Convex, concave, plano-convex, plano-concave, compound lenses, and many other types of lens shapes can be implemented using the method of the present invention.Type: ApplicationFiled: March 12, 2009Publication date: November 19, 2009Applicant: Corporation for National Research InitiativesInventor: Michael A. Huff
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Publication number: 20090286382Abstract: A method of wafer or substrate bonding a substrate made of a semiconductor material with a substrate made from a metallic material is disclosed. The method allows the bonding of the two substrates together without the use of any intermediate joining gluing, or solder layer(s) between the two substrates. The method allows the moderate or low temperature bonding of the metal and semiconductor substrates, combined with methods to modify the materials so as to enable low electrical resistance interfaces to be realized between the bonded substrates, and also combined with methods to obtain a low thermal resistance interface between the bonded substrates, thereby enabling various useful improvements for fabrication, packaging and manufacturing of semiconductor devices and systems.Type: ApplicationFiled: September 22, 2008Publication date: November 19, 2009Applicant: Corporation for National Research InitiativesInventor: Michael A. Huff
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Patent number: 7536769Abstract: An acoustic pressure type sensor is fabricated on a supporting substrate by depositing and etching a number of thin films on the supporting substrate and by machining the supporting substrate. The resulting structure contains a pressure sensitive, electrically conductive diaphragm positioned at a distance from an electrically conductive fixed electrode. In operation, the diaphragm deflects in response to an acoustic pressure and the corresponding change of electrical capacitance between the diaphragm and the fixed electrode is detected using an electrical circuit. Two or more such acoustic sensors are combined on the same supporting substrate with an interaural flexible mechanical connection, to form a directional sensor with a small surface area.Type: GrantFiled: May 25, 2006Date of Patent: May 26, 2009Assignee: Corporation for National Research InitiativesInventor: Michael Pedersen
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Publication number: 20090002914Abstract: A variable capacitor device is disclosed in which the capacitive tuning ratio and quality factor are increased to very high levels, and in which the capacitance value of the device is tuned and held to a desired value with a high level of accuracy and precision using a laser micromachining tuning process on suitably designed and fabricated capacitor devices. The tuning of the variable capacitor devices can be performed open-loop or closed-loop, depending on the precision of the eventual capacitor value needed or desired. Furthermore, the tuning to a pre-determined value can be performed before the variable capacitor device is connected to a circuit, or alternatively, the tuning to a desired value can be performed after the variable capacitor device has been connected into a circuit.Type: ApplicationFiled: June 27, 2008Publication date: January 1, 2009Applicant: Corporation for National Research InitiativesInventors: Michael A. Huff, Mehmet Ozgur
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Patent number: 7400737Abstract: An acoustic pressure type sensor fabricated on a supporting substrate is disclosed. The acoustic sensor is fabricated by depositing and etching a number of thin films on the supporting substrate and by machining the supporting substrate. The resulting structure contains a pressure sensitive, electrically conductive diaphragm positioned at a distance from an electrically conductive fixed electrode. In operation, the diaphragm deflects in response to an acoustic pressure and the corresponding change of electrical capacitance between the diaphragm and the fixed electrode is detected using an electrical circuit. Two or more such acoustic sensors are combined on the same supporting substrate with an interaural flexible mechanical connection, to form a directional sensor with a small surface area.Type: GrantFiled: May 30, 2006Date of Patent: July 15, 2008Assignee: Corporation for National Research InitiativesInventor: Michael Pedersen
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Patent number: 7362873Abstract: An acoustic pressure type sensor fabricated on a supporting substrate is disclosed. The acoustic sensor is fabricated by depositing and etching a number of thin films on the supporting substrate and by machining the supporting substrate. The resulting structure contains a pressure sensitive, electrically conductive diaphragm positioned at a distance from an electrically conductive fixed electrode. In operation, the diaphragm deflects in response to an acoustic pressure and the corresponding change of electrical capacitance between the diaphragm and the fixed electrode is detected using an electrical circuit. Two or more such acoustic sensors are combined on the same supporting substrate with an interaural flexible mechanical connection, to form a directional sensor with a small surface area.Type: GrantFiled: September 12, 2006Date of Patent: April 22, 2008Assignee: Corporation for National Research InitiativesInventor: Michael Pedersen