Abstract: According to certain embodiments, a micro controller unit of a smart computer case provides, based on the identification of the smart computer case: 1) lighting control of a plurality of individually addressable LEDs associated with computer case fans, logo panels and integrated lighting features, 2) fan speed control and monitoring, and 3) monitoring of temperature sensors. According to certain embodiments, each LED need not be RGB but instead can be single color LEDs.
Abstract: At least one hollow metal body with a plurality of micro heat pipes embedded in the hollow metal body is used as a heat sink to remove heat from memory chips in a memory device.
Abstract: A bracket for cooling a peripheral component interconnect card is disclosed. The bracket includes a plurality of heat transfer surfaces, mounting systems for a blower fan, fan shroud and liquid cooling system for cooling the peripheral component interconnect card.
Abstract: At least one hollow metal body with a plurality of micro heat pipes embedded in the hollow metal body is used as a heat sink to remove heat from memory chips in a memory device.
Abstract: A bracket for cooling a peripheral component interconnect card is disclosed. The bracket includes a plurality of heat transfer surfaces, mounting systems for a blower fan, fan shroud and liquid cooling system for cooling the peripheral component interconnect card.
Abstract: Monitoring parameters of memory modules is described. According to certain embodiments, one or more parameters on respective memory modules are monitored. Corresponding parameter information is transmitted from the respective memory module to a device that is external to the respective memory modules.
Abstract: An ATX compatible power supply unit having at least one DC power outlet and at least one DC power cable, the DC power outlet configured to support nominal contact resistances of less than 2.5 milliohms per contact or the DC power cable configured to support series resistances of less than 4 milliohms per linear foot of individual conductor is disclosed.
Type:
Grant
Filed:
February 26, 2010
Date of Patent:
July 29, 2014
Assignee:
Corsair Memory, Inc.
Inventors:
Donald Lieberman, Michael Gerard O'Connor, Martin Mueller
Abstract: Power supplied to a memory module is provided. A first voltage is supplied to a first power distribution pathway, the first voltage being from a voltage supplied to a printed circuit board on which the memory module resides. A second voltage is generated, the second voltage being generated by a voltage regulator. The second voltage is supplied to a second power distribution pathway.
Type:
Grant
Filed:
December 2, 2011
Date of Patent:
December 3, 2013
Assignee:
Corsair Memory, Inc.
Inventors:
Daniel Solvin, Martin Mueller, Donald Lieberman, John Beekley
Abstract: An ATX compatible power supply unit having a main printed circuit board and at least one connector printed circuit board that includes at least one outlet connector for use with a DC modular cable, the at least one connector printed circuit board is connected to the main printed circuit board with connectors other than bare or insulated wires to allow high currents to be transferred between the at least one connector printed circuit board and the main printed circuit board at low voltage drops is disclosed.