Abstract: An AT-cut crystal resonator plate includes: a vibrating part having a rectangular shape in plan view that is disposed on a center of the AT-cut crystal resonator plate and that has excitation electrodes respectively formed on a first and a second main surfaces; a cut-out part having a rectangular shape in plan view that is formed along an outer periphery of the vibrating part; an external frame part having a rectangular shape in plan view that is formed along an outer periphery of the cut-out part; and a connecting part that connects the vibrating part to the external frame part and that extends, in a Z? axis direction of the vibrating part, from one end part of a side of the vibrating part along an X axis direction. The connecting part includes wide parts whose widths gradually increase only toward the external frame part.

Abstract: In a crystal oscillator, a crystal resonator and an IC chip are hermetically sealed in a package. The crystal resonator includes: a crystal resonator plate including a first excitation electrode formed on a first main surface, and a second excitation electrode, which makes a pair with the first excitation electrode, formed on a second main surface; a first sealing member covering the first excitation electrode of the crystal resonator plate; and a second sealing member covering the second excitation electrode of the crystal resonator plate. A vibrating part including the first excitation electrode and the second excitation electrode of the crystal resonator plate is hermetically sealed by bonding the first sealing member to the crystal resonator plate, and the second sealing member to the crystal resonator plate.

Abstract: In a piezoelectric resonator device according to one or more embodiments, an internal space for hermetically sealing a vibrating part including a first excitation electrode and a second excitation electrode of a crystal resonator plate is formed by bonding a first sealing member and a second sealing member respectively to the crystal resonator plate. A through hole is formed in the second sealing member. A through electrode is formed along an inner wall surface of the through hole to establish conduction between an electrode formed on a first main surface and an external electrode terminal formed on a second main surface. A corrosion resistance structure to solder is formed on the through electrode that establishes conduction between the electrode and the external electrode terminal with a conductive metal other than Au.

Abstract: A tuning fork-type vibration piece is provided, in which a cushioning portion is formed on the base of a package to make contact with abutting portions of arm portions which are any parts but their edges, and the abutting portions of the arm portions allowed to contact the cushioning portion are electrodeless regions including no electrode, which prevents the risk of frequency fluctuations that may occur in case an electrode is chipped off by possible contact with the cushioning portion.

Abstract: In a piezoelectric resonator device according to an embodiment, an internal space is formed by bonding a first sealing member to a crystal resonator plate and bonding a second sealing member to the crystal resonator plate. The internal space hermetically seals a vibrating part including a first excitation electrode and a second excitation electrode of the crystal resonator plate. Seal paths that hermetically seal the vibrating part of the crystal resonator plate are formed to have an annular shape in plan view. A plurality of external electrode terminals is formed on a second main surface of the second sealing member to be electrically connected to an external circuit board. The external electrode terminals are respectively disposed on and along an external frame part surrounding the internal space in plan view.

Abstract: In a crystal oscillator, a crystal resonator plate is bonded to, via laminated bonding patterns, a first sealing member covering a first excitation electrode of the crystal resonator plate; and a second sealing member covering a second excitation electrode of the crystal resonator plate. An internal space is formed, which hermetically seals a vibrating part including the first and second excitation electrodes of the crystal resonator plate. The laminated bonding patterns include a laminated sealing pattern annularly formed to surround the vibrating part in plan view so as to hermetically seal the internal space, and a laminated conductive pattern establishing conduction between wiring and electrodes. The laminated conductive pattern is disposed within a closed space surrounded by the laminated sealing pattern. To the laminated sealing pattern, GND potential is applied when the crystal oscillator operates.

Abstract: A piezoelectric resonator device having a sandwich structure is provided. A crystal oscillator includes: a crystal resonator plate; a first sealing member covering a first excitation electrode of the crystal resonator plate; and a second sealing member covering a second excitation electrode of the crystal resonator plate. A parallelepiped shaped package is formed by bonding: the first sealing member to the crystal resonator plate; and the second sealing member to the crystal resonator plate. The package includes an internal space in which is hermetically sealed a vibrating part of the crystal resonator plate including the first excitation electrode and the second excitation electrode. A bonding material hermetically sealing the vibrating part of the crystal resonator plate is formed to have an annular shape in plan view, and is disposed along an outer peripheral edge of the package.

Abstract: A crystal resonator (101) includes: a piezoelectric resonator plate (2) on which a first excitation electrode and a second excitation electrode are formed; a first sealing member (3) that covers the first excitation electrode of the piezoelectric resonator plate (2); and a second sealing member (4) that covers the second excitation electrode of the piezoelectric resonator plate (2). The first sealing member (3) is bonded to the piezoelectric resonator plate (2) while the second sealing member (4) is bonded to the piezoelectric resonator plate (2) so that an internal space (13), which hermetically seals a vibrating part including the first excitation electrode and the second excitation electrode of the piezoelectric resonator plate (2), is formed. Plating films (51, 52) are formed respectively on both the first sealing member (3) and the second sealing member (4), on respective surfaces opposite to surfaces to be bonded to the piezoelectric resonator plate (2).

Abstract: A crystal oscillator includes: a crystal resonator plate having a first excitation electrode and a second excitation electrode. A first sealing member covers the first excitation electrode of the crystal resonator plate. A second sealing member covers the second excitation electrode of the crystal resonator plate. An internal space is formed by bonding the first sealing member to the crystal resonator plate and the second sealing member to the crystal resonator plate, and seals a vibrating part of the crystal resonator plate. First and second shield electrodes are connected to a fixed potential (e.g. GND potential) in the internal space.

Abstract: An object is to provide a frequency adjustment method for a piezoelectric resonator device that is applicable to a microminiaturized device and that can adjust the frequency without deteriorating the accuracy of frequency adjustment. A frequency adjustment method for a tuning-fork quartz resonator is applicable to a tuning-fork quartz resonator that includes a tuning-fork quartz resonator piece having a pair of resonator arms 31, 32 and metallic adjustment films W formed on the resonator arms. The frequency adjustment method adjusts the frequency by reduction of a mass of the metallic adjustment films W. The frequency adjustment method includes: a rough adjustment step for roughly adjusting the frequency by partially thinning or removing the metallic adjustment films W; and a fine adjustment step for finely adjusting the frequency by at least partially thinning or removing products W1, W2 derived from the metallic adjustment film W during the rough adjustment step.

Abstract: A through hole formed in an AT-cut crystal plate includes an inclined surface (72) that extends from a peripheral area toward a penetrating part (71) in a center part of the through hole. The inclined surface (72) includes: a first crystal surface S1 that extends from the penetrating part (71) toward the peripheral area of the through hole in a ?Z? and a +X directions; a second crystal surface S2 that extends from the penetrating part (71) toward the peripheral area of the through hole in the ?Z? and the +X directions and that contacts with the first crystal surface S1 in the +Z? and the +X directions of the first crystal surface S1; and a third crystal surface S3 that contacts with the second crystal surface S2 in the +X direction of the second crystal surface S2 and that contacts with the main surface of the AT-cut crystal plate.

Abstract: A piezoelectric resonator device having a sandwich structure is provided, which is stably bonded to an external element. In the piezoelectric resonator device 1, at least a vibrating part 21 of a piezoelectric substrate 2 is sealed by a first sealing member 3 and a second sealing member 4. The piezoelectric substrate 2 includes: the vibrating part 21; and an external frame part 23 that is thicker than the vibrating part 21 and that surrounds the outer periphery of the vibrating part 21. External electrodes 31 to be connected to an external element 5 are provided on at least one of the first sealing member 3 and the second sealing member 4. The external element 5 is connected to the external electrodes 31 at least on the external frame part 23 of the piezoelectric substrate 2.

Abstract: In a crystal resonator plate (2), a support part (24) extends from only one corner part positioned in the +X direction and in the ?Z? direction of a vibrating part (22) to an external frame part (23) in the ?Z? direction. The vibrating part (22) and at least part of the support part (24) form an etching region (Eg) having a thickness thinner than a thickness of the external frame part (23). A stepped part is formed at a boundary of the etching region (Eg), and a first lead-out wiring (223) is formed over the support part (24) to the external frame part (23) so as to overlap with the stepped part. At least part of the stepped part that is superimposed on the first lead-out wiring (223) is formed so as not to be parallel to the X axis in plan view.

Abstract: A piezoelectric resonator device having a sandwich structure is provided, which can avoid gas generation with reduced size or height. A crystal resonator includes a crystal resonator plate, a first sealing member and a second sealing member. A sealing-member-side first bonding pattern and a sealing-member-side second bonding pattern, both to be bonded to the crystal resonator plate, are formed respectively on the first and second sealing members. On the crystal resonator plate, a resonator-plate-side first bonding pattern to be bonded to the first sealing member is formed on a first main surface and a resonator-plate-side second bonding pattern to be bonded to the second sealing member is formed on a second main surface. The sealing-member-side first bonding pattern is bonded to the resonator-plate-side first bonding pattern, and the sealing-member-side second bonding pattern is bonded to the resonator-plate-side second bonding pattern, both by diffusion bonding.

Abstract: An AT-cut crystal resonator plate (2) includes a first main surface (2a) on which a first excitation electrode (211) is formed and a second main surface (2b) on which a second excitation electrode (212) is formed. The AT-cut crystal resonator plate (2) further includes: a substantially rectangular-shaped vibrating part (21) that is piezoelectrically vibrated when a voltage is applied to the first excitation electrode (211) and the second excitation electrode (212); a holding part (22) protruding from a corner part (21a) of the vibrating part (21) in a Z? axis direction of the AT-cut crystal; and an external frame part (23) configured to surround an external circumference of the vibrating part (21) and to hold the holding part (22).

Abstract: A crystal resonator (101) includes: a crystal resonator plate (2); a first sealing member (3); a second sealing member (4); and an internal space (13) hermetically sealing a vibrating part (22) of the crystal resonator plate (2). The crystal resonator plate (2) includes: the vibrating part (22); an external frame part (23) surrounding an outer periphery of the vibrating part (22); and a connecting part (24) connecting the vibrating part (22) to the external frame part (23). A first extraction electrode (223) drawn from a first excitation electrode (221) is formed on a first main surface of the connecting part (24) while a second extraction electrode (224) drawn from a second excitation electrode (222) is formed on a second main surface thereof. A wiring pattern (33) connected to the first extraction electrode (223) is formed on a second main surface (312) of the first sealing member (3).

Abstract: A crystal oscillator includes: a crystal resonator plate having a first excitation electrode and a second excitation electrode. A first sealing member covers the first excitation electrode of the crystal resonator plate. A second sealing member covers the second excitation electrode of the crystal resonator plate. An internal space is formed by bonding the first sealing member to the crystal resonator plate and the second sealing member to the crystal resonator plate, and seals a vibrating part of the crystal resonator plate. First and second shield electrodes are connected to a fixed potential (e.g. GND potential) in the internal space.

Abstract: In a crystal oscillator, a crystal resonator and an IC chip are hermetically sealed in a package. The crystal resonator includes: a crystal resonator plate including a first excitation electrode formed on a first main surface, and a second excitation electrode, which makes a pair with the first excitation electrode, formed on a second main surface; a first sealing member covering the first excitation electrode of the crystal resonator plate; and a second sealing member covering the second excitation electrode of the crystal resonator plate. A vibrating part including the first excitation electrode and the second excitation electrode of the crystal resonator plate is hermetically sealed by bonding the first sealing member to the crystal resonator plate, and the second sealing member to the crystal resonator plate.

Abstract: A crystal oscillator (101) includes: a piezoelectric resonator plate (2) on which a first excitation electrode and a second excitation electrode are formed; a first sealing member (3) covering the first excitation electrode of the piezoelectric resonator plate (2); a second sealing member (4) covering the second excitation electrode of the piezoelectric resonator plate (2); and an internal space (13) formed by bonding the first sealing member (3) to the piezoelectric resonator plate (2) and by bonding the second sealing member (4) to the piezoelectric resonator plate (2), so as to hermetically seal a vibrating part including the first excitation electrode and the second excitation electrode of the piezoelectric resonator plate (2). An electrode pattern (371) including a mounting pad for wire bonding is formed on an outer surface (first main surface (311)) of the first sealing member (3).

Abstract: A crystal resonator (101) includes: a piezoelectric resonator plate (2) on which a first excitation electrode and a second excitation electrode are formed; a first sealing member (3) that covers the first excitation electrode of the piezoelectric resonator plate (2); and a second sealing member (4) that covers the second excitation electrode of the piezoelectric resonator plate (2). The first sealing member (3) is bonded to the piezoelectric resonator plate (2) while the second sealing member (4) is bonded to the piezoelectric resonator plate (2) so that an internal space (13), which hermetically seals a vibrating part including the first excitation electrode and the second excitation electrode of the piezoelectric resonator plate (2), is formed. Plating films (51, 52) are formed respectively on both the first sealing member (3) and the second sealing member (4), on respective surfaces opposite to surfaces to be bonded to the piezoelectric resonator plate (2).