Abstract: A method for manufacturing piezoelectric resonator devices according to the present invention includes the following steps: a wafer forming step of preparing a thick-walled wafer 30 integrally formed with multiple lower lid members 3; a bonding step of bonding crystal resonator plates 2 to one main surface 31 of the wafer 30 via a bonding material 5 and bonding upper lid members 4 on the crystal resonator plates via a bonding material 5; a thinning step of thinning the wafer 30 from the other main surface 37 of the wafer; an external terminal forming step of forming external terminals on the other main surface of the thinned wafer; and a dividing step of cutting the wafer between each adjacent pair of crystal resonators so that multiple crystal resonators are obtained.

Abstract: A lead type piezoelectric resonator device includes a piezoelectric resonator plate and a lead terminal that supports the piezoelectric resonator plate. The piezoelectric resonator plate is provided with a terminal electrode that is electrically connected to the lead terminal, and the lead terminal is provided with a bonding layer that is electrically connected to the piezoelectric resonator plate. The piezoelectric resonator plate and the lead terminal are electromechanically bonded to each other by the terminal electrode and the bonding layer. A bonding material containing an Sn—Cu alloy is produced from the terminal electrode and the bonding layer by the bonding of the terminal electrode and the bonding layer.

Abstract: An electronic component package has a first sealing member main surface with mounted electronic element, and a second sealing member. An outer circumference portion of a second sealing member is molded into a tapered shape, providing a tapered area in at least part of the outer circumference. A flat area adjacent to the tapered area is provided in at least part of a flat portion inward of the outer circumference portion of the surface of the second sealing member. A first area corresponding to the tapered area and a second area corresponding to the flat area are provided adjacent to each other on a first main surface of the first sealing member with mounted electronic component element. A width W2 of the second area is 0.66 to 1.2 times a width W4 of the flat area. First and second bonding layers are formed and bonded with each other by heating.

Abstract: A tuning fork-type piezoelectric resonator plate has a resonator blank comprising a pair of vibrating leg portions and a base portion from which the leg portions protrude. The pair of leg portions are arranged in parallel protrudingly from one end face of the base portion, and a pronged portion is formed between the pair of leg portions in an intermediate position in a width direction of the one end face of the base portion. The base portion has a pair of through holes along the one end face of the base portion, and on another end face side opposite to the one end face of the base portion, a joining region that joins to an external portion. The pair of through holes are specially positioned and have special wall surface configurations.

Abstract: A scintillator material is made of a zinc-oxide single crystal grown on a +C surface or a ?C surface of a plate-shaped seed crystal of zinc oxide including a C surface as a main surface. The zinc-oxide single crystal contains In and Li. In response to an incident radiation, the scintillator material emits fluorescence of less than 20-ps fluorescence lifetime.

Abstract: There are disposed a sealing member, a pair of electrode pads to electrically couple a piezoelectric resonator, a plurality of connection pads to electrically couple an integrated circuit element and the piezoelectric resonator, and wiring patterns to establish electrical continuity between the pair of electrode pads and the plurality of connection pads, and the piezoelectric resonator and the integrated circuit element are disposed side by side in plan view. An output wiring pattern establishes electrical continuity between one of the connection pads and an alternating current output terminal of an oscillation circuit, and a power source wiring pattern establishs electrical continuity between one of the connection pads and a direct current power source terminal of the oscillation circuit. The electrode pads are disposed closer to the power source wiring pattern than the output wiring pattern.

Abstract: An optical filter 13 is provided with a quartz plate 2 and a filter group 3. The filter group 3 is constituted by combining a first filter 33 having transmission characteristics in the visible region and one preset band of the infrared region that is contiguous with the visible region, and a second filter 35 and a third filter 36 each having transmission characteristics in the visible region and another preset band of the infrared region that is removed from the visible region and having blocking characteristics in a band between the visible region and the other band of the infrared region. In the second filter 35 and the third filter 36, each of the bands in which blocking characteristics are obtained is approximately 150 nm or less, and the bands in which blocking characteristics are obtained overlap.

Abstract: A base of an electronic component package holds an electronic component element. The base has a bottom face in a rectangular shape in plan view. The base includes a pair of terminal electrodes having a rectangular shape on the bottom face. The pair of terminal electrodes are to be bonded on an external circuit substrate with a conductive bonding material. The pair of terminal electrodes have mutually symmetrical shapes. Each of the terminal electrodes has a long side adjacent to or on an edge of a long side of the bottom face. The long side of each of the terminal electrodes is disposed parallel to the long side of the bottom face. The long side of each of the terminal electrodes has a length that is more than half a length of the long side of the bottom face.

Abstract: A base of a surface-mount electronic component package holds an electronic component element and is to be mounted on a circuit board with a conductive bonding material. The base has a principal surface and an external connection terminal to be electrically connected to the circuit board. The external connection terminal is formed in the principal surface. The base includes a bump formed on the external connection terminal. The bump is smaller than the external connection terminal. The base has a distance d between an outer periphery end edge of the external connection terminal and an outer periphery end edge of the bump along an attenuating direction of stress on the external connection terminal The stress is generated in association of mounting of the base on the circuit board. The distance d is more than 0.00 mm and equal to or less than 0.45 mm.

Abstract: A piezoelectric resonator device in which excitation electrodes of a piezoelectric resonator plate are hermetically sealed, includes a plurality of sealing members that hermetically seal the excitation electrodes of the piezoelectric resonator plate. The plurality of sealing members each have a bonding layer, and at least one of the plurality of sealing members is provided with a bank portion and having the bonding layer formed on a top face of the bank portion. The plurality of sealing members are bonded together with the bonding layers of the sealing members, and a bonding material that contains an intermetallic compound is formed.

Abstract: A sealing member is for a piezoelectric resonator device that includes a piezoelectric resonator piece and a plurality of sealing members hermetically sealing a resonance region of the piezoelectric resonator piece. The sealing member includes a base material having one principal surface and includes a protruding portion on the one principal surface. The base material has another principal surface having a flat surface and a curved surface. The flat surface is a region corresponding to the protruding portion. The curved surface is a region other than the region of the flat surface. The sealing member includes a plurality of external terminals on the flat surface. The plurality of external terminals are to be connected to an external circuit board. The sealing member includes a plurality of inspection terminals on the curved surface. The plurality of inspection terminals is configured to inspect the piezoelectric resonator piece.

Abstract: An IR cut filter includes an infrared light absorber to absorb infrared light, and an infrared light reflector to reflect infrared light. The infrared light absorber has a light transmission property of 50% transmittance with respect to a wavelength in a wavelength band of 620 to 670 nm. The infrared light reflector has a light transmission property of 50% transmittance with respect to a wavelength in a wavelength band of 670 to 690 nm. The wavelength with respect to which the infrared light reflector has the 50% transmittance is longer than the wavelength with respect to which the infrared light absorber has the 50% transmittance. A combination of the infrared light absorber and the infrared light reflector provides a light transmission property of 50% transmittance with respect to a wavelength in the 620 to 670 nm wavelength band and less than 5% transmittance with respect to a 700 nm wavelength.

Abstract: An electronic component package has a first sealing member main surface with mounted electronic element, and a second sealing member. An outer circumference portion of a second sealing member is molded into a tapered shape, providing a tapered area in at least part of the outer circumference. A flat area adjacent to the tapered area is provided in at least part of a flat portion inward of the outer circumference portion of the surface of the second sealing member. A first area corresponding to the tapered area and a second area corresponding to the flat area are provided adjacent to each other on a first main surface of the first sealing member with mounted electronic component element. A width W2 of the second area is 0.66 to 1.2 times a width W4 of the flat area. First and second bonding layers are formed and bonded with each other by heating.

Abstract: An electronic component package sealing member that can be used as a first sealing member in an electronic component package in which an electrode of an electronic component element is hermetically sealed with the first sealing member and a second sealing member arranged so as to oppose each other, includes: a through hole that passes through a substrate of the electronic component package sealing member; an internal electrode that is formed on a face of the substrate opposing the second sealing member; an external electrode that is formed on a face of the substrate opposite the opposing face; and a through electrode that is formed on an inner side face of the through hole electrically connecting the internal electrode and the external electrode. In the electronic component package sealing member, at least one open face of the through hole is sealed with a resin material.

Abstract: A piezoelectric vibration device includes a piezoelectric vibration plate where an excitation electrode is formed, and an upper lid member and a lower lid member that hermetically seal the excitation electrode, the piezoelectric vibration plate having a region where the upper lid member is joined and a region where the lower lid member is joined, on front and back main surfaces, the upper lid member having a region on one main surface where the piezoelectric vibration plate is joined, and the lower lid member having a region on one main surface where the piezoelectric vibration plate is joined. At least one of a substrate of the joining region of the piezoelectric vibration plate, a substrate of the joining region of the upper lid member, and a substrate of the joining region of the lower lid member has a roughened surface.

Abstract: An IR cut filter includes an infrared light absorber to absorb infrared light, and an infrared light reflector to reflect infrared light. The infrared light absorber has a light transmission property of 50% transmittance with respect to a wavelength in a wavelength band of 620 to 670 nm. The infrared light reflector has a light transmission property of 50% transmittance with respect to a wavelength in a wavelength band of 670 to 690 nm. The wavelength with respect to which the infrared light reflector has the 50% transmittance is longer than the wavelength with respect to which the infrared light absorber has the 50% transmittance. A combination of the infrared light absorber and the infrared light reflector provides a light transmission property of 50% transmittance with respect to a wavelength in the 620 to 670 nm wavelength band and less than 5% transmittance with respect to a 700 nm wavelength.

Abstract: In a piezoelectric resonator plate, a substrate having a main face formed in a rectangular shape is provided with a vibration portion and a joining portion that are integrated with each other, the vibration portion including a vibration region configured by forming a pair of excitation electrodes, and the joining portion having formed therein a pair of terminal electrodes that is joined to an external portion. The terminal electrodes in the pair each have a conductive bump formed therein and are electrically connected respectively to the excitation electrodes in the pair. Also, the substrate includes a post portion formed convexly at a position where the pair of terminal electrodes is formed.

Abstract: An electronic component package is provided with a base on which an electronic component element is mounted and a lid that includes a conductive member and that is bonded to the base with a sealing member so as to hermetically seal the electronic component element. The base includes a bottom portion and a wall portion that extends from the bottom portion. A cavity in which the electronic component element is mounted is formed on a first main surface of the base by the bottom portion and the wall portion. The base also includes electrode pads electrically connected to electrodes of the electronic component element, external terminals electrically connected to outside and line patterns electrically connected to the electrode pads and the external terminals. The external terminals include a GND terminal for grounding.

Abstract: A base of a surface-mount electronic component package holds an electronic component element and is to be mounted on a circuit board with a conductive bonding material. The base has a principal surface and an external connection terminal to be electrically connected to the circuit board. The external connection terminal is formed in the principal surface. The base includes a bump formed on the external connection terminal. The bump is smaller than the external connection terminal. The base has a distance d between an outer periphery end edge of the external connection terminal and an outer periphery end edge of the bump along an attenuating direction of stress on the external connection terminal The stress is generated in association of mounting of the base on the circuit board. The distance d is more than 0.00 mm and equal to or less than 0.45 mm.

Abstract: An IR cut filter includes an infrared light absorber to absorb infrared light, and an infrared light reflector to reflect infrared light. The infrared light absorber has a light transmission property of 50% transmittance with respect to a wavelength in a wavelength band of 620 to 670 nm. The infrared light reflector has a light transmission property of 50% transmittance with respect to a wavelength in a wavelength band of 670 to 690 nm. The wavelength with respect to which the infrared light reflector has the 50% transmittance is longer than the wavelength with respect to which the infrared light absorber has the 50% transmittance. A combination of the infrared light absorber and the infrared light reflector provides a light transmission property of 50% transmittance with respect to a wavelength in the 620 to 670 nm wavelength band and less than 5% transmittance with respect to a 700 nm wavelength.