Abstract: A silicone-rubber composition for coating textile fabrics characterized in that the silicone-rubber composition comprises the following components: an alkenyl group-containing organopolysiloxane (A) that comprises a mixture of an organopolysiloxane (A-1) that contains in one molecule at least two alkenyl groups in the amount not exceeding 2 mass % and an organopolysiloxane (A-2) that contains in one molecule at least two alkenyl groups in amount of 5 mass % or more; an organohydrogenpolysiloxane (B) that comprises a mixture of an organohydrogenpolysiloxane (B-1) that has in one molecule on average three silicon-bonded hydrogen atoms and an organohydrogenpolysiloxane (B-2) that has in one molecule on average two silicon-bonded hydrogen atoms; a hydrosilylation catalyst (C); and a reinforcement fine silica powder (D); and elongation according to JIS K6251 of the cured product of the composition is equal to or greater than 800%.

Abstract: A methacryloxy group- or acryloxy group-containing polyorganosiloxane in which a methacryloxy group or acryloxy group is bonded to a silicon atom in the polyorganosiloxane across a long-chain alkylene group or poly(alkyleneoxy)-long chain-alkylene group having 11 to 20 carbon atoms. A method of producing this methacryloxy group- or acryloxy group-containing polyorganosiloxane, in which a silicon-bonded hydrogen atom-containing polyorganosiloxane is addition reacted in the presence of a hydrosilylation reaction catalyst with a 1-alkenyl methacrylate or a 1-alkenyl acrylate or a 1-alkenyloxypolyalkylene glycol methacrylate or a 1-alkenyloxypolyalkylene glycol acrylate.

Abstract: To provide a release modifier which provides a heavy release force to a cured release layer of silicone coating composition. The release modifier comprises an organopolysiloxane resin-organopolysiloxane condensation reaction product that is obtained by the condensation reaction of (a1) 100 weight parts of MQ-type organopolysiloxane resin in which the molar ratio of the M unit to the Q unit is 0.6 to 1.0 and the content of the hydroxyl group or alkoxy group is 0.3 to 2.0 weight % with (a2) 20 to 150 weight parts of chain-form diorganopolysiloxane that has an average degree of polymerization of 100 to 1000 and at least one hydroxyl group or alkoxy group; this organopolysiloxane resin-organopolysiloxane condensation reaction product preferably has a prescribed hydroxyl group content.

Abstract: A lubricating grease composition comprising (A) a base oil, (B) 5 to 10 wt. % of a urea compound, (C) 0.5 to 20 wt. % of at least one phosphorous compound selected from the group consisting of a phosphoric acid salt etc., and (D) 0.5 to 40 wt. % of a fatty acid metal salt. Aforementioned lubricating grease composition allows it to reduce the friction coefficient and prolong the endurance life significantly when it is applied onto surfaces of the sliding pair consisting of metal and plastic (especially glass-fiber-reinforced plastic) parts.

Abstract: A silicone composition comprises (a) a curable silicone resin, (b) an inorganic particle having a polymeric surface coating formed thereon, and (c) a cross-linking compound. The (a) curable silicone resin comprises units having a functional group R1 selected from an aryl group, an alkyl group, an alkenyl group, and hydrogen. The polymeric surface coating comprises an organopolysiloxane. The organopolysiloxane comprises units selected from R23SiO1/2, R22SiO2/2, R2SiO3/2, and combinations thereof. R2 is selected from an aryl group, an alkyl group, an alkenyl group, hydrogen, and combinations thereof, and R1 equals R2. The (c) cross-linking compound is reactive with at least one of (a) and the polymeric surface coating.

Abstract: A method of manufacturing a semiconductor device sealed in a cured silicone body by placing an unsealed semiconductor device into a mold and subjecting a curable silicone composition which is fed into the space between the mold and the unsealed semiconductor device to compression molding, the method being characterized by the fact that the aforementioned curable silicone composition comprises at least the following components: (A) an epoxy-containing silicone and (B) a curing agent for an epoxy resin; can reduce warping of the semiconductor chips and circuit board, and improve surface resistance to scratching.

Abstract: A thermally conductive silicone grease composition comprising at least the following components: an organopolysiloxane (A) represented by the following general formula: [wherein R1 designates identical or different univalent hydrocarbon groups; X designates identical or different univalent hydrocarbon groups or alkoxysilyl-containing groups of the following general formula: —R2—SiR1a(OR3)(3-a) (wherein R1 designates the previously mentioned groups; R2 designates oxygen atoms or alkylene groups; R3 designates alkyl groups; and ‘a’ is an integer ranging from 0 to 2); and ‘m’ and ‘n’ are integers equal to or greater than 0, respectively]; a thermally conductive filler (B); and an organopolysiloxane (C) having silicon-bonded hydrogen atoms on both molecular terminals and in the molecular chains; is characterized by excellent resistance to heat and reduced oil bleeding.

Abstract: A curable silicone composition comprising: an alkenyl-containing organopolysiloxane (A) that contains: a dialkylpolysiloxane (A-1) having on average at least 2 alkenyl groups in one molecule having a 25° C. viscosity in the range of 5,000 to 35,000 mPa·s, and a alkenyl-containing organopolysiloxane resin (A-2) consisting of SiO4/2 units, R12R2SiO1/2 units, and R13SiO1/2 units (where R1 designates alkyl groups with 1 to 10 carbon atoms, and R2 designates alkenyl groups) with the content of alkenyl groups ranging from 3.5 to 5.0 mass %, and with the ratio of the sum of the mole numbers of the R12R2SiO1/2 units and R13SiO1/2 units to 1 mole of the SiO4/2 units in the range from 0.5 to 1.4; an organopolysiloxane (B), wherein silicon-bonded hydrogen atoms are in an amount of at least 0.7 mass %; and a hydrosilylation catalyst (C). The composition is capable of forming a flex-resistant highly transparent cured silicone product with non-tacky surface.

Abstract: A silicon-containing polymer represented by the following average unit formula: (O2/2SiR1-R2-C6H4-R2-SiR1O2/2)x [R3 SiO(4-a)/2]y(R4O1/2)z (wherein R1 designates identical or different, substituted or unsubstituted monovalent hydrocarbon groups; R2 designates identical or different, substituted or unsubstituted alkylene groups; R3 designates substituted or unsubstituted monovalent hydrocarbon groups; R4 designates alkyl groups or hydrogen atoms; ‘a’ is a positive number that satisfies the following condition: 0=a=3; and ‘x’, ‘y’, and ‘z’ are positive numbers that satisfy the following conditions: 0<x<0.1; 0<y<1; 0=z<0.1; and (x+y+z)=1); and a curable polymer composition comprising: (A) the aforementioned silicon-containing polymer; (B) an organosilicon compound that contains in one molecule at least two silicon-bonded hydrogen atoms; and (C) a hydrosilylation catalyst.

Abstract: The present invention relates to a process for producing a molded silicone rubber sponge by filling a sponge-forming silicone rubber composition into a cavity of a mold, wherein after the aforementioned sponge-forming silicone rubber composition is cured, and before mold opening of the aforementioned mold, gas present in the aforementioned cavity is discharged. Thereby, a molded silicone rubber sponge without damage such as chips or the like can be effectively produced.

Abstract: A bis[tri(hydroxypolyalkyleneoxy)silylalkyl] polysulfide, i.e., a polysulfide that contains bonded hydroxypolyalkyleneoxy groups instead of alkoxy groups in the bis(trialkoxysilylalkyl) polysulfide; a method of manufacturing of the aforementioned polysulfide by heating a bis(trialkoxysilylalkyl) polysulfide and a polyalkyleneglycol; a tire rubber additive to a tire rubber composition that comprises a bis[tri(hydroxypolyalkyleneoxy)silylalkyl] polysulfide alone or a mixture of bis[tri(hydroxypolyalkyleneoxy)silylalkyl] polysulfide and a polyalkyleneglycol; and a tire rubber composition that contains the aforementioned additive.

Abstract: A thermally conductive silicone composition of the invention comprises: (A) an organopolysiloxane having a viscosity of at least 500 mPa·s at 25° C.; (B) a thermally conductive filler; (C) a fine silica powder; (D) an organopolysiloxane having a hydrolyzable group and having a viscosity of less than 500 mPa·s at 25° C.; and (E) a silane compound containing a hydrolyzable group. The composition possesses excellent handleability and workability at low viscosity and which, after application onto surfaces, is not subject to slipping-off when this surface assumes a vertically position, even under harsh temperature conditions.

Abstract: The present invention relates to a compound represented by the following general formula (I): wherein R1 and R2 independently represent a monovalent hydrocarbon group; R3 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms; X represents a divalent hydrocarbon group; and R4, R5 and R6 independently represent a monovalent organic group or a group represented by the following general formula (II): in which R7 and R8 independently represent a monovalent hydrocarbon group; and R9 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, with the proviso that R5 and R6 may combine together to form a divalent hydrocarbon group. The aforementioned compounds are useful as a polymerization inhibitor and the like.

Abstract: Silicone-based pressure-sensitive adhesive composition comprising 100 parts (A) a branched organopolysiloxane having on molecular terminals at least two alkenyl groups and represented by (R3SiO1/2)4-p(R1R2SiO1/2)p(R2SiO)m(RR1SiO)n(SiO4/2), to 400 parts (B) an organopolysiloxane composed of R3R22SiO1/2 units and SiO4/2 units, (C) an organohydrogenpolysiloxane, and a catalytic quantity of (D) a platinum-type catalyst. Pressure-sensitive adhesive tape or sheet having an adhesive layer in the form of a cured layer of the aforementioned composition.

Abstract: A curable silicone composition comprising: (A) a liquid organopolysiloxane having in one molecule at least two epoxy groups; (B) a compound containing groups that react with the epoxy groups; (C) a thermally conductive filler; and (D) a silicone powder, preferably, an epoxy-containing silicone powder; possesses excellent handleability and workability in combination with low viscosity and that, when cured, forms a cured body of excellent elasticity, adhesiveness, and thermal conductivity.

Abstract: To provide a highly storage-stable nonionic oil-in-water organosiloxane emulsion composition that substantially does not contain ionic surfactant and that on a long-term basis does not undergo separation of the emulsion composition. An oil-in-water organosiloxane emulsion composition that characteristically comprises (A) 100 weight parts of organosiloxane, (B) 0.5 to 35 weight parts of organic-modified organosiloxane, (C) 0.5 to 35 weight parts of nonionic surfactant, (D) 0.5 to 15 weight parts of water-soluble solvent, and (E) water, wherein the content of (F) ionic surfactant in the composition is less than 0.1 weight part per 100 weight parts component (A).

Abstract: A process for producing silicon-containing particles having an extremely small particle diameter by a simple process without using surface-active agents or the like. The process is characterized by forming silicon-containing particles as a result of phase separation from an organic polymer, wherein the phase separation is achieved by an addition reaction, condensation reaction, ring-opening reaction, or a radical reaction of a curable silicon-containing compound or a curable composition that contains said compound, and the silicon-containing compound or the composition is maintained in a uniform liquid, fused, or dissolved phase with the organic polymer that is free of silicon and does not participate in the curing reaction of the silicon-containing compound or the composition.

Abstract: A silicone rubber molding, which contains 1-50 wt % of a thermoplastic resin powder and whose silicone rubber surface possesses thermoplasticity and irregularities, and a method for manufacturing a silicone rubber molding, wherein an embossing die having surface irregularities is pressed into the surface of silicone rubber containing 1-50 wt % of a thermoplastic resin powder at a temperature that is not less than the softening point of said thermoplastic resin powder so as to transfer the irregularities of the embossing die thereto.

Abstract: The present invention relates to an amino acid-modified organopolysiloxane emulsion obtainable by reacting (a) a carboxy-unprotected amino acid, and (b) organopolysiloxane having an epoxy group in the molecule in an aqueous medium in the presence of a surfactant, is incorporated in a cosmetic product. The present invention also relates to the simple and highly efficient production of emulsions of amino acid-modified polysiloxane, as well as the use of the emulsions as beautifying components.

Abstract: This invention relates to a method for manufacturing silicon-containing particles characterized by preparing a uniform phase comprising a curable composition that includes a silicon-containing compound having in one molecule one or more reactive functional groups per 50 silicon atoms and an oil that does not participate in curing of the composition, then curing the composition, and causing phase separation from the oil for obtaining the silicon-containing particles; and to silicon-containing particles obtained by the above method. The method provides silicon-containing particles of an extremely small diameter in a simple process without the use of surfactants. And the silicon-containing particles possess excellent dispersibility in oil and a high degree of ceramification by baking.