Abstract: A coating agent composition of the present invention consists of: (A) an acrylic-type copolymer that has a weight-average molecular weight within the range of 3,000 to 100,000 and contains in its side molecular chains hydrolysable silyl groups of the following formula: —COO-Q-SiR2n(OR3)3-n and organosiloxysilyl groups of the following formula: —COO-Q-Si(OSiR43)3; and (B) a condensation-reaction accelerating catalyst. Prior to curing, the composition demonstrates excellent storage stability and coating properties, while after curing the composition produces a coating film of high hardness that has excellent water-repellent properties and durability.

Abstract: A curable organopolysiloxane composition comprising: (A) an organopolysiloxane (a1) that contains in one molecule at least one silicon-bonded alkoxysilyl-containing group and an average of at least 0.5 alkenyl groups; or a mixture of said organopolysiloxane (a1) with an organopolysiloxane (a2) that contains in one molecule at least two alkenyl groups and that is free of the alkoxysilyl-containing groups; (B) an organopolysiloxane that contains in one molecule at least two silicon-bonded hydrogen atoms; (C) an organosilicon compound that contains in one molecule at least one silicon-bonded alkoxy group and that is free of the alkoxysilyl-containing groups; and (D) a hydrosilylation-reaction catalyst, has good adhesion to unclean aluminum die castings, PPS resins, etc., even when cured by heating at relatively low temperatures such as 100° C.

Abstract: A curable silicone composition includes: (A) an organopolysiloxane represented by the siloxane unit formula (1) given below and having at least two univalent organic groups that contain epoxy groups and are free of aromatic rings: [R13SiO1/2]a[R22SiO2/2]b[R3SiO3/2]c (where R1, R2, and R3 are univalent organic groups, at least two of which are univalent organic groups which contain epoxy groups and are free of aromatic rings; more than 20 mole % of R3 are aryl groups; a+b+c equals 1; on average, “a” satisfies the following condition: 0?a?0.8; on average, “b” satisfies the following condition: 0.2?b?0.8; and, on average, “c” satisfies the following condition: 0.2<c<1.0); (B) a linear-chain organopolysiloxane having at least two univalent organic groups that contain phenolic hydroxyl groups; and (C) a curing accelerator.

Abstract: The present invention relates to an active energy ray-curable organopolysiloxane resin composition that comprises an organopolysiloxane resin having an epoxy group and an aromatic hydrocarbon group and a photopolymerization initiator, as well as to a light-transmitting component that comprises cured bodies produced by irradiating the aforementioned organopolysiloxane resin with active-energy rays in the presence of the aforementioned photopolymerization initiator, and to a method for manufacturing the aforementioned light-transmitting component.

Abstract: A silver-based powder is surface-treated with an oxidation inhibitor by means of a mechanochemical reaction. A method of preparation of the silver-based powder includes using an organic solution of the oxidation inhibitor as a lubricating agent, applying mechanical energy to the silver-based powder, and subjecting the silver-based powder to surface treatment with said oxidation inhibitor by means of a mechanochemical reaction.

Abstract: A silver-based powder is surface-treated with an oxidation inhibitor by means of a mechanochemical reaction. A method of preparation of the silver-based powder includes using an organic solution of the oxidation inhibitor as a lubricating agent, applying mechanical energy to the silver-based powder, and subjecting the silver-based powder to surface treatment with said oxidation inhibitor by means of a mechanochemical reaction.

Abstract: A silicone rubber emulsion composition comprising (A) 100 parts diorganopolysiloxane having at least two silicon-bonded alkenyl groups, (E) 0 to 60 parts reinforcing silica filler, (B) 10 to 250 parts water containing a smectite clay, (C) 0.1 to 15 parts emulsifier, and (D) a cross-linking agent (e.g., an organohydrogenpolysiloxane) in an amount sufficient for cross-linking component (A) and a catalyst (e.g., a platinum-type catalyst). A method for preparing the aforementioned emulsion composition comprising mixing components (A) and (E) with other components in a high-speed stirrer-equipped mixer. A method of manufacturing a silicone rubber comprising either heating and dehydrating the aforementioned emulsion composition.

Abstract: A method of manufacturing a silicone rubber comprises a first stage and a second stage. The first stage comprises (1-1) the step of preparing an aqueous dispersion composed of water that contains a water-soluble polymer (E), a finely powdered silica filler (B), a conductive filler (C), and a non-conductive inorganic filler (D) and (1-2) the step of preparing an aqueous emulsion by stirring and mixing the obtained aqueous dispersion with the following components: an organopolysiloxane (A) that contains silicon-bonded alkenyl groups, an emulsification agent (F), and a curing agent (G). The second stage obtains the silicon rubber either (2-1) by curing the aqueous emulsion prepared in the aforementioned first stage, forming a wet silicone-rubber like cured body, and then removing water from the aforementioned wet silicone-rubber like cured body; or (2-2) by dehydrating and curing the aqueous emulsion prepared in the aforementioned first stage.

Abstract: A stabilizing agent for a hydroalkoxysilane such as triethoxysilane and trimethoxysilane characterized by comprising a carboxylate such as an alkali metal salt or an alkali earth metal salt of a carboxylic acid having 1 to 18 carbon atoms; a method for stabilizing a hydroalkoxysilane by combining it with a carboxylate; and a hydroalkoxysilane stabilized with a carboxylate.

Abstract: A method of manufacturing an optical semiconductor device (16) sealed in a transparent or semitransparent cured silicone body (50) by placing an unsealed optical semiconductor device (16) into a mold (23, 34) and subjecting a transparent or semitransparent curable silicone composition (50) that fills the spaces between the mold and the unsealed device (70) to compression molding; provides the sealed optical semiconductor device that is free of voids, allows control of the coating layer thickness, protects the bonding wires from breakage and accidental contact, reduces concentration of stress on an optical semiconductor element, has long service life with reducing discoloration and disconnection of the sealing resin from the optical semiconductor element (16), and has excellent reliability.

Abstract: A method of manufacturing a semiconductor device sealed in a cured silicone body by placing a semiconductor device into a mold and subjecting a curable silicone composition that fills the spaces between said mold and said semiconductor device to compression molding, wherein the curable silicone composition comprises the following components: (A) an organopolysiloxane having at least two alkenyl groups per molecule; (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule; (C) a platinum-type catalyst; and (D) a filler, wherein either at least one of components (A) and (B) contains a T-unit siloxane and/or Q-unit siloxane. By the utilization this method, a sealed semiconductor device is free of voids in the sealing material, and a thickness of the cured silicone body can be controlled.

Abstract: Addition-curable organopolysiloxane resin composition comprising an organopolysiloxane resin that contains at least alkenyl, hydroxyl, and phenyl directly bonded to silicon of which at least 30 mole % is phenyl; an organohydrogenoligosiloxane or organohydrogenpolysiloxane that contains at least phenyl directly bonded to silicon of which at least 20 mole % is phenyl; and an addition reaction-curing catalyst.

Abstract: A composite silicone rubber powder comprising: (A) a silicone rubber powder having an average particle size within the range of 0.1 to 500 ?m and hardness of at least 15 by type A durometer according to JIS K 6253, wherein the surface of said silicone rubber powder is coated with (B) a microfine inorganic powder having the BET specific surface area of at least 10 m2/g, said composite silicone rubber powder being characterized by the fact that the surface thereof is treated with (C) an organic silicon compound having a silicon-bonded hydrolyzable group, or with a product of partial hydrolysis of said compound, is characterized by excellent dispersibility in coating and cosmetic materials and having the possibility of improving matting properties of coating materials, and feel of use of cosmetic materials.

Abstract: An addition-curable organopolysiloxane resin composition having, in a state of cued body, a hardness of 60 to 100 at 25 degree C. and 40 to 100 at 150 degree C. as measured in accordance with the provisions of ASTM D2240-86, said composition comprising: (A) 100 parts by weight of an organopolysiloxane resin comprised of at least alkenyl groups and phenyl groups; (B) 10 to 50 parts by weight of an organooligosiloxane comprised of at least alkeyl groups and phenyl groups; (C) 20 to 100 parts by weight of an organohydrogenoligosiloxane of organohydrogenpolysiloxane; and (D) an addition-reaction catalyst in a catalytic quantity; an optical material that is comprised of a cured body produced from aforementioned components (A), (B), and (C) and possesses the aforementioned characteristics.

Abstract: A silicone rubber emulsion composition comprising (A) 100 parts diorganopolysiloxane having at least two silicon-bonded alkenyl groups, (E) 0 to 60 parts reinforcing silica filler, (B) 10 to 250 parts water containing a smectite clay, (C) 0.1 to 15 parts emulsifier, and (D) a cross-linking agent (e.g., an organohydrogenpolysiloxane) in an amount sufficient for cross-linking component (A) and a catalyst (e.g., a platinum-type catalyst). A method for preparing the aforementioned emulsion composition comprising mixing components (A) and (E) with other components in a high-speed stirrer-equipped mixer. A method of manufacturing a silicone rubber comprising either heating and dehydrating the aforementioned emulsion composition.

Abstract: An organopolysiloxane represented by the following general formula (1), where R1 represents an aliphatic, unsaturated univalent hydrocarbon group, R2 represents identical or different univalent hydrocarbon groups except for aliphatic unsaturated bonds, R3 represents an oxygen atom or a bivalent hydrocarbon group, R4 represents a univalent hydrocarbon group that contains an acryloxy or methacryloxy group, R5 may represent an alkyl group, alkoxyalkyl group, alkenyl group, or an acyl group; “n” is an integer from 5 to 1000, and “a” is 1 or 2, can be used for the preparation of a silicone composition as a main component of a composition or as a surface-treating agent for thermally conductive fillers, can be combined with large amounts of thermally conductive fillers, is easy to handle, and imparts to the composition appropriate thixotropy.

Abstract: A multi-component room-temperature-curable silicone rubber composition comprising at least: (A) a diorganopolysiloxane, (B) a methoxy group-containing silicon compound comprising a bis(methoxysilyl)alkane or a organotrimethoxysilane (except amino group containing organotrimethoxysilane) (B-1), a methoxy group-containing carbasilatrane derivative (B-2), and an aminoalkylmethoxysilane (B-3) (wherein the weight ratio of constituent (B-2) to constituent (B-3) is in the range of (20:80) to (80:20)); and (C) a curing catalyst, the composition being packaged as two or more separately stored compositions wherein none of said separately stored compositions contain all said components (A), (B), and (C) simultaneously.

Abstract: A thermoconductive silicone elastomer comprising a silicone elastomer being a cured body of a hydrosilation-curable organopolysiloxane composition, a reinforcement fine silica powder, a thermoconductive inorganic powder, and an alkylphenylpolysiloxane that is liquid at room temperature. A hydrosilation-curable thermoconductive silicone elastomer composition comprising: a hydrosilation-curable organopolysiloxane composition, a reinforcement fine silica powder, a thermoconductive inorganic powder, and an alkylphenylpolysiloxane that is liquid at room temperature. A thermoconductive medium comprising the aforementioned thermoconductive silicone elastomer.

Abstract: Adhesive silicone elastomer sheet afforded by the cure of a hydrosilylation-curing silicone elastomer composition comprising: (A) an organopolysiloxane that contains at least one diorganosiloxane unit and that has at least two silicon-bonded alkenyl groups in each molecule, (B) an organopolysiloxane resin with the average unit formula: (R13SiO1/2)x(SiO4/2)1.0 in which R1 is substituted or unsubstituted monovalent hydrocarbon group and x is a number from 0.5 to 1.0, (C) an organopolysiloxane that contains at least two silicon-bonded hydrogen atoms in each molecule, and (D) a hydrosilylation catalyst. The adhesive silicone elastomer sheet is transparent, and whose surface exhibits a stable and permanent adhesiveness.

Abstract: A heat conductive silicone composition contains (A) a silicone oil as the primary ingredient and (B) a heat conductive filler. Component (A) has silicon-bonded alkoxy, alkoxyalkoxy, alkenoxy, or acyloxy groups in the molecule. Component (B) is surface treated with component (A).