Abstract: A cutting tool includes a blade formed so as to extend in the width direction or length direction of a workpiece; at least one cutting tip formed so as to protrude from the lower portion of the blade so as to cut the workpiece by reciprocating by means of a swinging motion; and a brazing part formed between the blade and the at least one cutting tip so as to silver-braze the blade and the at least one cutting tip. The brazing part includes a first silver solder layer; a metal sheet layer formed on the first silver solder layer and having a melting point that is higher than a silver brazing process temperature; and a second silver solder layer formed on the metal sheet layer.

Abstract: This invention relates to a conditioner for a chemical mechanical planarization pad, which is necessary for global planarization of a wafer in order to increase the degree of integration of a semiconductor device, and more particularly to a pad conditioner having a structure able to reduce friction with a pad so as to solve the problems caused by a lot of friction being generated upon conditioning, and to a method of manufacturing the same.

Abstract: A chemical mechanical polishing method includes providing a pad conditioner, such that the pad conditioner includes a base and a plurality of tips protruding from a surface of the base, adjusting a surface roughness of an upper surface of each tip of the plurality of tips, and adjusting a polishing rate of chemical mechanical polishing using the adjusted surface roughness of the upper surfaces of the plurality of tips.

Abstract: A stone cutting device configured to cut a workpiece with a plurality of cutting tools by swinging the cutting tools within a predetermined angle range. Each of the cutting tools includes: a blade extending in a length direction of the workpiece; and at least one cutting tip disposed on an end of the blade and protruding from the blade in a width direction of the blade so as to cut the workpiece while being reciprocated in a swinging motion. The stone cutting device includes a frame unit configured to combine and reciprocate the cutting tools and individually adjust tension in each of the cutting tools. The frame unit includes an actuator applying tension to the cutting tools so as to apply a load of 8 tons to 27 tons to each of the cutting tools.

Abstract: A cutting tool and a cutting apparatus including a cutting tool. The cutting tool includes: a blade extending and reciprocating in a length direction of a workpiece for cutting the workpiece; at least one cutting tip provided on an end of the blade and protruding in a width direction of the blade for cutting the workpiece while contacting the workpiece; and an auxiliary cutting structure provided on at least one side of the blade and corresponding to a width of the cutting tip to prevent the blade from wobbling in a slot formed by the cutting tip. The cutting apparatus includes: a frame unit disposed at both sides of a workpiece in a cutting direction of the workpiece; and the cutting tool, the cutting tool configured to cut the workpiece while being reciprocated by power transmitted from a driving unit disposed on a side of the frame unit.

Abstract: This invention relates to a conditioner for a chemical mechanical planarization pad, which is necessary for global planarization of a wafer in order to increase the degree of integration of a semiconductor device, and more particularly to a pad conditioner having a structure able to reduce friction with a pad so as to solve the problems caused by a lot of friction being generated upon conditioning, and to a method of manufacturing the same.

Abstract: A diamond blade having rim type cutting tip for use in apparatus such as cutting saw machine having a structure which rim type cutting tip is able to produce cutting chips with relative large size during cutting operation so that those chips are easily discharged outside with reducing the friction with cutting tip of blade, thereby to increase cutting ability and to prevent the chips dispersing in the air and giving rise to the bad effects to user's health and the contamination of environment. The diamond blade according to the present invention comprises a wheel body connected with a shaft of electric motor, and rim type cutting tip for cutting or grinding crushable materials disposed on the circumference of the wheel body and composed of at least two diamond layers longitudinally disposed parallel with the rotation direction of the blade in which diamond particles are included, and non-diamond portion disposed between the diamond layers in which diamond particles are not included.

Abstract: The invention relates to a diamond saw blade which is made by attaching improved undercut preventing tips, produced by diffusing and joining cobalt-based powder onto ultra hard tips at a high temperature, to respective shank slot walls formed on the circumference of a diamond saw blade by means of laser welding in order to remove drawbacks of high cost or insecurity with the conventional art.

Abstract: A diamond tool having segment type cutting tip for cutting, grinding or drilling workpieces. The diamond tool comprising a plurality of segment type cutting tips circumferentially fixed on the wheel of the diamond tool, each of which has at least two diamond layers longitudinally disposed parallel with the rotation direction of the diamond tool, and capable of effectively cutting, grinding or drilling workpieces as forming at least two microscopic linear cutting groves in the workpieces when cutting operation.

Abstract: The present invention relates to an improvement of the conventional sandwiched type saw blade shank by providing, as the intermediate layer, a coated thin sheet with tens of electro-conductive points or a thin sheet with multiple contacts to enhance weldability and to minimize the thermal deform or pressed marks, so that sound absorption, noise reduction and also heat dissipation may be maximized during a high speed cutting operation.

Abstract: The present invention relates to a core drill wherein initial drilling workability is improved through reduced frictional resistance on the segment tips, when they are seated on the surface of an article to start cutting operation, and wherein cutting scraps or sludge produced by the segment tips are smoothly discharged through the helical grooves formed on the core body so as to reduce the friction between the core body and the cutting scraps or sludge, whereby both the cooling and cutting performance of the core drill are improved. The invention proposes a core drill with a cylindrical core body with a predetermined diameter and length and with plural cutting segments provided on the lower part of a core body at a finite interval, wherein the cutting thickness surface of the cutting segment consists of inclined sharp thickness portion for decreased frictional resistance with an article to be processed.

Abstract: The present invention is intended to provide a grinding wheel which is prevented from the one-sided wear or the wear taking place intensively at the outer side of the segments due to working load so as to improve the processed quality of the ground surface. Thus the invention proposes a grinding wheel comprising a plurality of segments attached to the underside of a rim part of a grinding wheel, a rim part for supporting the segments, rib parts for connecting the rim part with a disk part, and a disk part with a central hole for connection to a motor-operated tool, wherein the segments are each demarcated into the inner portion and outer portion around the demarcating interface and the outer portions are so treated as to constitute a higher wear resisting region than the inner portions by controlling the particle size and/or the content of the super abrasive and/or by controlling the hardness of the metal bonding material for binding the abrasive particles together, in order to prevent one-sided wear.

Abstract: An adhesive sheet for noise and shock absorption and a saw blade making use of it and manufacturing methods therefor for use in joining components of a cutting or grinding apparatus to generate vibrations and noises such as a cutting saw machine for a grinding or cutting material such as brick, concrete, granite, marble, etc. The adhesive sheet according to the present invention is composed of a resin adhesive such as denaturalized epoxy resin, phenol resin, rubber, or compound composition thereof etc., and a noise and shock absorption material infiltrated with the resin adhesive, and fabricated by infiltrating the noise and shock absorption material such as non-woven fabric, paper, or textiles with the resin adhesive such as denaturalized epoxy resin, phenol resin, rubber, or compound composition thereof etc., and drying the infiltrated noise and shock absorption material at a predetermined temperature for several minutes and hardening it by half.

Abstract: The present invention relates to an abrasive dressing tool used for mechanical and chemical planarization abrasion of the surface of the work pieces as can be used for semiconductor wafers or the like which require precise, planar and micro polishing, and a method for manufacturing the same dressing tool. Specifically, ultimately macro- and micro-scratches on wafers can be drastically reduced, the rate of inferior finished products or wafers can be decreased and abrasive life time of the tool can be prolonged, by sintering and brazing abrasive particles with a nickel based brazing metal on the abrasive tool, and then filling or covering the non-sintered parts and re-crystallized parts of sintered and brazed layers, apt to crack or fall-out from the surface, through electroplating process.