Patents Assigned to EHWA Diamond Ind., Co., Ltd.
  • Patent number: 6299522
    Abstract: A grinding wheel having dust discharge-impelling blades which are able to impel to discharge the dust produced during the grinding operation to a dust collection machine to decrease dispersing dust in the air, and increase the cooling efficiency of the grinding wheel to enhance the grinding ability and the life of the grinding wheel. The grinding wheel of the present invention comprises a shank for connecting with a shaft of electric motor, having a plurality of dust discharging holes disposed at given intervals in the shank and a plurality of dust discharge-impelling blades disposed between the dust discharging holes for impelling to discharge dust produced during the grinding operation through and in cooperation with dust discharging holes, and a plurality of grinding tips disposed fixedly at predetermined intervals on the lower surface of the circumferential portion of the shank by means of welding or joining.
    Type: Grant
    Filed: December 14, 1999
    Date of Patent: October 9, 2001
    Assignee: EHWA Diamond Ind. Co. Ltd
    Inventor: Chang Hyun Lee
  • Patent number: 5782682
    Abstract: A grinding wheel with tips which can be uniformly abraded regardless of the position of the tips is disclosed. In the wheel, the inside and outside tips may be formed by bonding diamond dust of the same concentration with resinoid or metal bonds of lower and higher abrasion resistances, respectively. Alternatively, the inside and outside tips may be formed using the same resinoid or metal bond. In this case, the outside tips are laden with diamond dust, while the inside tips are laden with no diamond dust or cheap abrasive. As a further alternative, the concentration of the diamond dust of the tips may be stepwisely reduced from the outside toward the inside. In addition, the top surface of each tip may be inclined downward from the outside toward the inside to compensate for the eccentric abrasion of the tips due to the circumferential speed difference between the inside and outside tips.
    Type: Grant
    Filed: June 4, 1996
    Date of Patent: July 21, 1998
    Assignee: EHWA Diamond Ind. Co. Ltd.
    Inventors: Jung Su Han, So Young Yun
  • Patent number: 5392759
    Abstract: Diamond cutting tools such as a diamond core drill and a disk-shaped diamond saw which are used to grind and cut hard articles in order to bore or cut hard articles. The diamond cutting tools comprise a tool body and a diamond blade portion attached to an outer end of the tool body. The diamond blade portion has a plurality of outer cuts formed at an outer end thereof and a plurality of inner slots formed under and between the outer cuts and higher than the bottoms of outer cuts by a certain depth. The diamond cutting tools can carry out effectively boring or cutting work until the expensive diamond blade portion is completely worn away.
    Type: Grant
    Filed: December 6, 1993
    Date of Patent: February 28, 1995
    Assignee: EHWA Diamond Ind. Co. Ltd.
    Inventor: Kim S. Kwang
  • Patent number: 5316416
    Abstract: Diamond cutting tools such as a diamond core drill and a disk-shaped diamond saw which are used to grind and cut hard articles in order to bore or cut hard articles. The diamond cutting tools comprise a tool body and a diamond blade portion attached to an outer end of the tool body. The diamond blade portion has a plurality of outer cuts formed at an outer end thereof and a plurality of inner slots formed under and between the outer cuts and higher than the bottoms of outer cuts by a certain depth. The diamond cutting tools can carry out effectively boring or cutting work until the expensive diamond blade portion is completely worn away.
    Type: Grant
    Filed: September 29, 1992
    Date of Patent: May 31, 1994
    Assignee: EHWA Diamond Ind. Co., Ltd.
    Inventor: Soo K. Kim
  • Patent number: 5216999
    Abstract: A wire saw comprising a wire rope 120, a plurality of abrasive sleeves 110 each including a cylindrical mount 112 and an abrasive metal layer 114, an elastic material layer 130 of resin surrounding the wire rope 120 between the abrasive sleeves 110 and between each of the abrasive sleeves 110 and the wire rope 120, and a clamping pipe 140 for making the wire saw be endless to form a loop. The abrasive sleeves 110 surround the wire rope and are spaced at predetermined intervals longitudinally of the wire rope. The cylindrical mount 112 includes a pair of annular grooves formed on outer opposite ends thereof and a pair of through-holes diagonally formed thereon. The elastic material layer 130 includes a plurality of annular grooves 132 spaced at predetermined intervals and formed by means of a shape of a mold 200, thereby providing a straightness for the wire rope regardless of an injection pressure of resin injected into the mold 200.
    Type: Grant
    Filed: January 21, 1992
    Date of Patent: June 8, 1993
    Assignee: EHWA Diamond Ind. Co., Ltd.
    Inventor: Jung S. Han
  • Patent number: D447496
    Type: Grant
    Filed: August 22, 2000
    Date of Patent: September 4, 2001
    Assignee: EHWA Diamond Ind. Co. Ltd.
    Inventors: Chang Hyun Lee, Jong Moo Kang
  • Patent number: D456425
    Type: Grant
    Filed: May 18, 2001
    Date of Patent: April 30, 2002
    Assignee: Ehwa Diamond Ind. Co., Ltd.
    Inventor: See Hyung Kim
  • Patent number: D458619
    Type: Grant
    Filed: May 18, 2001
    Date of Patent: June 11, 2002
    Assignee: EHWA Diamond Ind. Co., Ltd.
    Inventors: Chang Hyun Lee, Youn Chul Kim
  • Patent number: D342270
    Type: Grant
    Filed: September 29, 1992
    Date of Patent: December 14, 1993
    Assignee: EHWA Diamond Ind. Co., Ltd.
    Inventor: Kim S. Kwang