Abstract: Fork-like connector terminals are moved along the pass line under guidance so that the forked end part thereof won't pass astray from the predetermined passageway. A plating brush, which has been positioned in alignment with the predetermined passageway of the end part of said fork-like connector terminal, is moved into the gap between the opposing portions to be plated at the end of each terminal or passed through said gap in such a way that said brush contacts only the small-area portions to be plated and applies thereto the plating solution supplied to said brush by the liquid retaining material to thereby perform desired plating.

Abstract: A plating apparatus for automatic plating of objects to be plated such as IC lead frames in a plural number in considerably high speed as a whole process line in which plural number of aligned object to be plated in the form of strips is conveyed laterally at a time on the conveyed line which is formed with aligning rollers group and the feed rollers group, while conveying, the objects to be plated are carried out pre-treatment and after-treatment, between both of treatments, the plating treatment is carried out by injection of plating liquid to the objects to be plated, and as loading a vacuum apparatus moving with arc-shaped track is employed for transferring plural objects to be plated in one on a conveyor line.

Abstract: An apparatus for dipping plating objects such as IC lead frame of a rectangular shape obtained by press forming and etching thin metal pieces, wherein a plural number of said rectangular sheets aligned and supported on the freely descending and returning rack base of the support carriage of the objects to be plated are concurrently subjected to dipping plating by determining the position of the said plural number of rectangular sheets to be plated for lowering into the plating tanks, and abutting the upper surface of the objects to be plated with the holding means thereby subjecting a plural number of objects to be plated.

Abstract: In an automatic apparatus for plating, the plating assembly line is incorporated into a circuit assuming a rectangle in a plan view, and on said assembly line a plurality of support carriages carrying objects to be plated are successively conveyed to effectively carry out the desired processings of plating in different plating tanks, the objects being a plurality of strips and aligned and carried by said support carriage.

Abstract: An apparatus optimum for partially plating such rectangular objects as an IC lead frame obtained by subjecting thin metal pieces to press working and etching. The apparatus is characterized in that a support carriage aligns and supports the plurality of objects to be plated in advance, positioning means align the objects as regards the plating tank the lead wire as a cathode is contacted at the same time with the upper side of each object to be plated and the whole of the plural number of objects to be plated is masked, thereby performing plating by jetting the plating liquid onto respective portions to be plated.

Abstract: While a rectangular sheet is being passed between a masking packing having at least one opening of a configuration corresponding to the selected area of the sheet to be plated and a pressure packing, a jet of plating solution is continuously directed from a nozzle against the masking packing opening or a jet of plating solution is intermittently directed from a specially designed nozzle against the opening in response to the intermittent movement of the rectangular sheet, thereby selectively plating the rectangular sheet in the lengthwise direction continuously or intermittently.

Abstract: A plating device suitable for performing high speed, gold-, nickel-, rhodium- platings on a rectangular sheet such as a printed circuit board is provided with a mechanical masking means and a plating solution jetting means.

Abstract: A high-speed continuous plating method and apparatus wherein a plating solution is sprayed from an anode and spray nozzle against a plating solution spraying opening formed in an object feeding guide tunnel of the shape corresponding to the cross-sectional shape of objects to be plated while the objects are being continuously passed through the guide tunnel, thus making it possible to plate at high speed only the desired portions of any objects to be plated even if the shape of such objects is very complicated.